Abstract: A transceiver includes: a radio-frequency (RF) front-end circuit; a dedicated RF front-end circuit; and a switchable matching circuit, integrated in a chip. The RF front-end circuit deals with communications of a first wireless standard, and the dedicated RF front-end circuit deals with communications of a second wireless standard. The switchable matching circuit provides impedance matching between the signal port and the RF front-end circuit when the RF front-end circuit is in operation, and provides impedance matching between the signal port and the dedicated RF front-end circuit when the dedicated RF front-end circuit is in operation, and includes: a first capacitive circuit coupled to the signal port; a first switch circuit coupled between the first capacitive circuit and the dedicated RF front-end circuit; a second capacitive circuit coupled to the dedicated RF front-end circuit; and a second switch circuit coupled to a second terminal of the second capacitive circuit.

Abstract: A system includes a local oscillator (LO) signal generation circuit, a receiver (RX) circuit, and a calibration circuit. The LO signal generation circuit generates an LO signal according to a reference clock, and includes an active oscillator that generates the reference clock. The active oscillator includes at least one active component. The RX circuit generates a processed RX signal by processing an RX input signal according to the LO signal. The calibration circuit checks a signal characteristic of the processed RX signal by detecting if a calibration tone exists within a receiver bandwidth, set a frequency calibration control output in response to the calibration tone being not found in the receiver bandwidth, and output the frequency calibration control output to the LO signal generation circuit. The LO signal generation circuit adjusts an LO frequency of the LO signal in response to the frequency calibration control output.

Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.

Abstract: The invention refers to a light-transmissive plastic plate structure suitable for vehicle sunroof with curved surface and a method for fabricating the same. By using polymer material formulation, UV resistant coating formulation and precision coating technology, the wear resistance of polymer surface of plastic substrate can be improved to the same level as glass, and the original optical and physical properties after various environmental tests can also be maintained. The plastic substrate is first formed into a curved plastic plate through a hot pressing process, and then a connecting structure is formed and fixed on the plastic plate by an insert-molding injection process, in order to replace the traditional car sunroof mechanism which is assembled by glass plate bonded with metal connecting parts.

Abstract: The invention refers to a light-transmissive plastic plate structure suitable for vehicle sunroof with curved surface and a method for fabricating the same. By using polymer material formulation, UV resistant coating formulation and precision coating technology, the wear resistance of polymer surface of plastic substrate can be improved to the same level as glass, and the original optical and physical properties after various environmental tests can also be maintained. The plastic substrate is first formed into a curved plastic plate through a hot pressing process, and then a connecting structure is formed and fixed on the plastic plate by an insert-molding injection process, in order to replace the traditional car sunroof mechanism which is assembled by glass plate bonded with metal connecting parts.

Abstract: A wireless system includes an active oscillator and a front-end circuit. The active oscillator is used to generate and output a reference clock. The active oscillator includes at least one active component, and does not include an electromechanical resonator. The front-end circuit is used to process a transmit (TX) signal or a receive (RX) signal according to a local oscillator (LO) signal. The LO signal is derived from the reference clock.

Abstract: A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.

Abstract: A method for processing a curved plastic panel is to first form a hard coating layer, an optical function layer, and a printing layer on a flat plastic substrate, and then cut it into a predetermined shape, and then use a hot pressing and curving device to perform a hot pressing and curving process to the flat plastic substrate in order to make it becoming a curved plastic substrate. The hot pressing and curving device can simultaneously perform hot pressing during the heating process, and has the functions of real-time monitoring of the local temperature and the local curvature forming state, and then feedback to the local heating and curvature forming mechanism for adjustments. The monitoring of temperature and curvature can be divided into multiple stages, which can be monitored stage by stage and adjusted for heating or curvature forming to improve production yield.

Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.

Abstract: A transceiver includes: a radio-frequency (RF) front-end circuit; a dedicated RF front-end circuit; and a switchable matching circuit, integrated in a chip. The RF front-end circuit deals with communications of a first wireless standard, and the dedicated RF front-end circuit deals with communications of a second wireless standard. The switchable matching circuit provides impedance matching between the signal port and the RF front-end circuit when the RF front-end circuit is in operation, and provides impedance matching between the signal port and the dedicated RF front-end circuit when the dedicated RF front-end circuit is in operation, and includes: a first capacitive circuit coupled to the signal port; a first switch circuit coupled between the first capacitive circuit and the dedicated RF front-end circuit; a second capacitive circuit coupled to the dedicated RF front-end circuit; and a second switch circuit coupled to a second terminal of the second capacitive circuit.

