Abstract: An electronic includes an electronic element, an encapsulation layer surrounding the electronic element, a first circuit structure, a second circuit structure and a connecting structure. The encapsulation layer has a top surface, a bottom surface and an opening, wherein a sidewall of the opening connects the top surface and the bottom surface. The first circuit structure is disposed at the top surface of the encapsulation layer. The second circuit structure is disposed at the bottom surface of the encapsulation layer. The connecting structure is disposed in the opening, wherein the electronic element is electrically connected to the second circuit structure through the first circuit structure and the connecting structure. The connecting structure includes a first sub layer and a second sub layer, the first sub layer is located between the encapsulation layer and the second sub layer, and the first sub layer covers the sidewall of the opening.

Abstract: Provided is a wafer container including a frame having a first sidewall and a second sidewall extending along a YZ plane; a plurality of first support structures disposed on the first sidewall and arranged along a Z direction; and a plurality of second support structures disposed on the second sidewall and arranged along the Z direction. One of the plurality of first support structures is horizontally aligned with a corresponding second support structure to constitute a wafer holder. The wafer holder includes a plurality of island structures to hold a wafer in a XY plane, and the plurality of island structures are separated to each other along a X direction. A method for holding at least one wafer is also provided.

Abstract: Provided is a wafer container including a frame having a first sidewall and a second sidewall extending along a YZ plane; a plurality of first support structures disposed on the first sidewall and arranged along a Z direction; and a plurality of second support structures disposed on the second sidewall and arranged along the Z direction. One of the plurality of first support structures is horizontally aligned with a corresponding second support structure to constitute a wafer holder. The wafer holder includes a plurality of island structures to hold a wafer in a XY plane, and the plurality of island structures are separated to each other along a X direction. A method for holding at least one wafer is also provided.

Abstract: Provided is a wafer container including a frame and at least a pair of the stents. The frame has opposite sidewalls. The at least a pair of the stents is respectively disposed on the sidewalls of the frame, wherein the at least a pair of the stents is configured to provide at least three supporting points to support at least one wafer. A method for holding at least one wafer is also provided.

Abstract: Provided is a wafer container including a frame and at least a pair of the stents. The frame has opposite sidewalls. The at least a pair of the stents is respectively disposed on the sidewalls of the frame, wherein the at least a pair of the stents is configured to provide at least three supporting points to support at least one wafer. A method for holding at least one wafer is also provided.

Abstract: A power-actuated vise apparatus includes a first jaw which is disposed on a base, and a second jaw which is supported by a carrier to be movable in a longitudinal direction by an angular force in an initial course. The carrier is further pressed by a linear force in a subsequent course to bring the second jaw into tightened engagement with a workpiece against the first jaw. A servo control mechanism is disposed to drive a torque transmitting member so as to transmit a torque force. A force coupler unit is configured to couple the torque transmitting member to the carrier and to take up the torque force from the torque transmitting member to result in generation of the angular force and the linear force.

Abstract: A power-actuated vise apparatus includes a first jaw which is disposed on a base, and a second jaw which is supported by a carrier to be movable in a longitudinal direction by an angular force in an initial course. The carrier is further pressed by a linear force in a subsequent course to bring the second jaw into tightened engagement with a workpiece against the first jaw. A servo control mechanism is disposed to drive a torque transmitting member so as to transmit a torque force. A force coupler unit is configured to couple the torque transmitting member to the carrier and to take up the torque force from the torque transmitting member to result in generation of the angular force and the linear force.