Patents by Inventor Jui-Ping Hung

Jui-Ping Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMALLY EFFICIENT PACKAGING FOR A PHOTONIC DEVICE
    Publication number: 20120068218
    Abstract: The present disclosure provides a method of packaging for a photonic device, such as a light-emitting diode device. The packaging includes an insulating structure. The packaging includes first and second conductive structures that each extend through the insulating structure. A substantial area of a bottom surface of the light-emitting diode device is in direct contact with a top surface of the first conductive structure. A top surface of the light-emitting diode device is bonded to the second conductive structure through a bonding wire.
    Type: Application
    Filed: September 17, 2010
    Publication date: March 22, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hung-Pin Chang, Yung-Chi Lin, Chia-Lin Yu, Jui-Ping Hung, Chien Ling Hwang, Chen-Hua Yu