Patents by Inventor Jui-Jung Chien

Jui-Jung Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mask structure and manufacturing method thereof
    Patent number: 11366381
    Abstract: A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: June 21, 2022
    Assignee: Unimicron Technology Corp.
    Inventors: Pu-Ju Lin, Shih-Lian Cheng, Yu-Hua Chen, Cheng-Ta Ko, Jui-Jung Chien, Wei-Tse Ho
  • MASK STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20190250502
    Abstract: A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.
    Type: Application
    Filed: April 26, 2019
    Publication date: August 15, 2019
    Applicant: Unimicron Technology Corp.
    Inventors: Pu-Ju Lin, Shih-Lian Cheng, Yu-Hua Chen, Cheng-Ta Ko, Jui-Jung Chien, Wei-Tse Ho
  • Manufacturing method of circuit substrate and mask structure and manufacturing method thereof
    Patent number: 10324370
    Abstract: A manufacturing method of a circuit substrate is provided. A substrate is provided. A positive photoresist layer is coated on the substrate. Once exposure process is performed on the positive photoresist layer disposed on the substrate so as to simultaneously form concaves with at least two different depths.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: June 18, 2019
    Assignee: Unimicron Technology Corp.
    Inventors: Pu-Ju Lin, Shih-Lian Cheng, Yu-Hua Chen, Cheng-Ta Ko, Jui-Jung Chien, Wei-Tse Ho
  • MANUFACTURING METHOD OF CIRCUIT SUBSTRATE AND MASK STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20180070452
    Abstract: A manufacturing method of a circuit substrate is provided. A substrate is provided. A positive photoresist layer is coated on the substrate. Once exposure process is performed on the positive photoresist layer disposed on the substrate so as to simultaneously form concaves with at least two different depths.
    Type: Application
    Filed: September 6, 2016
    Publication date: March 8, 2018
    Applicant: Unimicron Technology Corp.
    Inventors: Pu-Ju Lin, Shih-Lian Cheng, Yu-Hua Chen, Cheng-Ta Ko, Jui-Jung Chien, Wei-Tse Ho
  • METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
    Publication number: 20140263168
    Abstract: A method for manufacturing a package substrate is provided, including etching a substrate to form trenches each having a buffer portion, and forming a circuit in each of the trenches. The trenches are formed by etching instead of excimer laser to increase the aspect ratio of the trench, thereby solving the problem that the metallic layer is not thick enough and achieving a high yield of the circuit and a good process capability index.
    Type: Application
    Filed: November 25, 2013
    Publication date: September 18, 2014
    Applicant: Unimicron Technology Corporation
    Inventors: Shih-Lian Cheng, Jui-Jung Chien