Patents by Inventor Jui-Ping Weng
Jui-Ping Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240117342Abstract: An construction method of an embryonic chromosome signal library is provided. The construction method comprises obtaining an embryo and performing whole-genome amplification and next-generation sequencing to obtain a first chromosome signal; mapping the first chromosome signal to a chromosome reference signal to obtain a second chromosome signal; dividing the second chromosome signal within a predetermined interval range to obtain a third chromosome signal; and performing a regression correction on the sequencing read count (RC) of the third chromosome signal to obtain an embryonic chromosome signal library. Furthermore, a detection method and system of embryonic chromosomes are also provided. Thereby, the information comparison of the embryo chromosome signal library is used to determine whether the pre-implantation embryo is abnormal or not to achieve pre-implantation chromosome screening of pre-implantation embryos.Type: ApplicationFiled: October 2, 2023Publication date: April 11, 2024Inventors: LI-JEN SU, SHAO-PING WENG, YU-YU YEN, LI-CHING WU, HUI-YIN CHIU, JUI-HUNG KAO
-
Patent number: 9484385Abstract: An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via hole therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via hole for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.Type: GrantFiled: November 23, 2015Date of Patent: November 1, 2016Assignee: VisEra Technologies Company LimitedInventors: Jui-Ping Weng, Jang-Cheng Hsieh, Tzu-Han Lin, Pai-Chun Peter Zung
-
Publication number: 20160079304Abstract: An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via hole therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via hole for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.Type: ApplicationFiled: November 23, 2015Publication date: March 17, 2016Inventors: Jui-Ping WENG, Jang-Cheng HSIEH, Tzu-Han LIN, Pai-Chun Peter ZUNG
-
Patent number: 9231012Abstract: An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.Type: GrantFiled: August 1, 2007Date of Patent: January 5, 2016Assignee: VISERA TECHNOLOGIES COMPANY LIMITEDInventors: Jui-Ping Weng, Jang-Cheng Hsieh, Tzu-Han Lin, Pai-Chun Peter Zung
-
Patent number: 9136442Abstract: The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.Type: GrantFiled: January 25, 2013Date of Patent: September 15, 2015Assignee: TSMC SOLID STATE LIGHTING LTD.Inventors: Jui-Ping Weng, Hsiao-Wen Lee, Chun-Chih Chang, Min-Sheng Wu, Hsin-Hsien Lee
-
Publication number: 20140209930Abstract: The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.Type: ApplicationFiled: January 25, 2013Publication date: July 31, 2014Applicant: TSMC Solid State Lighting Ltd.Inventors: Jui-Ping Weng, Hsiao-Wen Lee, Chun-Chih Chang, Min-Sheng Wu, Hsin-Hsien Lee
-
Patent number: 8153458Abstract: Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.Type: GrantFiled: March 19, 2009Date of Patent: April 10, 2012Assignee: Visera Technologies Company LimitedInventors: Jui-Ping Weng, Tzu-Han Lin, Pai-Chun Peter Zung
-
Patent number: 7994598Abstract: An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.Type: GrantFiled: October 4, 2010Date of Patent: August 9, 2011Assignee: Visera Technologies Company LimitedInventors: Jui-Ping Weng, Tzu-Han Lin
-
Patent number: 7932529Abstract: A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a transparent conductive layer coated with a fluorescent material under the molded lens. A method for fabricating the semiconductor devices is also disclosed.Type: GrantFiled: August 28, 2008Date of Patent: April 26, 2011Assignee: VisEra Technologies Company LimitedInventors: Tzu-Han Lin, Jui-Ping Weng, Tzy-Ying Lin, Kuo-Jung Fu
-
Patent number: 7928458Abstract: A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed.Type: GrantFiled: July 15, 2008Date of Patent: April 19, 2011Assignee: VisEra Technologies Company LimitedInventors: Tzu-Han Lin, Jui-Ping Weng, Shin-Chang Shiung
-
