Abstract: A molding machine teaching aid includes a frame unit, a molding unit, a material supply unit, a drive unit and a monitoring unit. The molding unit includes a fixed die holder, a movable die holder, and two die kernels respectively and detachably disposed on the fixed and movable die holders. The material supply unit includes a heating module for melting a wire material, and an extruder transporting the molten material into a die cavity formed between the die kernels. The drive unit is controllable to drive movement of the movable die holder relative to the frame unit. The monitoring unit is for a user to operate to control the extruder, the heating module and the drive unit.

Abstract: A molding machine teaching aid includes a frame unit, a molding unit, a material supply unit, a drive unit and a monitoring unit. The molding unit includes a fixed die holder, a movable die holder, and two die kernels respectively and detachably disposed on the fixed and movable die holders. The material supply unit includes a heating module for melting a wire material, and an extruder transporting the molten material into a die cavity formed between the die kernels. The drive unit is controllable to drive movement of the movable die holder relative to the frame unit. The monitoring unit is for a user to operate to control the extruder, the heating module and the drive unit.

Abstract: A synthesis reactor including a container and a control unit is provided. The container includes an outer shell, an inner tank that is disposed in the outer shell and that cooperates with the outer shell to define an interlayer space therebetween, and a heater that is disposed in the interlayer space and that is attached directly to an outer surface of the inner tank. The control unit includes a controller that is electrically connected to the heater and that is configured to control heating temperature of the heater.

Abstract: A lighting apparatus includes an outer housing surrounding a longitudinal axis and made of light-transmissive material, a supporting mount provided within the outer housing, a pair of end caps coupled to opposite ends of the outer housing and supporting mount to define a watertight internal chamber, and a plurality of lighting devices provided on a surface of the supporting mount inside the internal chamber. Each of the lighting devices includes a circuit component and a lighting module detachably mounted to the circuit component.

Abstract: A modular underwater lighting apparatus includes an outer housing, a supporting mount, and a plurality of lighting devices. The outer housing includes an outer surrounding wall extending to surround a longitudinal axis and made of a light-transmissive material. The supporting mount is mounted inside the outer housing. The lighting devices are separately mounted on the supporting mount. Each of the lighting devices includes a circuit component and a lighting module which is detachably mounted to the circuit component.

Abstract: A photography lighting fixture includes a lighting device and a shade device. The lighting device includes a housing, a lighting element disposed in the housing, and a first attaching unit connected to the housing. The shade device includes a base mount, a plurality of shade components mounted pivotally to the base mount, and a second attaching unit mounted to the base mount and detachably and rotatably attaching the first attaching unit.

Abstract: A photography lighting fixture includes a lighting device and a shade device. The lighting device includes a housing, a lighting element disposed in the housing, and a first attaching unit connected to the housing. The shade device includes a base mount, a plurality of shade components mounted pivotally to the base mount, and a second attaching unit mounted to the base mount and detachably and rotatably attaching the first attaching unit.

Abstract: A stacking carrier and a stacking method are provided. The stacking method is used between a wafer and a stacking carrier having the same shape. The stacking method includes the following steps. Firstly, an adhesive layer is coated on a surface of the carrier. Then, the adhesive layer corresponding to an edge of the carrier is partially removed, thereby defining at least one adhesive layer indentation. Afterwards, the wafer is stacked on the carrier through the adhesive layer having the adhesive layer indentation.

Abstract: A silicon based substrate includes a silicon wafer, a first circuit substrate and a second circuit substrate. The silicon wafer includes a first surface and a second surface and at least a through silicon via. The first circuit substrate is disposed on the first surface and includes a plurality of first dielectric layers and a plurality of first conductive trace layers alternately stacked. The second circuit substrate is disposed on the second surface and includes a plurality of second dielectric layers and a plurality of second conductive trace layers alternately stacked. The trace density of the first conductive trace layers is higher than the trace density of the second conductive trace layers. Otherwise, the first dielectric layer includes an inorganic material and the second dielectric layer includes an organic material. A manufacturing method of the silicon based substrate is also provided.

Abstract: A stacking carrier and a stacking method are provided. The stacking method is used between a wafer and a stacking carrier having the same shape. The stacking method includes the following steps. Firstly, an adhesive layer is coated on a surface of the carrier. Then, the adhesive layer corresponding to an edge of the carrier is partially removed, thereby defining at least one adhesive layer indentation. Afterwards, the wafer is stacked on the carrier through the adhesive layer having the adhesive layer indentation.

