Patents by Inventor Jui-Hung Yeh
Jui-Hung Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240113414Abstract: Disclosed is an electronic device including a device body and an antenna module. The antenna module includes a conductive element and at least one antenna element. The conductive element includes a main body portion and at least one assembly portion connected with each other. The at least one assembly portion is assembled on the device body. The at least one antenna element is disposed on the device body and coupled with the conductive element to excite a first resonance mode. The at least one assembly portion overlaps the at least one antenna element in the length direction of the main body portion.Type: ApplicationFiled: September 24, 2023Publication date: April 4, 2024Applicant: COMPAL ELECTRONICS, INC.Inventors: Chih-Heng Lin, Li-Chun Lee, Shih-Chia Liu, Jui-Hung Lai, Hung-Yu Yeh
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Patent number: 10890553Abstract: A sensing device includes a first III-V compound stack and a second III-V compound stack. The first III-V compound stack has a first sensing area, and the second III-V compound stack has a second sensing area. A passivation layer fully covers the second sensing area. The first III-V compound stack is physically separated from the second III-V compound stack, and has material compositions and structures same as the second III-V compound stack.Type: GrantFiled: November 6, 2017Date of Patent: January 12, 2021Assignee: EPISTAR CORPORATIONInventors: Kunal Kashyap, Kun-Wei Kao, Yih-Hua Renn, Meng-Lun Tsai, Zong-Xi Chen, Hsin-Mao Liu, Jui-Hung Yeh, Hung-Chi Wang
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Patent number: 10403804Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.Type: GrantFiled: June 13, 2018Date of Patent: September 3, 2019Assignees: EPISTAR CORPORATION, IMEC TAIWAN CO.Inventors: Guan Ru He, Jui-Hung Yeh, Kevin T. Y. Huang, Chih Chung Chen
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Patent number: 10326065Abstract: The present application discloses a light-emitting array, comprising a first light-emitting chip; a second light-emitting chip; and a conductive line electrically connected to the first light-emitting chip and the second light-emitting chip, wherein the conductive line includes a first segment and a second segment having a radius curvature different from that of the first segment.Type: GrantFiled: July 18, 2017Date of Patent: June 18, 2019Assignee: Epistar CorporationInventors: Min-Hsun Hsieh, Guan-Ru He, Chao-Hsing Chen, Jui-Hung Yeh, Chia-Liang Hsu
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Publication number: 20180301609Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.Type: ApplicationFiled: June 13, 2018Publication date: October 18, 2018Inventors: Guan Ru He, Jui-Hung Yeh, Kevin T. Y. Huang, Chih Chung Chen
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Patent number: 10026882Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.Type: GrantFiled: October 7, 2014Date of Patent: July 17, 2018Assignees: EPISTAR CORPORATION, IMEC TAIWAN CO.Inventors: Guan Ru He, Jui-Hung Yeh, Kevin T. Y. Huang, Chih Chung Chen
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Patent number: 10026778Abstract: A light-emitting structure includes an epitaxial structure including a plurality of trenches; a conductive connecting layer, disposed under the epitaxial structure; a first isolation layer; a crossover metal layer, disposed under the first isolation layer and including a plurality of protruding portions protruding into the epitaxial structure through the plurality of trenches; a second isolation layer, disposed under the crossover metal layer; a bonding layer disposed under the second isolation layer; a substrate, disposed under the bonding layer; and an electrode, electrically connected to the conductive connecting layer and disposed adjacent to the epitaxial structure in a cross-sectional view.Type: GrantFiled: October 6, 2017Date of Patent: July 17, 2018Assignee: EPISTAR CORPORATIONInventors: Li-Ping Jou, Yu-Chen Yang, Jui-Hung Yeh
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Publication number: 20180128761Abstract: A sensing device includes a first III-V compound stack and a second III-V compound stack. The first III-V compound stack has a first sensing area, and the second III-V compound stack has a second sensing area. A passivation layer fully covers the second sensing area. The first III-V compound stack is physically separated from the second III-V compound stack, and has material compositions and structures same as the second III-V compound stack.Type: ApplicationFiled: November 6, 2017Publication date: May 10, 2018Inventors: Kunal KASHYAP, Kun-Wei KAO, Yih-Hua RENN, Meng-Lun TSAI, Zong-Xi CHEN, Hsin-Mao LIU, Jui-Hung YEH, Hung-Chi WANG
