Abstract: An earphone module includes a first circuit board. The first circuit board includes a touch panel layer, a grounding layer, an antenna layer and a touch circuit layer assembly. The grounding layer is disposed apart from and below the touch panel layer. The antenna layer includes an antenna flat portion, an antenna feed wire and an antenna short-circuit wire. The antenna flat portion is disposed apart from and below the grounding layer, and the antenna feed wire and the antenna short-circuit wire are connected to the antenna flat portion. The touch circuit layer assembly is disposed apart from and below the antenna flat portion and includes a touch chip. The touch panel layer is electrically connected to the touch chip.

Abstract: An earphone module includes a first circuit board. The first circuit board includes a touch panel layer, a grounding layer, an antenna layer and a touch circuit layer assembly. The grounding layer is disposed apart from and below the touch panel layer. The antenna layer includes an antenna flat portion, an antenna feed wire and an antenna short-circuit wire. The antenna flat portion is disposed apart from and below the grounding layer, and the antenna feed wire and the antenna short-circuit wire are connected to the antenna flat portion. The touch circuit layer assembly is disposed apart from and below the antenna flat portion and includes a touch chip. The touch panel layer is electrically connected to the touch chip.

Abstract: An earphone module, including a housing, a circuit board, a feeding conductor, a first grounding conductor, and a second grounding conductor, is provided. The housing includes an insulating housing and a metal ring connected thereto. The metal ring serves as an antenna and includes a feeding end, a first ground end, a second ground end, and a slit that splits the metal ring. The slit is located between the feeding end and the first ground end. The second ground end is located between the feeding end and the slit. The circuit board is located in the insulating housing. A slot is formed between the circuit board and the metal ring. The feeding conductor is connected to the feeding end and the circuit board. The first grounding conductor is connected to the first ground end and the circuit board. The second grounding conductor is connected to the second ground end and the circuit board.

Abstract: An earphone module includes an antenna structure. The antenna structure includes a first radiator, a second radiator, a conductive member, and a first insulating member. The first radiator includes a feeding end. The second radiator includes a ground end, and a first slot is formed between the first radiator and the second radiator. The conductive member is connected to the first radiator and the second radiator. The first insulating member is disposed in the first slot. The first radiator, the second radiator, the conductive member, and the first insulating member collectively serve as at least a part of a shell of the earphone module.

Abstract: An earphone module includes an antenna structure. The antenna structure includes a first radiator, a second radiator, a conductive member, and a first insulating member. The first radiator includes a feeding end. The second radiator includes a ground end, and a first slot is formed between the first radiator and the second radiator. The conductive member is connected to the first radiator and the second radiator. The first insulating member is disposed in the first slot. The first radiator, the second radiator, the conductive member, and the first insulating member collectively serve as at least a part of a shell of the earphone module.

Abstract: A wireless communication module includes a first circuit board, a second circuit board, a chip antenna, an electrical connector and an electrical conductive member. The first circuit board and the second circuit board are electrically connected to each other and arranged in parallel spaced relationship. The chip antenna is located on the first circuit board. The electrical connector is located on the second circuit board and between the first and second circuit boards. The electrical conductive member extends from a metal housing of the electrical connector and has at least a radiation aid portion and a shielding portion. The electrical conductive member and the first circuit board collectively define a hollow space, wherein the electrical connector and the electrical conductive member are electrically connected to the chip antenna to serve as an electromagnetic radiation aid member for the chip antenna.

Abstract: A wireless communication module includes a first circuit board, a second circuit board, a chip antenna, an electrical connector and an electrical conductive member. The first circuit board and the second circuit board are electrically connected to each other and arranged in parallel spaced relationship. The chip antenna is located on the first circuit board. The electrical connector is located on the second circuit board and between the first and second circuit boards. The electrical conductive member extends from a metal housing of the electrical connector and has at least a radiation aid portion and a shielding portion. The electrical conductive member and the first circuit board collectively define a hollow space, wherein the electrical connector and the electrical conductive member are electrically connected to the chip antenna to serve as an electromagnetic radiation aid member for the chip antenna.

Abstract: According to one embodiment of the present invention, a dipole antenna capable of supporting multi-band communications, includes a first portion of the antenna in a folded structure, a second portion of the antenna that includes a first coupling pad and a second coupling pad physically separated by a distance, and a current path along the first portion of the antenna and the second portion of the antenna, wherein a first portion of the current path that includes the first coupling pad and the second coupling pad is configured to introduce a slow wave effect if electric current flows through the first portion of the current path.

Abstract: According to one embodiment of the present invention, a dipole antenna capable of supporting multi-band communications, includes a first portion of the antenna in a folded structure, a second portion of the antenna that includes a first coupling pad and a second coupling pad physically separated by a distance, and a current path along the first portion of the antenna and the second portion of the antenna, wherein a first portion of the current path that includes the first coupling pad and the second coupling pad is configured to introduce a slow wave effect if electric current flows through the first portion of the current path.