Abstract: This document describes a system including a printed circuit board oriented along a first plane, the printed circuit board having a device that extends in a direction away from the first plane and is capable of producing a radiated signal or is sensitive to a radiated signal produced by another device. The system includes a component shield with a wall structure and a cover structure, the cover structure connected to the wall structure. A housing structure oriented along a second plane defines a shielded space within which the component shield and the device reside. A shielding layer oriented along a third plane substantially parallel with the second plane is disposed at least partially between the cover structure and the housing structure and configured to attenuate radiated signals. A number of capacitor spot welds affix the shielding layer to the cover structure to improve component shielding.

Abstract: An image sensing module is provided. The image sensing module includes an image sensor chip, a support member, a transparent layer, and a shielding layer. The support member is arranged on upper surface of the image sensor chip and surrounds an image sensing region of the image sensor chip. The transparent layer is arranged on upper surface of the support member. Lower surface of the transparent layer faces the image sensor chip, and includes a transparent region and a shielding region surrounding the transparent region. The transparent region corresponds to the image sensing region. Projection of the shielding region in normal direction of the lower surface of the transparent layer does not overlap with the image sensing region. The shielding layer is formed on the shielding region, and includes a frame portion and a plurality of reinforcing portions. The reinforcing portions are individually located at corners of the frame portion.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a sensing chip, a light-permeable element, a photoresist layer, and a die-bonding film layer. The sensing chip is disposed on the substrate, and an upper surface of the sensing chip has a sensing region. The light-permeable element is disposed above the sensing chip. The photoresist layer is disposed on a first surface of the light-permeable element. The die-bonding film layer is adhered between the sensing chip and the light-permeable element and surrounds the sensing region.

Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; placing a chip upside-down on the substrate; forming bonding wires coupled with the chip and the substrate; providing at least one reflecting member on an upper surface of the substrate, forming a support body on the substrate to cover the at least one reflecting member; providing a package cover adhered to the support body by a glass adhesive; performing a solidifying process in which a solidifying light beam is emitted to the reflecting member and the reflecting member reflects the solidifying light beam to the glass adhesive to solidify the glass adhesive; performing a packaging process in which a package body is formed to cover an edge surface of the package cover and a top part of the support body.

Abstract: A force and vibration measurement device is provided for testing an under-test object. The force and vibration measurement device includes a testing assembly, an actuator and a guiding mechanism. The testing assembly is used for applying a force on the under-test object, and collecting a force data of the under-test object, a vibration data or a combination of the force data and the vibration data. The actuator is used driving the testing assembly, changing a magnitude of the applied force on the under-test object and changing a distance between the testing assembly and the under-test object. The guiding mechanism is used for limiting an operating direction of the actuator.

Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; placing a chip upside-down on the substrate; forming bonding wires coupled with the chip and the substrate; forming a support body on the substrate; providing at least one reflecting member at a periphery of the support body; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the reflecting member and the reflecting member reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process to form the chip package structure.

Abstract: A chip package structure includes a substrate, a chip, a light-permeable element, a first anti-reflective layer, and an adhesive element. The chip is disposed on the substrate. The light-permeable element is disposed above the chip. The light-permeable element has a first surface and a second surface opposite to each other, and the first surface faces the chip. The first anti-reflective layer covers at least part of the first surface. The adhesive element is connected between the chip and the light-permeable element, and the adhesive element separates the chip and the light-permeable element. The adhesive element and the first anti-reflective layer are not in contact with each other.

Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; forming a mirror ink on the substrate; placing a chip upside-down on the substrate; forming soldering wires coupled with the chip and the substrate; forming a support body on the substrate; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the mirror ink and the mirror ink reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process in which the package layer and the substrate are cut to form the chip package structure.

Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupling the sensor chip to the substrate, a supporting colloid layer disposed on the substrate, and a light-permeable sheet that is disposed on the supporting colloid layer. The substrate has a first board surface and a second board surface that is opposite to the first board surface. The substrate has a chip-accommodating slot recessed in the first board surface. The sensor chip is disposed in the chip-accommodating slot, and a gap distance between a top surface of the sensor chip and the first board surface is less than or equal to 10 ?m. The supporting colloid layer is ring-shaped and is disposed on the first board surface, and each of the wires is at least partially embedded in the supporting colloid layer.

Abstract: A chip packaging structure is provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, a grating film, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate and has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The second substrate is disposed on an upper surface of the supporting member. The grating film is disposed on a peripheral region of the second substrate and includes a plurality of grating units. The encapsulant is attached to the upper surface of the first substrate, a side surface of the supporting member, and a side surface of the second substrate.

Abstract: A user gesture behavior simulation system includes a touch gesture recording and editing device and a touch gesture simulation device. When at least one touch gesture is implemented on a record touch object with at least one finger of a user, the at least one touch gesture is recorded by the touch gesture recording and editing device, and at least one touch gesture operating trajectory is correspondingly generated by the touch gesture recording and editing device. The touch gesture simulation device includes at least one artificial finger. The at least one artificial finger is driven and moved to an under-test touch object by the touch gesture simulation device. The at least one touch gesture is simulated by the touch gesture simulation device according to the at least one touch gesture operating trajectory.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; forming a mirror ink on the substrate; placing a chip upside-down on the substrate; forming soldering wires coupled with the chip and the substrate; forming a support body on the substrate; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the mirror ink and the mirror ink reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process in which the package layer and the substrate are cut to form the chip package structure.

Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; placing a chip upside-down on the substrate; forming bonding wires coupled with the chip and the substrate; forming a support body on the substrate; providing at least one reflecting member at a periphery of the support body; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the reflecting member and the reflecting member reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process to form the chip package structure.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip mounted on the substrate, a supporting layer being ring-shaped and disposed on the sensor chip, a light-permeable layer, and a grooved shielding layer that is ring-shaped and that is disposed on a lower surface of the light-permeable layer. The grooved shielding layer includes an inner barrier and an outer barrier respectively located at two opposite sides of the supporting layer. An inner edge of the inner barrier has an opening directly located above a sensing region of the sensor chip. The inner barrier, the outer barrier, and a part of the lower surface of the light-permeable layer jointly define a ring-shaped groove. The part of the lower surface of the light-permeable layer is disposed on the supporting layer, so that a part of the supporting layer is arranged in the ring-shaped groove.

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The circuit board has a chip-receiving slot recessed in the surface thereof. The sensor chip is arranged in the chip-receiving slot, and a top surface of the sensor chip and the surface of the circuit board have a step difference therebetween that is less than or equal to 10 ?m. The supporting adhesive layer is in a ringed shape and is disposed on the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupled to the substrate and the sensor chip, a light-permeable layer, and a colloid formed on the substrate to fix the light-permeable layer. The colloid covers the wires, a peripheral portion of the sensor chip, and lateral surfaces of the light-permeable layer. A top curved surface of the colloid is partially arranged beside the lateral surfaces. In a cross section of the sensor package structure, the top curved surface has a reference point spaced apart from one of the lateral surfaces adjacent thereto by 100 ?m, a top edge of the top curved surface and the reference point define a connection line, and the connection line and the one of the lateral surfaces have an acute angle within a range from 25 degrees to 36 degrees.

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.