Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: An optical water-quality detection apparatus includes a detection device, a biofilm-inhibition light source, a detection light source and a sensor. The detection device includes a detection chamber. The biofilm-inhibition light source is disposed outside the detection chamber and configured to emit biofilm-inhibition light. The detection light source is disposed outside the detection chamber and configured to emit detection light. The sensor is configured to sense the detection light penetrating the detection chamber. A beam of the detection light and a beam of the inhibition light overlaps as penetrating the detection chamber.

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip mounted on the substrate, a supporting layer being ring-shaped and disposed on the sensor chip, a light-permeable layer, and a grooved shielding layer that is ring-shaped and that is disposed on a lower surface of the light-permeable layer. The grooved shielding layer includes an inner barrier and an outer barrier respectively located at two opposite sides of the supporting layer. An inner edge of the inner barrier has an opening directly located above a sensing region of the sensor chip. The inner barrier, the outer barrier, and a part of the lower surface of the light-permeable layer jointly define a ring-shaped groove. The part of the lower surface of the light-permeable layer is disposed on the supporting layer, so that a part of the supporting layer is arranged in the ring-shaped groove.

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The circuit board has a chip-receiving slot recessed in the surface thereof. The sensor chip is arranged in the chip-receiving slot, and a top surface of the sensor chip and the surface of the circuit board have a step difference therebetween that is less than or equal to 10 ?m. The supporting adhesive layer is in a ringed shape and is disposed on the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupled to the substrate and the sensor chip, a light-permeable layer, and a colloid formed on the substrate to fix the light-permeable layer. The colloid covers the wires, a peripheral portion of the sensor chip, and lateral surfaces of the light-permeable layer. A top curved surface of the colloid is partially arranged beside the lateral surfaces. In a cross section of the sensor package structure, the top curved surface has a reference point spaced apart from one of the lateral surfaces adjacent thereto by 100 ?m, a top edge of the top curved surface and the reference point define a connection line, and the connection line and the one of the lateral surfaces have an acute angle within a range from 25 degrees to 36 degrees.

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 µm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 um. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, an infrared light curing layer being in a ringed shape and disposed on the sensor chip, a light-permeable layer arranged above the sensor chip through the infrared light curing layer, and a visible light shielding layer that is in a ringed shape and that is disposed on the light-permeable layer. A sensing region of the sensor chip faces the light-permeable layer. The visible light shielding layer can block a visible light from passing therethrough, and has an opening located directly above the sensing region. The infrared light curing layer is located in a projection space defined by orthogonally projecting the visible light shielding layer toward the substrate, and the visible light shielding layer only allows an infrared light to travel onto the infrared light curing layer by passing therethrough.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupling the sensor chip to the substrate, a supporting colloid layer disposed on the substrate, and a light-permeable sheet that is disposed on the supporting colloid layer. The substrate has a first board surface and a second board surface that is opposite to the first board surface. The substrate has a chip-accommodating slot recessed in the first board surface. The sensor chip is disposed in the chip-accommodating slot, and a gap distance between a top surface of the sensor chip and the first board surface is less than or equal to 10 ?m. The supporting colloid layer is ring-shaped and is disposed on the first board surface, and each of the wires is at least partially embedded in the supporting colloid layer.

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The circuit board has a chip-receiving slot recessed in the surface thereof The sensor chip is arranged in the chip-receiving slot, and a top surface of the sensor chip and the surface of the circuit board have a step difference therebetween that is less than or equal to 10 ?m. The supporting adhesive layer is in a ringed shape and is disposed on the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupled to the substrate and the sensor chip, a light-permeable layer, and a colloid formed on the substrate to fix the light-permeable layer. The colloid covers the wires, a peripheral portion of the sensor chip, and lateral surfaces of the light-permeable layer. A top curved surface of the colloid is partially arranged beside the lateral surfaces. In a cross section of the sensor package structure, the top curved surface has a reference point spaced apart from one of the lateral surfaces adjacent thereto by 100 ?m, a top edge of the top curved surface and the reference point define a connection line, and the connection line and the one of the lateral surfaces have an acute angle within a range from 25 degrees to 36 degrees.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light permeable layer arranged above the sensor chip, and a glue layer formed on the substrate. The light permeable layer includes a top surface, a bottom surface, and a plurality of lateral surfaces. The top surface has a plurality of edges respectively connected to the lateral surfaces covered by the glue layer. The glue layer includes a top curved surface having a top edge connected to the edges, and defines a plurality of tangent planes respectively passing through the edges and being tangent to the top curved surface. Between any one of the lateral surfaces and the adjacent one of the tangent planes, there exists an angle ranging from 38 to 53 degrees. And a difference between any two of the angles is equal to or less than 8 degrees.

Abstract: An electronic device is provided. The electronic device includes a printed circuit board (PCB), an antenna structure, a radio frequency signal transceiving circuit and a testing structure. The antenna structure is disposed on the PCB. The radio frequency signal transceiving circuit is disposed on the PCB, and is connected to the antenna structure through a conductive line. The testing structure includes a testing point and a grounding structure. The testing point is disposed on the conductive line, and the grounding structure is disposed on the PCB.

Abstract: An electronic device is provided. The electronic device includes a printed circuit board (PCB), an antenna structure, a radio frequency signal transceiving circuit and a testing structure. The antenna structure is disposed on the PCB. The radio frequency signal transceiving circuit is disposed on the PCB, and is connected to the antenna structure through a conductive line. The testing structure includes a testing point and a grounding structure. The testing point is disposed on the conductive line, and the grounding structure is disposed on the PCB.

Abstract: Provided is a low water-vapor permeable composite film, which includes a 3-layered co-extruded biaxial-oriented film formed of polyester films or polypropylene films including a first layer, a second layer and a third layer stacked in sequence. The first layer further includes an anti-block agent. An alternate structure including a plurality of organic protection layers and a plurality of inorganic layers are formed on the 3-layered co-extruded biaxial-oriented film. The plurality of organic protection layers and the plurality of inorganic layers are stacked alternately. The inorganic layers are formed by atom layer deposition.