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Publication number: 20180033824Abstract: A light-emitting structure includes an epitaxial structure including a plurality of trenches; a conductive connecting layer, disposed under the epitaxial structure; a first isolation layer; a crossover metal layer, disposed under the first isolation layer and including a plurality of protruding portions protruding into the epitaxial structure through the plurality of trenches; a second isolation layer, disposed under the crossover metal layer; a bonding layer disposed under the second isolation layer; a substrate, disposed under the bonding layer; and an electrode, electrically connected to the conductive connecting layer and disposed adjacent to the epitaxial structure in a cross-sectional view.Type: ApplicationFiled: October 6, 2017Publication date: February 1, 2018Inventors: Li-Ping JOU, Yu-Chen YANG, Jui-Hung YEH
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Patent number: 9825090Abstract: A light-emitting structure includes a first epitaxial unit; a second epitaxial unit disposed next to the first epitaxial unit; a crossover metal layer including a first protruding portion laterally overlapping the first epitaxial unit and the second epitaxial unit wherein the first protruding portion is electrically connected with the first epitaxial unit and the second epitaxial unit; a conductive connecting layer disposed below the first epitaxial unit and the second epitaxial unit and surrounding the first protruding portion; and an electrode arranged on the conductive connecting layer.Type: GrantFiled: January 9, 2017Date of Patent: November 21, 2017Assignee: EPISTAR CORPORATIONInventors: Li-Ping Jou, Yu-Chen Yang, Jui-Hung Yeh
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Publication number: 20170317255Abstract: The present application discloses a light-emitting array, comprising a first light-emitting chip; a second light-emitting chip; and a conductive line electrically connected to the first light-emitting chip and the second light-emitting chip, wherein the conductive line includes a first segment and a second segment having a radius curvature different from that of the first segment.Type: ApplicationFiled: July 18, 2017Publication date: November 2, 2017Inventors: Min-Hsun Hsieh, Guan-Ru He, Chao-Hsing Chen, Jui-Hung Yeh, Chia-Liang Hsu
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Publication number: 20170117321Abstract: A light-emitting structure includes a first epitaxial unit; a second epitaxial unit disposed next to the first epitaxial unit; a crossover metal layer including a first protruding portion laterally overlapping the first epitaxial unit and the second epitaxial unit wherein the first protruding portion is electrically connected with the first epitaxial unit and the second epitaxial unit; a conductive connecting layer disposed below the first epitaxial unit and the second epitaxial unit and surrounding the first protruding portion; and an electrode arranged on the conductive connecting layer.Type: ApplicationFiled: January 9, 2017Publication date: April 27, 2017Inventors: Li-Ping JOU, Yu-Chen YANG, Jui-Hung YEH
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Patent number: 9553127Abstract: A light-emitting diode structure comprises a first epitaxial unit; a second epitaxial unit separated from the first epitaxial unit; a crossover metal layer comprising a first protruding portion entering the first epitaxial unit; a conductive layer separated from the crossover metal layer and comprising a second protruding portion entering the second epitaxial unit; a conductive connecting layer surrounding the first protruding portion; and an electrode arranged on the conductive connecting layer.Type: GrantFiled: November 30, 2015Date of Patent: January 24, 2017Assignee: Epistar CorporationInventors: Li-Ping Jou, Yu-Chen Yang, Jui-Hung Yeh
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Publication number: 20160104744Abstract: An LED array having N light-emitting diode units (N?3) comprises a permanent substrate, a bonding layer on the permanent substrate, a second conductive layer on the bonding layer, a second isolation layer on the second conductive layer, a crossover metal layer on the second isolation layer, a first isolation layer on the crossover metal layer, a conductive connecting layer on the first isolation layer, an epitaxial structure on the conductive connecting layer, and a first electrode layer on the epitaxial structure. The light-emitting diode units are electrically connected with each other by the crossover metal layer.Type: ApplicationFiled: November 30, 2015Publication date: April 14, 2016Inventors: Li-Ping JOU, Yu-Chen YANG, Jui-Hung YEH
