Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.

Abstract: A method of performing automatic tuning on a deep learning model includes: utilizing an instruction-based learned cost model to estimate a first type of operational performance metrics based on a tuned configuration of layer fusion and tensor tiling; utilizing statistical data gathered during a compilation process of the deep learning model to determine a second type of operational performance metrics based on the tuned configuration of layer fusion and tensor tiling; performing an auto-tuning process to obtain a plurality of optimal configurations based on the first type of operational performance metrics and the second type of operational performance metrics; and configure the deep learning model according to one of the plurality of optimal configurations.

Abstract: An optical fiber end securing structure and a method of securing an optical fiber end are introduced. The optical fiber end securing structure includes a stub component, a substrate and an adhesive component. The stub component is cylindrical. The stub component has axially a through hole for receiving an optical fiber. The substrate has a securing groove. Two walls of the securing groove extend in the axial direction of the stub component. The distance between the two walls is less than the diameter of the stub component in the radial direction. The outer circumferential surface of the stub component is in linear contact with apexes of the two walls. The adhesive component fills the securing groove and connects the securing groove and the stub component. Therefore, the optical fiber end securing structure and the method of securing an optical fiber end enable the optical fiber to undergo high-precision engagement.

Abstract: A terminal portion structure of an optical transmission element includes a light guiding component, glass protection layer and convex lens. The light guiding component includes a core and a cladding enclosing the core. The cladding is of a lower refractive index than the core, allowing light signals to be transmitted in the light guiding component by total internal reflection. The glass protection layer covers at least a terminal portion of the light guiding component. The convex lens is disposed on one side of the glass protection layer. The cross section of the terminal portion of the light guiding component tilts relative to the axial direction of the light guiding component. The optical axis of the convex lens is perpendicular to the axial direction of the light guiding component. The focal point of the convex lens is located at the cross section of the terminal portion of the core.

Abstract: An electronic device comprises a housing, a pillar and a fixing unit. The housing comprises a side-wall, an opening and a first positioning portion, wherein the opening is formed on the side-wall, and the first positioning portion is disposed in the housing corresponding to the side-wall. The fixing unit comprises an arm, and a second positioning portion, wherein the pillar is disposed on the arm, the second positioning portion is disposed on an end of the arm, the pillar is inserted into the opening to prevent the fixing unit from moving in a first direction and a second direction, the first direction perpendicular to the second direction, and when the fixing unit is in a fixing orientation, the second positioning portion contacts the first positioning portion, the first positioning portion prevents the fixing unit from moving in a third direction perpendicular to the first and second directions.

Abstract: A locking device for locking a removable module on an electronic device is provided. The locking device has a switch, a base and an elastic component. When the base is located in a locked position, the base can prevent the removable module from separating from the electronic device. When the base is located in an unlocked position, the removable module and the electronic device can be separated. The elastic component provides a recovery force when the base is moved from the lock position. The base can be held in the unlocked position when the removable module is installed on the electronic device and the base is moved from the locked position to the unlocked position.

Abstract: A locking device for locking a removable module on an electronic device is provided. The locking device has a switch, a base and an elastic component. When the base is located in a locked position, the base can prevent the removable module from separating from the electronic device. When the base is located in an unlocked position, the removable module and the electronic device can be separated. The elastic component provides a recovery force when the base is moved from the lock position. The base can be held in the unlocked position when the removable module is installed on the electronic device and the base is moved from the locked position to the unlocked position.

Abstract: An electronic device comprises a housing, a pillar and a fixing unit. The housing comprises a side-wall, an opening and a first positioning portion, wherein the opening is formed on the side-wall, and the first positioning portion is disposed in the housing corresponding to the side-wall. The fixing unit comprises an arm, and a second positioning portion, wherein the pillar is disposed on the arm, the second positioning portion is disposed on an end of the arm, the pillar is inserted into the opening to prevent the fixing unit from moving in a first direction and a second direction, the first direction perpendicular to the second direction, and when the fixing unit is in a fixing orientation, the second positioning portion contacts the first positioning portion, the first positioning portion prevents the fixing unit from moving in a third direction perpendicular to the first and second directions.

Abstract: A novel method for fabricating leadless solder for IC packaging includes the following steps: A. to prepare a mixture containing Zn, 7-11 wt %; Co, 0.1-0.5 wt %; and Sn for balance; or a mixture containing Zn, 7-11 wt %; Co, 0.1-0.5 wt %; P, 0.005-0.05 wt % and Sn for balance; or a mixture containing Zn, 7-11 wt %; Al, 0.1-0.5 wt %; and Sn for balance; a mixture containing Zn, 7-11 wt %; Al, 0.1-0.5 wt %; P, 0.005-0.05 wt % and Sn for balance; or a mixture containing In, 10-15 wt %; Co, 0.1-0.5 wt % and Sn for balance; B. to place the mixture in a high frequency furnace to be melted together at a temperature lower than 350° C., then take it out of the furnace for a quick freezing and cast it into an ingot in an adequate size; C. to treat the ingot with a homogenization processing at 180-240° C. for 30-240 minutes; D. to draw the homogenized ingot into the form of leadless solder filament or granule.