Patents by Inventor Jui-Lin Yang
Jui-Lin Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11983051Abstract: An electronic device having a detachable memory is provided with a docking connector, and includes a device body and a memory. The device body has an accommodating slot and a stopping portion provided corresponding to the accommodating slot, and the stopping portion and the accommodating slot jointly form a displacement space in between. The memory is provided with a connector and a protruding stopped portion. When the memory is accommodated in the accommodating slot, the stopped portion is moved along into the displacement space and is stopped by the stopping portion, and the connector is docked with the docking connector. Thus, the memory is provided with an anti-misplugging effect.Type: GrantFiled: April 10, 2023Date of Patent: May 14, 2024Assignee: Getac Technology CorporationInventors: Jui-Lin Yang, Juei-Chi Chang
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Publication number: 20240154015Abstract: A method includes forming a first fin and a second fin protruding from a frontside of a substrate, forming a gate stack over the first and second fins, forming a dielectric feature dividing the gate stack into a first segment engaging the first fin and a second segment engaging the second fin, and growing a first epitaxial feature on the first fin and a second epitaxial feature on the second fin. The dielectric feature is disposed between the first and second epitaxial features. The method also includes performing an etching process on a backside of the substrate to form a backside trench, and forming a backside via in the backside trench. The backside trench exposes the dielectric feature and the first and second epitaxial features. The backside via straddles the dielectric feature and is in electrical connection with the first and second epitaxial features.Type: ApplicationFiled: March 22, 2023Publication date: May 9, 2024Inventors: Jui-Lin CHEN, Hsin-Wen SU, Chih-Ching WANG, Chen-Ming LEE, Chung-I YANG, Yi-Feng TING, Jon-Hsu HO, Lien-Jung HUNG, Ping-Wei WANG
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Patent number: 11968817Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.Type: GrantFiled: February 28, 2022Date of Patent: April 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Jui-Lin Chen, Chao-Yuan Chang, Ping-Wei Wang, Fu-Kai Yang, Ting Fang, I-Wen Wu, Shih-Hao Lin
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Publication number: 20240130040Abstract: Disclosed are a conductive film and a test component. A conductive film includes a supporting layer, a circuit layer and a protective layer. The supporting layer has a first surface and a second surface opposite to the first surface. The supporting layer supports the circuit layer. The circuit layer includes a first protruding part, a second protruding part and a connecting part. The first protruding part is disposed on the first surface. The second protruding part is disposed on the second surface. The connecting part is disposed between the first protruding part and the second protruding part. The first protruding part is connected to the second protruding part through the connecting part. The protective layer covers the first protruding part. The conductive film and the test component of the disclosed embodiments may have a buffering effect or increase the service life.Type: ApplicationFiled: September 7, 2023Publication date: April 18, 2024Applicant: Innolux CorporationInventors: Ker-Yih Kao, Kuang-Ming Fan, Chia-Lin Yang, Jui-Jen Yueh, Ju-Li Wang
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Patent number: 11942367Abstract: A semiconductor device such as a fin field effect transistor and its method of manufacture are provided. In some embodiments gate spacers are formed over a semiconductor fin, and a first gate stack is formed over the fin. A first sacrificial material with a large selectivity to the gate spacers is formed over the gate stack, and a second sacrificial material with a large selectivity is formed over a source/drain contact plug. Etching processes are utilized to form openings through the first sacrificial material and through the second sacrificial material, and the openings are filled with a conductive material.Type: GrantFiled: December 7, 2020Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chan Syun David Yang, Li-Te Lin, Chun-Jui Huang
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Patent number: 11841742Abstract: The present invention provides an external module including a housing and an electronic component. One surface of the housing is provided with a through hole. The electronic component is disposed in the housing and includes a first connector, wherein the first connector is floatingly arranged in the housing and is exposed in the through hole.Type: GrantFiled: January 28, 2022Date of Patent: December 12, 2023Assignee: GETAC TECHNOLOGY CORPORATIONInventors: Tzu-Chiu Huang, Juei-Chi Chang, Jui-Lin Yang
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Publication number: 20230276596Abstract: A heat dissipation module includes a diversion case and a fan. The diversion case includes an input section, an output section, and a connecting section that connects the input section and the output section, where an angle is defined between an extending direction of the input section and an extending direction of the output section, and an end of the input section away from the connecting section and an end of the output section away from the connecting section are respectively inclined relative to the connecting section. The fan is accommodated in the connecting section. An electronic device assembly includes an expansion component and the heat dissipation module.Type: ApplicationFiled: February 6, 2023Publication date: August 31, 2023Inventors: Jui-Lin YANG, Wan-Lin HSU, Hsin-Chih CHOU, Kun-Cheng LEE, Juei-Chi CHANG