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Publication number: 20160099393Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.Type: ApplicationFiled: October 7, 2014Publication date: April 7, 2016Inventors: Guan Ru He, Jui-Hung Yeh, Kevin T. Y. Huang, Chih Chung Chen
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Publication number: 20150364650Abstract: The description discloses a lighting-emitting device and the method of manufacturing the same. A disclosed method of manufacturing a light-emitting device comprising providing a temporary substrate, forming a bonding pad on the temporary substrate, providing a first substrate, forming a light-emitting chip on the first substrate, connecting the light-emitting chip and the bonding pad layer.Type: ApplicationFiled: June 12, 2014Publication date: December 17, 2015Inventors: Guan-Ru HE, Jui-Hung YEH
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Patent number: 9202981Abstract: An LED array having N light-emitting diode units (N?3) comprises a permanent substrate, a bonding layer on the permanent substrate, a second conductive layer on the bonding layer, a second isolation layer on the second conductive layer, a crossover metal layer on the second isolation layer, a first isolation layer on the crossover metal layer, a conductive connecting layer on the first isolation layer, an epitaxial structure on the conductive connecting layer, and a first electrode layer on the epitaxial structure. The light-emitting diode units are electrically connected with each other by the crossover metal layer.Type: GrantFiled: July 14, 2014Date of Patent: December 1, 2015Assignee: EPISTAR CORPORATIONInventors: Li-Ping Jou, Yu-Chen Yang, Jui-Hung Yeh
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Publication number: 20150263256Abstract: The present application discloses a light-emitting array, comprising a first light-emitting chip; a second light-emitting chip; and a conductive line electrically connected to the first light-emitting chip and the second light-emitting chip, wherein the conductive line includes a first segment and a second segment having a radius curvature different from that of the first segment.Type: ApplicationFiled: March 13, 2015Publication date: September 17, 2015Inventors: Min-Hsun Hsieh, Guan-Ru He, Chao-Hsing Chen, Jui-Hung Yeh, Chia-Liang Hsu
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Publication number: 20140319574Abstract: An LED array having N light-emitting diode units (N?3) comprises a permanent substrate, a bonding layer on the permanent substrate, a second conductive layer on the bonding layer, a second isolation layer on the second conductive layer, a crossover metal layer on the second isolation layer, a first isolation layer on the crossover metal layer, a conductive connecting layer on the first isolation layer, an epitaxial structure on the conductive connecting layer, and a first electrode layer on the epitaxial structure. The light-emitting diode units are electrically connected with each other by the crossover metal layer.Type: ApplicationFiled: July 14, 2014Publication date: October 30, 2014Inventors: Li-Ping JOU, Yu-Chen YANG, Jui-Hung YEH
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Patent number: 8872204Abstract: A light-emitting device comprises a substrate, an epitaxial structure formed on the substrate including a first semiconductor layer, a second semiconductor layer, and a light-emitting layer formed between the first semiconductor layer and the second semiconductor layer. A trench is formed in the epitaxial structure to expose a part of side surface of the epitaxial structure and a part of surface of the first semiconductor layer, so that a first conductive structure is formed on the part of surface of the first semiconductor layer in the trench, and a second conductive structure is formed on the second semiconductor layer. The first conductive structure includes a first electrode and a first pad electrically contacted with each other. The second conductive structure includes a second electrode and a second pad electrically contacted with each other. Furthermore, the area of at least one of the first pad and the second pad is between 1.5×104 ?m2 and 6.2×104 ?m2.Type: GrantFiled: June 2, 2011Date of Patent: October 28, 2014Assignee: Epistar CorporationInventors: Yu-Chen Yang, Li-Ping Jou, Jui-Hung Yeh, Chien-Fu Shen