Abstract: An antenna structure comprises a substrate having a first surface and a second surface, an array of conductor units positioned on the first surface and including at least two conductor units which are coupled, and at least one load metal sheet positioned on at least one of the first surface or the second surface. Each of the conductor units includes an intervening material with two conductors positioned on opposite surfaces of the intervening material.

Abstract: An alternating current light emitting diode device is disclosed, which comprises a substrate having a supporting surface and two supporting elements locating on the two sides of the supporting surface; a plurality of LED grains set on the supporting surface; a first chip resistor set on one of the two supporting elements; and a plurality of electrical wires providing electrical connections between the LED grains, and between the LED grain and the first chip resistor. Therefore, the total wattage of the AC LED device can be lowered to a designed range by using a chip resistor with proper resistance, and the total illumination efficiency can be increased.

Abstract: According to an embodiment of the present invention, an electromagnetic radiation apparatus includes a ground plane and an integrally formed antenna structure. The integrally formed antenna structure may include a radiation plate perpendicular to or with an angle larger than 45 degrees to the ground plane and a shielding structure configured to restrict radiation of the radiation plate.

Abstract: A process for manufacturing an LED package structure includes the following steps: (A) providing a T-shaped heat-sink block and an integral material sheet, wherein the T-shaped heat-sink block includes a base portion and a rise portion extending from the base portion, and wherein the integral material sheet includes a side frame and a pair of electrode lead frames extending, respectively, from two opposite internal sides of the side frame; (B) forming an insulating layer on an upper surface of the base portion; (C) disposing the electrode lead frames on the insulating layer; and (D) forming an insulating outer frame around the T-shaped heat-sink block, wherein the insulating layer is enveloped in the insulating outer frame, and part of the base portion of the heat-sink block exposes out of the insulating outer frame. As a result, the LED package structure can improve voltage resistance and insulation.

Abstract: An epoxy resin composition has a glass transition temperature between 20° C. and 75° C. The epoxy resin composition includes an epoxy resin, a plurality of water vapor-proof particles, and at least two kinds of amino-functional curing agents. One of the amino-functional curing agents is a polyamine-type curing agent. The weight percent of the curing agent corresponding to the epoxy resin is between 10% and 95%.

Abstract: A method for forming an LED phosphor resin layer includes the following steps: (A) providing an upper mold, a lower mold, and an LED support, wherein the LED support supports an LED chip; (B) securing the LED support on the lower mold; (C) providing a phosphor resin material between the LED chip and an attaching surface of the upper mold; (D) aligning the upper mold with the lower mold, such that the phosphor resin material in part contacts the LED chip and in part attaches to the attaching surface of the upper mold, and that the LED chip and the attaching surface are apart from each other at a predetermined distance; and (E) heating the phosphor resin material. Accordingly, the phosphor resin layer so formed can have a thickness and configuration well controlled and that the problem of spatial color difference can be improved.

Abstract: A process for manufacturing an LED package structure includes the following steps: (A) providing a T-shaped heat-sink block and an integral material sheet, wherein the T-shaped heat-sink block includes a base portion and a rise portion extending from the base portion, and wherein the integral material sheet includes a side frame and a pair of electrode lead frames extending, respectively, from two opposite internal sides of the side frame; (B) forming an insulating layer on an upper surface of the base portion; (C) disposing the electrode lead frames on the insulating layer; and (D) forming an insulating outer frame around the T-shaped heat-sink block, wherein the insulating layer is enveloped in the insulating outer frame, and part of the base portion of the heat-sink block exposes out of the insulating outer frame. As a result, the LED package structure can improve voltage resistance and insulation.

Abstract: A high-efficiency LED includes: a substrate, an epitaxial layer structure, a cathode, an anode, a transparent sealing compound and a polyimide layer. The polyimide layer covers surfaces of the epitaxial layer structure and the substrate. The transparent sealing compound covers the polyimide layer, the substrate, the epitaxial layer structure, the cathode and the anode. The polyimide layer of the present invention has a refractive index higher than that of packaging materials in prior art, so as to reduce total internal reflection and optical consumption caused by light scattered from the epitaxial layer structure and the transparent sealing compound.