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Publication number: 20230262923Abstract: An electronic device includes: a body, including opposite outer and inner surfaces, and a through opening passing through the outer and inner surfaces; a fan, disposed on the outer surface and having an air outlet; a heat sink assembly, disposed at the air outlet and corresponding to the through opening; a first thermal tube, having one end assembled on the heat sink assembly and located on the side of the outer surface; a first heat source, disposed corresponding to the other end of the first thermal tube; a thermal plate, disposed in the body and corresponding to the through opening, having one side abutting against the heat sink assembly and the inner surface; a second thermal tube, having one end connected to the other side of the thermal plate; and a second heat source, disposed corresponding to the other end of the second thermal tube.Type: ApplicationFiled: November 4, 2022Publication date: August 17, 2023Inventors: JUI-LIN YANG, WAN-LIN HSU, HSIN-CHIH CHOU, KUN-CHENG LEE, JUEI-CHI CHANG
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Publication number: 20230262896Abstract: An electronic device assembly includes an expansion component and a host. The expansion component includes a first case, a first circuit board, and a first connector. The host includes a second case, a main circuit board, and a main connector. The first circuit board is arranged in the first case. The first connector is electrically connected to the first circuit board and is exposed from a top plate of the first case. The main circuit board is arranged in the second case. The main connector is electrically connected to the main circuit board and exposed from a second surface of the second case. When the host is assembled to the expansion component, the second surface of the second case covers the top plate of the first case, and the first connector is electrically connected to the main connector.Type: ApplicationFiled: February 6, 2023Publication date: August 17, 2023Inventors: Jui-Lin YANG, Wan-Lin HSU, Hsin-Chih CHOU, Kun-Cheng LEE, Juei-Chi CHANG
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Publication number: 20230244282Abstract: An electronic device having a detachable memory is provided with a docking connector, and includes a device body and a memory. The device body has an accommodating slot and a stopping portion provided corresponding to the accommodating slot, and the stopping portion and the accommodating slot jointly form a displacement space in between. The memory is provided with a connector and a protruding stopped portion. When the memory is accommodated in the accommodating slot, the stopped portion is moved along into the displacement space and is stopped by the stopping portion, and the connector is docked with the docking connector. Thus, the memory is provided with an anti-misplugging effect.Type: ApplicationFiled: April 10, 2023Publication date: August 3, 2023Inventors: JUI-LIN YANG, JUEI-CHI CHANG
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Patent number: 11662783Abstract: An electronic device having a detachable memory is provided with a docking connector, and includes a device body and a memory. The device body has an accommodating slot and a stopping portion provided corresponding to the accommodating slot, and the stopping portion and the accommodating slot jointly form a displacement space in between. The memory is provided with a connector and a protruding stopped portion. When the memory is accommodated in the accommodating slot, the stopped portion is moved along into the displacement space and is stopped by the stopping portion, and the connector is docked with the docking connector. Thus, the memory is provided with an anti-misplugging effect.Type: GrantFiled: May 27, 2021Date of Patent: May 30, 2023Assignee: Getac Technology CorporationInventors: Jui-Lin Yang, Juei-Chi Chang
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Patent number: 11635792Abstract: An electronic device having a detachable memory is provided with a docking connector, and includes a device body and a memory. The device body has an accommodating slot and a stopping portion provided corresponding to the accommodating slot, and the stopping portion and the accommodating slot jointly form a displacement space in between. The memory is provided with a connector and a protruding stopped portion. When the memory is accommodated in the accommodating slot, the stopped portion is moved along into the displacement space and is stopped by the stopping portion, and the connector is docked with the docking connector. Thus, the memory is provided with an anti-misplugging effect.Type: GrantFiled: May 27, 2021Date of Patent: April 25, 2023Assignee: Getac Technology CorporationInventors: Jui-Lin Yang, Juei-Chi Chang
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Publication number: 20220300037Abstract: The present invention provides an external module including a housing and an electronic component. One surface of the housing is provided with a through hole. The electronic component is disposed in the housing and includes a first connector, wherein the first connector is floatingly arranged in the housing and is exposed in the through hole.Type: ApplicationFiled: January 28, 2022Publication date: September 22, 2022Inventors: TZU-CHIU HUANG, JUEI-CHI CHANG, JUI-LIN YANG
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Publication number: 20210405699Abstract: An electronic device having a detachable memory is provided with a docking connector, and includes a device body and a memory. The device body has an accommodating slot and a stopping portion provided corresponding to the accommodating slot, and the stopping portion and the accommodating slot jointly form a displacement space in between. The memory is provided with a connector and a protruding stopped portion. When the memory is accommodated in the accommodating slot, the stopped portion is moved along into the displacement space and is stopped by the stopping portion, and the connector is docked with the docking connector. Thus, the memory is provided with an anti-misplugging effect.Type: ApplicationFiled: May 27, 2021Publication date: December 30, 2021Inventors: JUI-LIN YANG, JUEI-CHI CHANG
