Patents by Inventor JUI-FU CHANG
JUI-FU CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230006109Abstract: A light emitting device and a manufacturing method thereof are provided. The light emitting device includes a light emitting unit, a fluorescent layer, a reflective layer, and a light-absorbing layer. The light emitting unit has a top surface, a bottom surface opposite to the top surface, and a side surface located between the top surface and the bottom surface. The light emitting unit includes an electrode disposed at the bottom surface. The fluorescent layer is disposed on the top surface of the light emitting unit. The reflective layer covers the side surface of the light emitting unit. The light-absorbing layer covers the reflective layer, so that the reflective layer is located between the side surface of the light emitting unit and the light-absorbing layer.Type: ApplicationFiled: June 24, 2022Publication date: January 5, 2023Applicant: Genesis Photonics Inc.Inventors: Yun-Han Wang, Chin-Hua Hung, Chuan-Yu Liu, Tsai-Chieh Shih, Jui-Fu Chang, Yu-Jung Wu, Yu-Feng Lin
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Publication number: 20210159369Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: ApplicationFiled: February 1, 2021Publication date: May 27, 2021Applicant: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Patent number: 10957674Abstract: A manufacturing method is provided. The manufacturing method includes the following steps. Firstly, a substrate and a light-emitting component are provided, wherein the light-emitting component is disposed on the substrate. Then, a wavelength conversion layer is provided, wherein the wavelength conversion layer includes a high-density phosphor layer and a low-density phosphor layer. Then, the high-density phosphor layer is adhered to the light-emitting component by an adhesive. Then, a reflective layer is formed above the substrate, wherein the reflective layer covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion layer.Type: GrantFiled: December 2, 2019Date of Patent: March 23, 2021Assignee: GENESIS PHOTONICS INCInventors: Cheng-Wei Hung, Jui-Fu Chang, Chin-Hua Hung, Yu-Feng Lin
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Patent number: 10910523Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: GrantFiled: June 11, 2018Date of Patent: February 2, 2021Assignee: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Patent number: 10804444Abstract: A light-emitting device including at least one light-emitting unit, a wavelength conversion adhesive layer, and a reflective protecting element is provided. The light-emitting unit has an upper surface and a lower surface opposite to each other. The light-emitting unit includes two electrode pads, and the two electrode pads are located on the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface. The wavelength conversion adhesive layer includes a low-concentration fluorescent layer and a high-concentration fluorescent layer. The high-concentration fluorescent layer is located between the low-concentration fluorescent layer and the light-emitting unit. The width of the high-concentration fluorescent layer is WH. The width of the low-concentration fluorescent layer is WL. The width of the light-emitting unit is WE. The light-emitting device further satisfies the following inequalities: WE<WL, WH<WL and 0.8<WH/WE?1.2.Type: GrantFiled: October 7, 2019Date of Patent: October 13, 2020Assignee: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Long-Chi Tu, Jui-Fu Chang, Chun-Ming Tseng, Yun-Chu Chen
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Publication number: 20200105725Abstract: A manufacturing method is provided. The manufacturing method includes the following steps. Firstly, a substrate and a light-emitting component are provided, wherein the light-emitting component is disposed on the substrate. Then, a wavelength conversion layer is provided, wherein the wavelength conversion layer includes a high-density phosphor layer and a low-density phosphor layer. Then, the high-density phosphor layer is adhered to the light-emitting component by an adhesive. Then, a reflective layer is formed above the substrate, wherein the reflective layer covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion layer.Type: ApplicationFiled: December 2, 2019Publication date: April 2, 2020Inventors: Cheng-Wei Hung, Jui-Fu Chang, Chin-Hua Hung, Yu-Feng Lin
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Publication number: 20200083419Abstract: A light emitting device including a light emitting unit, two electrodes, a reflective member, and a light transmissive member is provided. The two electrodes are disposed on one side of the light emitting unit, and electrically connected to the light emitting unit. The reflective member is disposed on the other side of the light emitting unit, and has at least one reflective surface. The light transmissive member is disposed between the reflective member and the light emitting unit, and covers a part of the light emitting unit. A lateral surface of the light transmissive member is served as a light emitting surface of the light emitting device. A manufacturing method of a light emitting device is also provided.Type: ApplicationFiled: August 19, 2019Publication date: March 12, 2020Applicant: Genesis Photonics Inc.Inventors: Yun-Han Wang, Chin-Hua Hung, Jui-Fu Chang, Chuan-Yu Liu, Yu-Feng Lin, Cheng-Wei Hung, Jian-Xiang Huang, Po-Hsiang Wang
