Patents by Inventor Jui-Feng Wang

Jui-Feng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9887597
    Abstract: The present invention provides a motor winding assembly including a flexible base plate and a winding assembly. The flexible base plate includes a plurality of supports. A bridge is connected between adjacent two of the plurality of supports. Each of the plurality of supports has a center, and the flexible base plate has a reference line extending through the centers of the plurality of supports. The bridge is not located on the reference line. The winding assembly includes a plurality of winding units. Each of the plurality of supports is provided with at least one winding unit. An electrical path is located on the bridge between the adjacent two of the plurality of supports and electrically connected to the winding units of the adjacent two of the plurality of supports. In this arrangement, the total length of the flexible base plate is reduced.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: February 6, 2018
    Assignee: Sunonwealth Electric Machine Industry Co., Ltd.
    Inventors: Alex Horng, Guan-Ming Chen, Li-Yang Lyu, Chang-Yu Lin, Jui-Feng Wang
  • Publication number: 20160111928
    Abstract: The present invention provides a motor winding assembly including a flexible base plate and a winding assembly. The flexible base plate includes a plurality of supports. A bridge is connected between adjacent two of the plurality of supports. Each of the plurality of supports has a center, and the flexible base plate has a reference line extending through the centers of the plurality of supports. The bridge is not located on the reference line. The winding assembly includes a plurality of winding units. Each of the plurality of supports is provided with at least one winding unit. An electrical path is located on the bridge between the adjacent two of the plurality of supports and electrically connected to the winding units of the adjacent two of the plurality of supports. In this arrangement, the total length of the flexible base plate is reduced.
    Type: Application
    Filed: September 22, 2015
    Publication date: April 21, 2016
    Inventors: Alex Horng, Guan-Ming Chen, Li-Yang Lyu, Chang-Yu Lin, Jui-Feng Wang
  • Patent number: 8279607
    Abstract: A cooling module assembly method includes forming at least one through-hole on a circuit board; coupling the circuit board to a heat dissipating unit so that a face of the circuit board is coupled to a coupling face of the heat dissipating unit; filling the at least one through-hole with metal solders; fixing at least one heat-generating element to another face of the circuit board, with the at least one heat-generating element aligned with and covering the at least one through-hole; and soldering the at least one heat-generating element and the heat dissipating unit together by melting the metal solders in the at least one through-hole.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: October 2, 2012
    Assignee: Sunonwealth Electric Machine Industry Co., Ltd.
    Inventors: Alex Horng, Chi-Hung Kuo, Chih-Hao Chung, Chung-Ken Cheng, Jui-Feng Wang
  • Publication number: 20110292614
    Abstract: A cooling module assembly method comprises forming at least one through-hole on a circuit board; coupling the circuit board to a heat dissipating unit so that a face of the circuit board is coupled to a coupling face of the heat dissipating unit; filling the at least one through-hole with metal solders; fixing at least one heat-generating element to another face of the circuit board, wherein the at least one heat-generating element aligns with and covers the at least one through-hole; and soldering the at least one heat-generating element and the heat dissipating unit together by melting the metal solders in the at least one through-hole.
    Type: Application
    Filed: June 30, 2010
    Publication date: December 1, 2011
    Inventors: Alex Horng, Chi-Hung Kuo, Chih-Hao Chung, Chung-Ken Cheng, Jui-Feng Wang