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Patent number: 10185360Abstract: An engaging mechanism includes a slidable engaging member, a guiding frame configured to be fixed on and protrude from a carrying surface, and a guided frame. The slidable engaging member includes a slide block, an arm disposed on the slide block and a hook portion protruding from the arm. The hook portion is covered by the guiding frame when being in a releasing position. The hook portion protrudes from one of two outer sides relative to each other of the guiding frame when being in an engaging position. When being in the releasing position, the guided frame is put on the carrying surface along a connecting direction by its two inner sides pressed against and guided by the two outer sides of the guiding frame. Then, the hook portion is moved from the releasing to the engaging position so as to be connected to the guided frame.Type: GrantFiled: November 9, 2017Date of Patent: January 22, 2019Assignee: GETAC TECHNOLOGY CORPORATIONInventor: Jui-Lin Yang
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Publication number: 20170149125Abstract: A helix antenna device includes a board, a signal output circuit on the board, a column body, a ground wire, a helix antenna, and an annular metal member. The column body includes a passage and a helix trough. A bottom surface of the column body is fastened to the board. The passage is formed along a central axis of the column body. The helix trough is around an annular side surface of the column body. The ground wire passes into the passage. The ground wire is fastened to the board and is connected to the signal output circuit. The helix antenna is around the column body. A part of the helix antenna is disposed in the helix trough. The helix antenna is fastened to the board and is electrically connected to the signal output circuit. The annular metal member is disposed on the board and surrounds the column body.Type: ApplicationFiled: November 19, 2015Publication date: May 25, 2017Inventors: Jia-Min HUANG, Jui-Lin YANG, Yen-Ching LEE
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Publication number: 20170093030Abstract: A helix antenna device includes a board, a signal output circuit, a column body, a ground wire, and a helix antenna. The signal output circuit is disposed on the board. The column body includes a passage and a helix trough. A bottom surface of the column body is fastened to the board. The passage is along a central axis of the column body. The helix trough is formed around an annular side surface of the column body. The ground wire passes into the passage. One end of the ground wire is fastened to the board and is electrically connected to the signal output circuit. The helix antenna is around the column body. A part of the helix antenna is disposed in the helix trough. One end of the helix antenna is fastened to the board and is electrically connected to the signal output circuit.Type: ApplicationFiled: September 30, 2015Publication date: March 30, 2017Inventors: Jia-Min HUANG, Yen-Ching LEE, Jui-Lin YANG
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Patent number: 9535463Abstract: A circuit board assembling structure includes a first casing, a second casing, a dam and a circuit board. The first casing has an outer edge and at least a snap-engaging element. The second casing is coupled to the first casing. The dam is mounted on the first casing. The at least a snap-engaging element is disposed between the outer edge of the first casing and the dam. The circuit board is a resilient carrier which is snap-engaged with the at least a snap-engaging element, such that the circuit board is disposed between the outer edge of the first casing and the dam. Furthermore, an electronic device having the circuit board assembling structure and an assembling method of the electronic device are further provided.Type: GrantFiled: February 13, 2014Date of Patent: January 3, 2017Assignee: Getac Technology CorporationInventor: Jui-Lin Yang
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Publication number: 20150103475Abstract: A circuit board assembling structure includes a first casing, a second casing, a dam and a circuit board. The first casing has an outer edge and at least a snap-engaging element. The second casing is coupled to the first casing. The dam is mounted on the first casing. The at least a snap-engaging element is disposed between the outer edge of the first casing and the dam. The circuit board is a resilient carrier which is snap-engaged with the at least a snap-engaging element, such that the circuit board is disposed between the outer edge of the first casing and the dam. Furthermore, an electronic device having the circuit board assembling structure and an assembling method of the electronic device are further provided.Type: ApplicationFiled: February 13, 2014Publication date: April 16, 2015Applicant: GETAC TECHNOLOGY CORPORATIONInventor: Jui-Lin YANG
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Patent number: 5949379Abstract: A microwave antenna device on PCMCIA network cards for notebook computers includes; extended base, which is connected to input port of PCMCIA network card, has pivot acceptor symmetrically located on the outer side of extended base, T-shaped pivot which is capable of 180-degree rotation about the vertical axis, is then supported by pivot acceptor. Tunnel is inside pivot and extended base, in which HF (high frequency) transmitting wire from input port passes through up to the top of pivot. Plate which is capable of 90-degree rotation in both clockwise and counter-clockwise direction is hooked up on pivot. Plate which is capable of 90-degree rotation in both clockwise and counter-clockwise direction is hooked up on pivot. Plate or bar microwave antenna is capped on pivot and connected through HF transmitting wire. In accordance with the above description, plate microwave antenna has the advantage of foldable for transportation easy to setup, receiving angle optimisable and preventing from breaking design.Type: GrantFiled: January 12, 1998Date of Patent: September 7, 1999Assignee: Alpha Telecom Inc.Inventor: Jui-Lin Yang