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Publication number: 20200035875Abstract: A light-emitting device including at least one light-emitting unit, a wavelength conversion adhesive layer, and a reflective protecting element is provided. The light-emitting unit has an upper surface and a lower surface opposite to each other. The light-emitting unit includes two electrode pads, and the two electrode pads are located on the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface. The wavelength conversion adhesive layer includes a low-concentration fluorescent layer and a high-concentration fluorescent layer. The high-concentration fluorescent layer is located between the low-concentration fluorescent layer and the light-emitting unit. The width of the high-concentration fluorescent layer is WH. The width of the low-concentration fluorescent layer is WL. The width of the light-emitting unit is WE. The light-emitting device further satisfies the following inequalities: WE<WL, WH<WL and 0.8<WH/WE?1.2.Type: ApplicationFiled: October 7, 2019Publication date: January 30, 2020Applicant: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Long-Chi Tu, Jui-Fu Chang, Chun-Ming Tseng, Yun-Chu Chen
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Patent number: 10497681Abstract: A light-emitting device includes a substrate, a light-emitting component, a wavelength conversion component, an adhesive and a reflective layer. The light-emitting component is disposed on the substrate. The wavelength conversion component includes a high-density phosphor layer and a lower-density phosphor layer. The adhesive is formed between the light-emitting device and the high-density phosphor layer. The reflective layer is formed above the substrate and covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion component.Type: GrantFiled: March 19, 2018Date of Patent: December 3, 2019Assignee: GENESIS PHOTONICS INC.Inventors: Cheng-Wei Hung, Jui-Fu Chang, Chin-Hua Hung, Yu-Feng Lin
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Patent number: 10439111Abstract: A light-emitting device including at least one light-emitting unit, a wavelength conversion adhesive layer, and a reflective protecting element is provided. The light-emitting unit has an upper surface and a lower surface opposite to each other. The light-emitting unit includes two electrode pads, and the two electrode pads are located on the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface. The wavelength conversion adhesive layer includes a low-concentration fluorescent layer and a high-concentration fluorescent layer. The high-concentration fluorescent layer is located between the low-concentration fluorescent layer and the light-emitting unit. The width of the high-concentration fluorescent layer is WH. The width of the low-concentration fluorescent layer is WL. The width of the light-emitting unit is WE. The light-emitting device further satisfies the following inequalities: WE<WL, WH<WL and 0.8<WH/WE?1.2.Type: GrantFiled: October 19, 2017Date of Patent: October 8, 2019Assignee: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Long-Chi Tu, Jui-Fu Chang, Chun-Ming Tseng, Yun-Chu Chen
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Publication number: 20180294388Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: ApplicationFiled: June 11, 2018Publication date: October 11, 2018Applicant: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Publication number: 20180211942Abstract: A light-emitting device includes a substrate, a light-emitting component, a wavelength conversion component, an adhesive and a reflective layer. The light-emitting component is disposed on the substrate. The wavelength conversion component includes a high-density phosphor layer and a lower-density phosphor layer. The adhesive is formed between the light-emitting device and the high-density phosphor layer. The reflective layer is formed above the substrate and covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion component.Type: ApplicationFiled: March 19, 2018Publication date: July 26, 2018Inventors: Cheng-Wei Hung, Jui-Fu Chang, Chin-Hua Hung, Yu-Feng Lin