Abstract: A transceiver includes a radio-frequency (RF) front-end circuit, a dedicated RF front-end circuit, and a switchable matching circuit. The RF front-end circuit deals with communications of at least a first wireless communication standard. The dedicated RF front-end circuit deals with communications of a second wireless communication standard only. The switchable matching circuit is coupled to the RF front-end circuit, the dedicated RF front-end circuit, and a signal port of a chip. The switchable matching circuit provides impedance matching between the signal port and the RF front-end circuit when the RF front-end circuit is in operation, and provides impedance matching between the signal port and the dedicated RF front-end circuit when the dedicated RF front-end circuit is in operation. The RF front-end circuit, the dedicated RF front-end circuit, and the switchable matching circuit are integrated in the chip.

Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.

Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.

Abstract: A system includes a local oscillator (LO) signal generation circuit, a receiver (RX) circuit, and a calibration circuit. The LO signal generation circuit generates an LO signal according to a reference clock, and includes an active oscillator that generates the reference clock. The active oscillator includes at least one active component. The RX circuit generates a processed RX signal by processing an RX input signal according to the LO signal. The calibration circuit checks a signal characteristic of the processed RX signal by detecting if a calibration tone exists within a receiver bandwidth, set a frequency calibration control output in response to the calibration tone being not found in the receiver bandwidth, and output the frequency calibration control output to the LO signal generation circuit. The LO signal generation circuit adjusts an LO frequency of the LO signal in response to the frequency calibration control output.

Abstract: A wireless system includes a local oscillator (LO) signal generation circuit, a receiver (RX) circuit, and a calibration circuit. The LO signal generation circuit generates an LO signal according to a reference clock. The LO signal generation circuit includes an active oscillator. The active oscillator generates the reference clock, wherein the active oscillator includes at least one active component, and does not include an electromechanical resonator. The RX circuit generates a down-converted RX signal by performing down-conversion upon an RX input signal according to the LO signal. The calibration circuit generates a frequency calibration control output according to a signal characteristic of the down-converted RX signal, and outputs the frequency calibration control output to the LO signal generation circuit. The LO signal generation circuit adjusts an LO frequency of the LO signal in response to the frequency calibration control output.

Abstract: A transceiver includes a radio-frequency (RF) front-end circuit, a dedicated RF front-end circuit, and a switchable matching circuit. The RF front-end circuit deals with communications of at least a first wireless communication standard. The dedicated RF front-end circuit deals with communications of a second wireless communication standard only. The switchable matching circuit is coupled to the RF front-end circuit, the dedicated RF front-end circuit, and a signal port of a chip. The switchable matching circuit provides impedance matching between the signal port and the RF front-end circuit when the RF front-end circuit is in operation, and provides impedance matching between the signal port and the dedicated RF front-end circuit when the dedicated RF front-end circuit is in operation. The RF front-end circuit, the dedicated RF front-end circuit, and the switchable matching circuit are integrated in the chip.

Abstract: A light-guide sunroof assembly comprises a plastic substrate and a light source module furnished besides the plastic substrate. An outer layer of the plastic substrate is added with dye to form a colored background. A plurality of light-guide microstructures is furnished on the plastic substrate to guide the light generated by the light source module toward an inner surface of the plastic substrate. Thereby, the light generated by the light source module is guided by the plastic substrate and then ejects out of the inner surface of plastic substrate, so as to provide a light decoration or lighting effect that enriches the visual experience. Moreover, the plastic substrate is first formed into a curved plastic plate through a hot pressing process, and then a connecting structure is formed and fixed on the plastic plate by an insert-molding injection process, in order to replace the traditional car sunroof mechanism which is assembled by glass plate bonded with metal connecting parts.

Abstract: The invention refers to a light-transmissive plastic plate structure suitable for vehicle sunroof with curved surface and a method for fabricating the same. By using polymer material formulation, UV resistant coating formulation and precision coating technology, the wear resistance of polymer surface of plastic substrate can be improved to the same level as glass, and the original optical and physical properties after various environmental tests can also be maintained. The plastic substrate is first formed into a curved plastic plate through a hot pressing process, and then a connecting structure is formed and fixed on the plastic plate by an insert-molding injection process, in order to replace the traditional car sunroof mechanism which is assembled by glass plate bonded with metal connecting parts.

Abstract: A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.

Abstract: A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.