Abstract: A copper clad laminate is provided. The copper clad laminate includes a dielectric layer; an adhesive layer, which is disposed on at least one side of the dielectric layer and formed of an adhesive material, wherein the adhesive material includes a non-perfluorinated resin; and a copper foil, wherein the copper foil has a first surface and is disposed on the other side of the adhesive layer opposite to the dielectric layer, and the copper foil is adhered to the adhesive layer with the first surface, wherein the first surface has a ten-point average roughness (Rz) of less than 0.5 ?m, and the copper foil has a phosphorus content of no more than 499 ?g/dm2 at the first surface.

Abstract: A solvent-free resin composition and uses thereof are provided. The resin composition includes: (A) a maleic acid-modified liquid hydrocarbon resin; (B) a first filler having a D50 particle size of 1 ?m to 4 ?m; and (C) a second filler having a D50 particle size of 5 ?m to 10 ?m. The solvent-free resin composition can be used to fill the holes of printed circuit boards.

Abstract: A resin composition is provided. The resin composition includes a polyimide resin; a hydrocarbon resin or a fluorinated polymer resin; and a silica that is modified by a surface modifier. The content of the hydrocarbon resin is in a range from 1 to 13 parts by weight based on 100 parts by weight of the polyimide resin. The content of the fluorinated polymer resin is in a range from 1 to 60 parts by weight based on 100 parts by weight of the polyimide resin. The content of the silica is in a range from 1 to 10 parts by weight based on 100 parts by weight of the polyimide resin.

Abstract: A primer composition and a laminated substrate with a primer are provided. The primer composition includes 60 to 90 parts by weight of vinyl-aromatic-conjugated-diene copolymer, 1 to 16 parts by weight of a compound having at least three of terminal acryloyloxy groups and 5 to 24 parts by weight of a silane coupling agent, wherein the silane coupling agentis distinct from the compound having at least three of terminal acryloyloxy groups.

Abstract: A resin composition is provided. The resin composition includes a polyimide resin; a hydrocarbon resin or a fluorinated polymer resin; and a silica that is modified by a surface modifier. The content of the hydrocarbon resin is in a range from 1 to 13 parts by weight based on 100 parts by weight of the polyimide resin. The content of the fluorinated polymer resin is in a range from 1 to 60 parts by weight based on 100 parts by weight of the polyimide resin. The content of the silica is in a range from 1 to 10 parts by weight based on 100 parts by weight of the polyimide resin.

Abstract: A resin composition is provided. The resin composition includes a polyimide resin; a hydrocarbon resin or a fluorinated polymer resin; and a silica that is modified by a surface modifier. The content of the hydrocarbon resin is in a range from 1 to 13 parts by weight based on 100 parts by weight of the polyimide resin. The content of the fluorinated polymer resin is in a range from 1 to 60 parts by weight based on 100 parts by weight of the polyimide resin. The content of the silica is in a range from 1 to 10 parts by weight based on 100 parts by weight of the polyimide resin.

Abstract: A primer composition and a copper foil substrate using the same are provided. The primer composition includes a mixture of a hydrocarbon resin and a compound having three or more carbon-carbon double bonds, wherein a molar ratio of the hydrocarbon resin to the compound having three or more carbon-carbon double bonds is 1:0.2 to 1:10.

Abstract: A resin composition is provided. The resin composition includes a polyimide resin; a hydrocarbon resin or a fluorinated polymer resin; and a silica that is modified by a surface modifier. The content of the hydrocarbon resin is in a range from 1 to 13 parts by weight based on 100 parts by weight of the polyimide resin. The content of the fluorinated polymer resin is in a range from 1 to 60 parts by weight based on 100 parts by weight of the polyimide resin. The content of the silica is in a range from 1 to 10 parts by weight based on 100 parts by weight of the polyimide resin.

Abstract: A primer composition and a copper foil substrate using the same are provided. The primer composition includes a mixture of a hydrocarbon resin and a compound having three or more carbon-carbon double bonds, wherein a molar ratio of the hydrocarbon resin to the compound having three or more carbon-carbon double bonds is 1:0.2 to 1:10.