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Patent number: 9997676Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: GrantFiled: September 19, 2016Date of Patent: June 12, 2018Assignee: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Publication number: 20180123001Abstract: A light-emitting device including at least one light-emitting unit, a wavelength conversion adhesive layer, and a reflective protecting element is provided. The light-emitting unit has an upper surface and a lower surface opposite to each other. The light-emitting unit includes two electrode pads, and the two electrode pads are located on the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface. The wavelength conversion adhesive layer includes a low-concentration fluorescent layer and a high-concentration fluorescent layer. The high-concentration fluorescent layer is located between the low-concentration fluorescent layer and the light-emitting unit. The width of the high-concentration fluorescent layer is WH. The width of the low-concentration fluorescent layer is WL. The width of the light-emitting unit is WE. The light-emitting device further satisfies the following inequalities: WE<WL, WH<WL and 0.8<WH/WE?1.2.Type: ApplicationFiled: October 19, 2017Publication date: May 3, 2018Applicant: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Long-Chi Tu, Jui-Fu Chang, Chun-Ming Tseng, Yun-Chu Chen
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Patent number: 9922963Abstract: A light-emitting device includes a substrate, a light-emitting component, a wavelength conversion component, an adhesive and a reflective layer. The light-emitting component is disposed on the substrate. The wavelength conversion component includes a high-density phosphor layer and a lower-density phosphor layer. The adhesive is formed between the light-emitting device and the high-density phosphor layer. The reflective layer is formed above the substrate and covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion component.Type: GrantFiled: September 19, 2016Date of Patent: March 20, 2018Assignee: GENESIS PHOTONICS INC.Inventors: Cheng-Wei Hung, Jui-Fu Chang, Chin-Hua Hung, Yu-Feng Lin
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Publication number: 20170084800Abstract: A light emitting device package structure includes at least one light emitting device, a wavelength conversion adhesive layer, and a protection element. The light emitting device has an upper surface, a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface of the light emitting device and has a first edge and a second edge opposite to each other. The protection element encapsulates the side surface of the light emitting device and the second edge of the wavelength conversion adhesive layer and exposes the lower surface of the light emitting device. A third edge of the protection element is aligned with the first edge of the wavelength conversion adhesive layer.Type: ApplicationFiled: September 19, 2016Publication date: March 23, 2017Applicant: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Po-Tsun Kuo, Long-Chi Du, Jui-Fu Chang, Yu-Feng Lin
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Publication number: 20170084587Abstract: A light-emitting device includes a substrate, a light-emitting component, a wavelength conversion component, an adhesive and a reflective layer. The light-emitting component is disposed on the substrate. The wavelength conversion component includes a high-density phosphor layer and a lower-density phosphor layer. The adhesive is formed between the light-emitting device and the high-density phosphor layer. The reflective layer is formed above the substrate and covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion component.Type: ApplicationFiled: September 19, 2016Publication date: March 23, 2017Inventors: Cheng-Wei Hung, Jui-Fu Chang, Chin-Hua Hung, Yu-Feng Lin
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Publication number: 20170005238Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: ApplicationFiled: September 19, 2016Publication date: January 5, 2017Applicant: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Publication number: 20160276546Abstract: A chip package structure and method of manufacturing the same are provided. The chip package structure includes a substrate with a carrier surface, a chip having a first surface and a second surface positioned oppositely and a side surface connecting the first surface and the second surface, an encapsulation layer and a fluorescent layer. The second surface of the chip is disposed on the carrier surface of the substrate. The fluorescent layer fully covers the first surface of the chip. The encapsulation layer covers the carrier surface of the substrate and the side surface of the chip. A reflectivity of the encapsulation layer is at least greater than 90%.Type: ApplicationFiled: March 18, 2016Publication date: September 22, 2016Inventors: Hao-Chung Lee, Chin-Hua Hung, Cheng-Wei Hung, Jui-Fu Chang, Yu-Feng Lin
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Publication number: 20140241263Abstract: A method for reducing interference between WiMAX signals and WiFi signals includes: obtaining a work frequency of the WiMAX module via the processor; comparing the work frequency of the WiMAX module with a preset frequency via the processor; and selecting a work frequency for the WiFi module according to the comparison result via the processor to make a difference between the work frequency of the WiFi module and the work frequency of the WiMAX module as greater as possible to reduce the interference between the WiFi module and the WiMAX module. An electronic device is also provided.Type: ApplicationFiled: June 3, 2013Publication date: August 28, 2014Inventors: HSIN-LUNG TU, CHIEN-PAN LAI, JUI-FU CHANG