Abstract: The present invention relates to a detection apparatus of chemical mechanical polishing conditioner, comprising: a working platform with a working plane; a placement base disposed on the working plane of the working platform, for carrying a chemical mechanical polishing conditioner; an image capture device forming one or a plurality of captured images on different regions of the chemical mechanical polishing conditioner; a display device; an image recognition module, wherein the captured images are performed a color matching by the image recognition module to determine one or a plurality of risk diamonds on the chemical mechanical polishing conditioner, and the coordinate location of the risk diamonds are outputted into the display device; and a mobile platform for moving the risk diamonds to specified locations. A detection method of the above mentioned detection apparatus is also disclosed.

Abstract: The present invention relates to a detection method and apparatus for the tip of the chemical mechanical polishing conditioner, which comprises: providing a dyeing apparatus comprising a dyeing layer; providing a chemical mechanical polishing conditioner comprising a substrate, a binding layer, and a plurality of abrasive particles, the abrasive particles fixed on the substrate by the binding layer; making the abrasive particles of the chemical mechanical polishing conditioner toward the dyeing apparatus and provide a downward force, so that the chemical mechanical polishing conditioner is contacted with the dyeing layer; and separating the chemical mechanical polishing conditioner and the dyeing apparatus, so that the abrasive particles with a particular protruding height form dyeing abrasive particles adhered the dyeing layer on their surface, and the dyeing abrasive particles are determined as a defect of destroying the flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a chemical mechanical polishing conditioner and manufacturing methods thereof. The chemical mechanical polishing conditioner comprises: a planar substrate having a leveling surface; a bonding layer disposed on the surface of the planar substrate; and a plurality of abrasive particles embedded in the surface of the bonding layer and fixed to the surface of the planar substrate by the binding layer; wherein the planar substrate is formed by a deformation compensation for the non-planar substrate during curing the binding layer, and thus the tips of the abrasive particles have a leveled height. Therefore, the present invention can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during heating and curing process, and thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a segment-type chemical mechanical polishing conditioner and a method for manufacturing thereof. The segment-type chemical mechanical polishing conditioner comprises: a bottom substrate having a center protrusion; an abrasive unit binding layer disposed on the outside of the surface of the bottom substrate; and a plurality of abrasive units placed on the abrasive unit binding layer; wherein the abrasive units have a fan-shaped contour and are arrange along the center protrusion of the bottom substrate to form a discontinuous circular contour. Therefore, the present invention can utilize the center protrusion of the bottom substrate to adjust the arrangements of the abrasive units, and effectively improve the problem of thermal deformation of the surface of the chemical mechanical polishing conditioner during heat-hardening process, thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a grinding tool and a method for fabricating the same. The method comprises: (A) providing a grinding plate having a working surface and a non-working surface, a mold having an adjustment surface, and a backplane; (B) getting the working surface of the grinding plate to fit precisely and be retained on the adjustment surface of the mold by a binder; (C) forming an adhesive layer on the non-working surface of the grinding plate; (D) disposing the backplane on a surface of the adhesive layer to retain the backplane over the non-working surface of the grinding plate by the adhesive layer; and (E) removing the binder to separate the mold from the grinding plate. Accordingly, the present invention can significantly improve the precision and lifetime of products, reduce the cost of production, and enhance the machining efficiency.