Patents by Inventor Jui-Lin Chou

Jui-Lin Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140273773
    Abstract: The present invention relates to a segment-type chemical mechanical polishing conditioner and a method for manufacturing thereof. The segment-type chemical mechanical polishing conditioner comprises: a bottom substrate having a center protrusion; an abrasive unit binding layer disposed on the outside of the surface of the bottom substrate; and a plurality of abrasive units placed on the abrasive unit binding layer; wherein the abrasive units have a fan-shaped contour and are arrange along the center protrusion of the bottom substrate to form a discontinuous circular contour. Therefore, the present invention can utilize the center protrusion of the bottom substrate to adjust the arrangements of the abrasive units, and effectively improve the problem of thermal deformation of the surface of the chemical mechanical polishing conditioner during heat-hardening process, thereby enhancing the surface flatness of chemical mechanical polishing conditioner.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: Kinik Company
    Inventors: Jui-Lin CHOU, Chia Chun WANG, Chia-Feng CHIU, Chung-Yi CHENG
  • Publication number: 20100022174
    Abstract: The present invention relates to a grinding tool and a method for fabricating the same. The method comprises: (A) providing a grinding plate having a working surface and a non-working surface, a mold having an adjustment surface, and a backplane; (B) getting the working surface of the grinding plate to fit precisely and be retained on the adjustment surface of the mold by a binder; (C) forming an adhesive layer on the non-working surface of the grinding plate; (D) disposing the backplane on a surface of the adhesive layer to retain the backplane over the non-working surface of the grinding plate by the adhesive layer; and (E) removing the binder to separate the mold from the grinding plate. Accordingly, the present invention can significantly improve the precision and lifetime of products, reduce the cost of production, and enhance the machining efficiency.
    Type: Application
    Filed: July 28, 2008
    Publication date: January 28, 2010
    Applicant: Kinik Company
    Inventors: Jui-Lin Chou, Tung-liang Liao, Yung-Chuan Chen