Abstract: A bonding method and a bonding substrate are provided. The bonding substrate is applied to a silicon wafer having the same shape. The bonding method includes the following steps. Firstly, the optical glass substrate is processed to form a first alignment mark. Then, an adhesive layer is coated on a surface of the optical glass substrate. The adhesive layer on the surface of the optical glass substrate is partially removed, thereby defining an adhesive structure. According to the first alignment mark of the optical glass substrate and a second first alignment mark of the silicon wafer, alignment between the optical glass substrate and the silicon wafer is performed. Afterwards, the optical glass substrate and the silicon wafer are bonded together through the adhesive structure.

Abstract: A silicon based substrate includes a silicon wafer, a first circuit substrate and a second circuit substrate. The silicon wafer includes a first surface and a second surface and at least a through silicon via. The first circuit substrate is disposed on the first surface and includes a plurality of first dielectric layers and a plurality of first conductive trace layers alternately stacked. The second circuit substrate is disposed on the second surface and includes a plurality of second dielectric layers and a plurality of second conductive trace layers alternately stacked. The trace density of the first conductive trace layers is higher than the trace density of the second conductive trace layers. Otherwise, the first dielectric layer includes an inorganic material and the second dielectric layer includes an organic material. A manufacturing method of the silicon based substrate is also provided.

Abstract: A rotary shaft assembly includes: a rotary shaft having an insertion end portion that is disposed co-axially in a hollow base, and rotatable relative to the base; a bearing sleeved on the insertion end portion of the rotary shaft, and partitioning an inner receiving space in the base into a lower oil-storage portion and an upper oil-flow portion; and a stirring member mounted on one end of the insertion end portion and co-rotatable with the rotary shaft. When the rotary shaft rotates, the stirring member stirs lubricating oil in the lower oil-storage portion to urge flow of the lubricating oil from the lower oil-storage portion through a first oil passage unit in one of the base and the bearing, through the upper oil-flow portion and through a second oil passage unit between the bearing and the insertion end portion of the rotary shaft, and back into the lower oil-storage portion.

Abstract: A heat dissipating fan comprises a base unit having an axial sleeve, a dynamic bearing having a shaft section, a stator unit securely around the axial sleeve and a rotor unit. The rotor unit has a hub with a through hole to be jointed to the shaft section. A barrel core is positioned at the inner side of the hub corresponding to the through hole for receiving the shaft section. A connection element engages with the shaft section to secure the connection between the hub and the shaft section. Thus, the heat dissipating fan is assembled quickly, easily and precisely.

Abstract: A hub associated with a shaft in a motor includes a hub, a metal sleeve base and a shaft. The hub has a bush disposed at the center of the inner side of a lateral wall thereof and the sleeve base is inserted in and joined to the bush. The shaft has an end thereof is joined to the bush and another end thereof extending outward from the bush. The metal sleeve base provides an effect of more steadily locating the shaft during a manufacturing process for the shaft being joined to the hub. Hence, it secures the rotational center of the shaft aligns with the axial line of the hub without deviation and the production cost is saved substantially.

Abstract: A heat sink comprises a frame having an axle sleeve, a motor axle having an shaft, a positioning unit securely around the axle sleeve and a rotating unit. The rotating unit is connected to the shaft and has a hub with a through hole. An axle is positioned at a top side of the hub corresponding to the flange of the through hole to receive the shaft. A connection element is fitted to the axle to securely sleeve the shaft. When fitting the shaft into the axle, the connection element is inserted into the through hole to secure around the shaft in order to securely position the shaft within the axle and securely assemble the hub to the shaft. Thus, the heat sink can be quickly, easily and precisely assembled.

Abstract: A heat sink comprising an open frame including air inlets on a top side and a rotatable fan having a plurality of blades is provided. The heat sink is installed in the frame. The frame has pluralities of supporting elements and ribs positioned between two adjacent supporting elements. The supporting elements and ribs correspond to each other to form multiple side air inlets. The operation of the fan is capable of drawing a large volume of the air into the open frame via the top side and side air inlets. The flange of the blades is parallel to the inner curved side of the ribs when the blades pass by the ribs so that a large volume of air is guided into the frame to enhance the heat dissipation effect. This may also maintain an optimum static pressure and substantially reduce the noise level during the operation of the fan.

Abstract: A heat dissipating fan with uniform luminosity includes a frame, a circuit board, a fan wheel and a luminous unit. The frame further includes an annular frame part, a substrate at the center of the annular frame part and a plurality of ribs being connected to the annular frame part and the substrate. The circuit board is attached to the substrate. The fan wheel further includes a fan hub and a plurality of translucidus fan blades circumferentially joined to the fan hub. Each of the fan blades has a plurality of light guiding granular spots intensively distributing at the top thereof to form a foggy and slightly uneven surface to generate a refraction effect with uniform light distribution such that the entire heat dissipating fan becomes well-lit to enhance effect of the integral sight appeal.