Abstract: Embodiments provide a device for penetrating a tissue of a subject. The device comprises a tissue penetrating portion having a tissue penetrating end. The device further comprises an ultrasonic scanner coupled to the tissue penetrating portion. The ultrasonic scanner comprises an ultrasound transduction circuit being configured to generate and transmit ultrasound waves to the subject and to receive returned sound waves echoed from the subject. The ultrasonic scanner further comprises a pulse generating circuit being configured to generate an electrical pulse so that the ultrasound transduction circuit is triggered to generate and transmit ultrasound waves.

Abstract: Embodiments of the invention are directed to an external shock absorber for an electronic device such as a disc drive. The external shock absorber is made from an elastomeric material with an arrangement of foam-like internal and external cavities. The external shock absorber may be placed adjacent to a housing of an electronic device to provide shock absorption, may cover a portion of the electronic device housing, or may be shaped to cover a portion of the electronic device housing.

Abstract: A method for forming an plurality of paths on a substrate includes drilling an opening for a via to a depth to expose a first pad and a second pad, lining the opening with a conductive material, and insulating a first portion of the lining in the opening from a second portion of the lining in the opening to form a first electrical path contacting the first pad and a second electrical path contacting the second pad.

Abstract: A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

Abstract: A system includes a device having at least one integrated circuit. The integrated circuit further includes a first layer of conductive material, a second layer of conductive material, and a via having multiple electrical paths for interconnecting the first layer of conductive material and the second layer of conductive material. A method for forming a via includes drilling an opening to a depth to expose a first pad and a second pad, lining the opening with a conductive material, and insulating a first portion of the lining in the opening from a second portion of the lining in the opening to form a first electrical path contacting the first pad and a second electrical path contacting the second pad.

Abstract: In some embodiments, a method includes providing a substrate, providing a coverlay blank, laminating the coverlay blank to the substrate, and forming at least one opening in the coverlay blank by photolithography.