Patent number: 7928655Abstract: A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a planar top surface, a light-emitting diode (LED) chip disposed over the top surface of the semiconductor substrate, at least two isolated outer wiring layers formed through the semiconductor substrate and electrically connected to the light-emitting diode chip, serving as input terminals, a transparent encapsulating layer with a substantially planar top surface formed over the semiconductor substrate, capping the LED chip and the at least two isolated outer wiring layers, and a lens module adhered to the substantially planar top surface of the transparent encapsulating layer to cap the light-emitting diode chip. In one embodiment, the lens module includes a fluorescent layer and a lens covering or covered by the fluorescent layer.Type: GrantFiled: November 10, 2008Date of Patent: April 19, 2011Assignee: VisEra Technologies Company LimitedInventors: Tzu-Han Lin, Tzy-Ying Lin, Jui-Ping Weng, Wei-Hung Kang
-
Patent number: 7898070Abstract: The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.Type: GrantFiled: August 19, 2009Date of Patent: March 1, 2011Assignee: VisEra Technologies Company LimitedInventors: Jui-Ping Weng, Jang-Cheng Hsieh, Tzu-Han Lin, Pai-Chun Peter Zung
-
Publication number: 20110018082Abstract: An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.Type: ApplicationFiled: October 4, 2010Publication date: January 27, 2011Inventors: Jui-Ping WENG, Tzu-Han Lin
-
Patent number: 7829966Abstract: An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.Type: GrantFiled: November 23, 2007Date of Patent: November 9, 2010Assignee: VisEra Technologies Company LimitedInventors: Jui-Ping Weng, Tzu-Han Lin
-
Publication number: 20100237379Abstract: An embodiment of the invention provides a light emitting device, which includes: a first substrate made of a semiconductor material or a ceramic material; a first hole having extending direction from a first side toward an opposite second side and from a first surface toward an opposite second surface of the first substrate; a second hole having extending direction from the first side toward the second side and from the first surface toward the second surface; a light emitting element disposed overlying the first surface and having a first electrode and a second electrode; a first conducting layer overlying a first sidewall of the first hole and electrically connected to the first electrode; and a second conducting layer overlying a second sidewall of the second hole and electrically connected to the second electrode.Type: ApplicationFiled: March 19, 2009Publication date: September 23, 2010Inventors: Wu-Cheng KUO, Jui-Ping Weng, Tzu-Han Lin
-
Publication number: 20100117530Abstract: A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a planar top surface, a light-emitting diode (LED) chip disposed over the top surface of the semiconductor substrate, at least two isolated outer wiring layers formed through the semiconductor substrate and electrically connected to the light-emitting diode chip, serving as input terminals, a transparent encapsulating layer with a substantially planar top surface formed over the semiconductor substrate, capping the LED chip and the at least two isolated outer wiring layers, and a lens module adhered to the substantially planar top surface of the transparent encapsulating layer to cap the light-emitting diode chip. In one embodiment, the lens module includes a fluorescent layer and a lens covering or covered by the fluorescent layer.Type: ApplicationFiled: November 10, 2008Publication date: May 13, 2010Inventors: Tzu-Han LIN, Tzy-Ying LIN, Jui-Ping WENG, Wei-Hung Kang
-
Publication number: 20100051982Abstract: A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a transparent conductive layer coated with a fluorescent material under the molded lens. A method for fabricating the semiconductor devices is also disclosed.Type: ApplicationFiled: August 28, 2008Publication date: March 4, 2010Inventors: Tzu-Han Lin, Jui-Ping Weng, Tzy-Ying Lin, Kuo-Jung Fu
-
Publication number: 20100012957Abstract: A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed.Type: ApplicationFiled: July 15, 2008Publication date: January 21, 2010Inventors: Tzu-Han LIN, Jui-Ping Weng, Shin-Chang Shiung
-
Publication number: 20090309178Abstract: The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.Type: ApplicationFiled: August 19, 2009Publication date: December 17, 2009Inventors: Jui-Ping Weng, Jang-Cheng Hsieh, Tzu-Han Lin, Pai-Chun Peter Zung
-
Patent number: 7595220Abstract: The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.Type: GrantFiled: June 29, 2007Date of Patent: September 29, 2009Assignee: VisEra Technologies Company LimitedInventors: Jui-Ping Weng, Jang-Cheng Hsieh, Tzu-Han Lin, Pai-Chun Peter Zung