Abstract: An illuminating device includes a receiving base and at least one light source. The receiving base has at least one receiving space defined therein, and at least one fixing post is positioned adjacent to the corresponding at least one receiving space. The at least one light source is positioned in the at least one receiving space for emitting light. Each light source comprises a light-pervious plate and a LED array located on a side of the light-pervious plate. The light-pervious plate comprises at least one first through hole with the at least one fixing post extending therethrough, the light-pervious plate is fixed to the receiving base in the corresponding receiving space of the receiving base.

Abstract: A light emitting diode illuminator includes at least one light source, a receiving seat and a power source arranged on the receiving seat for supplying currents to the at least one light source for causing the at least one light source emitting light. The receiving seat includes a panel and a back plate assembled to the panel. At least one receiving chamber is defined between the panel and the back plate. The receiving chamber defines an opening at a lateral side of the receiving seat. The at least one light source is mounted into the at least one receiving chamber via the opening of the receiving chamber. A block extends outwardly from the back plate to the opening of the receiving chamber to prevent the at least one light source from falling out from the at least one receiving chamber of the receiving seat.

Abstract: A light emitting diode (LED) illumination device (10) includes an LED (11), a frustum-shaped light guide member (12) and a light diffusing plate (13). The frustum-shaped light guide member (12) has a light input surface (120) and a light output surface (122) opposite to the light input surface (120). The light guide member (12) tapers from the light output surface (122) to the light input surface (120). The light input surface (120) is optically coupled to the LED (11), and the light diffusing plate (13) is optically coupled to the light output surface (122) of the light guide member (12).

Abstract: An illuminating device includes a receiving base and at least one light source. The receiving base has at least one receiving space defined therein, and at least one fixing post is positioned adjacent to the corresponding at least one receiving space. The at least one light source is positioned in the at least one receiving space for emitting light. Each light source comprises a light-pervious plate and a LED array located on a side of the light-pervious plate. The light-pervious plate comprises at least one first through hole with the at least one fixing post extending therethrough, the light-pervious plate is fixed to the receiving base in the corresponding receiving space of the receiving base.

Abstract: An illumination device includes a light emitting module (20) and a mounting housing (10) for receiving the light emitting module therein. The light emitting module includes a light guide plate (21) and a light source (23) optically coupled to the light guide plate. The mounting housing includes a top plate (12), a mounting plate (14) and a side plate (16) interconnected between the top plate and the mounting plate. A receiving space (15) is cooperatively formed by the top plate, the mounting plate and the side plate of the mounting housing for receiving the light guide plate therein. A gap (120) is defined in the top plate above the light emitting module. An opening (160) is defined in one end of the side plate for allowing the light emitting module to insert into the receiving space.

Abstract: A light emitting diode illuminator includes at least one light source, a receiving seat and a power source arranged on the receiving seat for supplying currents to the at least one light source for causing the at least one light source emitting light. The receiving seat includes a panel and a back plate assembled to the panel. At least one receiving chamber is defined between the panel and the back plate. The receiving chamber defines an opening at a lateral side of the receiving seat. The at least one light source is mounted into the at least one receiving chamber via the opening of the receiving chamber. A block extends outwardly from the back plate to the opening of the receiving chamber to prevent the at least one light source from falling out from the at least one receiving chamber of the receiving seat.

Abstract: A light emitting diode (LED) illumination device (10) includes an LED (11), a frustum-shaped light guide member (12) and a light diffusing plate (13). The frustum-shaped light guide member (12) has a light input surface (120) and a light output surface (122) opposite to the light input surface (120). The light guide member (12) tapers from the light output surface (122) to the light input surface (120). The light input surface (120) is optically coupled to the LED (11), and the light diffusing plate (13) is optically coupled to the light output surface (122) of the light guide member (12).

Abstract: An exemplary method for laser machining is provided comprising: providing a workpiece, the workpiece including a predetermined machining region; loading the workpiece onto a laser machining station, the laser machining station being configured for providing an initial ambient temperature for the workpiece; heating the machining region of the workpiece up to a predetermined temperature between the initial ambient temperature and a melting temperature of a material of the workpiece; and machining the machining region with at least one laser beam. An exemplary apparatus for laser machining is also provided.

Abstract: A method for processing a brittle substrate includes first providing a brittle substrate having a substrate surface. Then applying a first laser beam onto the brittle substrate surface to form a pre-cut groove in the brittle substrate, the first laser beam being generated by a solid-state laser device. A second laser beam is then applied onto the brittle substrate surface along the precut groove to heat the brittle substrate, the second laser beam being generated by a gas laser device. Finally, a coolant is applied onto the brittle substrate along the pre-cut groove so as to cause formation of a through crack in the brittle substrate. The first laser beam can be generated by a solid-state laser device, the first laser beam should be of narrow diameter and high energy density, so the first laser beam can form a pre-cut groove rapidly and accurately without generation of micro-cracks, in addition, the pre-cut groove should have a better uniformity and linearity.