Abstract: An AC LED device for avoiding harmonic current and flash includes an AC power input terminal, a first AC LED group and a second AC LED group. The AC power input terminal receives an AC power including a positive half-cycle and a negative half-cycle. The first AC LED group is turned on in the positive half-cycle and turned off in the negative half-cycle. The second AC LED group is turned on in the negative half-cycle and turned off in the positive half-cycle. Each of the first AC LED group and the second AC LED group has an overall on voltage with a value lower than a peak voltage value of the AC power by a predetermined value, and an overall peak inverse voltage with a value higher than the peak voltage value of the AC power, so as to increase power factor and avoid harmonic current, thereby effectively eliminating flash problems of the AC LED.

Abstract: An AC LED package structure includes a heat-sink slug, an AC LED module, a positive-electrode frame, a negative-electrode frame, and an insulation submount. The AC LED module is electrically connected with the positive-electrode frame and the negative-electrode frame, respectively. The insulation submount is interposed between the AC LED module and the heat-sink slug. The insulation submount is characterized by having a voltage-resistance value greater than 1000 volts. Therefore, it is possible to prevent the AC LED chip of an AC LED device from being broken through by high voltage, causing an electric shock if a human body touches the AC LED device. And moreover, the AC LED device can satisfy the requirements of a certified safety specification.

Abstract: An alternating current light emitting diode device is disclosed, which comprises a substrate having a supporting surface and two supporting elements locating on the two sides of the supporting surface; a plurality of LED grains set on the supporting surface; a first chip resistor set on one of the two supporting elements; and a plurality of electrical wires providing electrical connections between the LED grains, and between the LED grain and the first chip resistor. Therefore, the total wattage of the AC LED device can be lowered to a designed range by using a chip resistor with proper resistance, and the total illumination efficiency can be increased.

Abstract: According to an embodiment of the present invention, an electromagnetic radiation apparatus includes a ground plane and an integrally formed antenna structure. The integrally formed antenna structure may include a radiation plate perpendicular to or with an angle larger than 45 degrees to the ground plane and a shielding structure configured to restrict radiation of the radiation plate.

Abstract: The present invention discloses a pH buffering hybrid material and the forming method thereof. The pH buffering hybrid material comprises a substrate, a conductive polymer layer on the substrate, and a ZnO nanorod layer produced by deposition of ZnO particles as nucleuses on the conductive polymer layer, and the ZnO particles growing into the ZnO nanorods via hydrothermal reaction. The pH buffering hybrid material has the pH turning ability and the potential of conductivity.

Abstract: A computer input/output (I/O) cable plug retaining seat comprises a retaining cover and a base. The seat can be connected to a computer I/O plug, such as a well-known CENTRONICS cable plug. Four screws are used to secure the cable plug between the retaining cover and the base. A pair of fixing screws secure the retaining seat with cable plug to the rear cover of an equipment shelf so that when a channel unit slides from the card guide of the equipment shelf, the channel unit connector will be led into the guide holes by means of guide pins so that the channel unit connector is precisely aligned with the cable plug. When a user wishes to remove the channel unit from the equipment shelf, the channel unit is extracted directly without having to disconnect the cable. Thus, the objective of rapid assembly and disassembly is achieved.

Abstract: A SCSI cable plug retaining seat includes two guide holes, two guide pins, and a seat. The two guide holes are combined to the upper and lower grooves of the cable plug. The two guide pins are installed to a channel unit connector. The seat has an L shape and the bottom thereof having an opening and has two screws and two screw holes. The retaining base of the present invention serves to fix the cable plug by the screw, and then is locked to the rear covering plate of the shelf. When the channel unit slides into the shelf through card guide, the channel unit connector will be guided into the guide holes by the guide pins so that the channel unit connector is precisely combined to the cable plug. Therefore, the connector can be pulled and inserted rapidly.