Abstract: An exemplary heat dissipation device includes a bracket, and heat sink and a pressing member. The bracket includes a bottom plate. An opening is defined in the bottom plate. Two supporting portions are formed from an underside of the bottom plate. The heat sink extends through the opening of the bracket, with bottom edges of the heat sink rested on the supporting portions. The pressing member is mounted on the bracket and elastically presses the heat sink onto the supporting portions.

Abstract: A heat dissipation module includes a plurality of fins. Each fin includes a main body, a bottom bending plate bending from a bottom edge of the main body, a top bending plate bending from a top edge of the main body, and a slick flange folding inwards from an outer edge of the main body. The flange overlaps the main body at the outer edge of a corresponding fin. The present disclosure also relates to an LED illumination device using the heat dissipation module.

Abstract: An exemplary can heating and cooling device includes a container made of thermally conductive material, a heat spreader with a heat spreading portion and a heat exchanging portion, and a heat exchanger with a thermoelectric cooling chip and a heat sink. The container includes an outer side wall with a planar thermal contacting section of the container. The heat spreading portion of the heat spreader contacts the outer side wall of the container. The heat exchanging portion of the heat spreader contacts the planar thermal contacting section of the container. The thermoelectric cooling chip includes a first surface thermally connected with the heat exchanging portion of the heat spreader, and a second surface thermally connected with the heat sink.

Abstract: An LED lamp includes a heat sink, a reflecting cup, a heat pipe and an LED. The heat sink includes fins cooperatively defining a receiving space therein. Each of the fins includes a plate-shaped main body and a flange extending rearward from a periphery side of the main body. The flanges are connected to each other to cooperatively form an annular supporting surface. The reflecting cup is received in the receiving space of the heat sink. The heat pipe includes an evaporating section located above the reflecting cup and a condensing section thermally connecting with the annular supporting surface of the heat sink. The LED is directly mounted on the evaporating section with a light emitting surface facing downwardly towards the reflecting cup.

Abstract: A heat dissipation module includes a centrifugal fan, a fin group, a first heat pipe and a second heat pipe. The centrifugal fan includes a housing and an impeller rotatably mounted in the housing. The housing defines an air inlet and an air outlet therein. The fin group is disposed at the air outlet of the centrifugal fan. The fin group includes a plurality of spaced fins. The first heat pipe includes a condensing section thermally contacting the fin group and an evaporating section for thermally contacting a heat source. The second heat pipe includes a condensing section thermally contacting the condensing section of the first heat pipe and an evaporating section for thermally contacting another heat source.

Abstract: An LED lamp includes a heat sink, a heat pipe and an LED. The heat sink includes a connecting core and fins mounted around the connecting core. Each of the fins includes a plate-shaped main body and a flange extending perpendicularly from a periphery side of the main body. The flanges of the fins cooperatively form an annular planar top surface of the heat sink. The heat pipe includes a condensing section, an evaporating section parallel to and higher than the condensing section and an adiabatic section connected between the condensing section and the evaporating section. The condensing section is fixed to and thermally connects with the top surface of the heat sink. The LED is directly mounted on the evaporating section with a light emitting surface thereof facing outwardly.

Abstract: An LED lamp includes a heat sink, a reflecting cup, a heat pipe and an LED. The heat sink includes fins cooperatively defining a receiving space therein. Each of the fins includes a plate-shaped main body and a flange extending rearward from a periphery side of the main body. The flanges are connected to each other to cooperatively form an annular supporting surface. The reflecting cup is received in the receiving space of the heat sink. The heat pipe includes an evaporating section located above the reflecting cup and a condensing section thermally connecting with the annular supporting surface of the heat sink. The LED is directly mounted on the evaporating section with a light emitting surface facing downwardly towards the reflecting cup.

Abstract: A lamp includes a heat sink and a lamp cover mounted on the heat sink. The lamp cover includes a connecting portion. The heat sink includes a plurality of clamping portions. The plurality of clamping portions surrounds the lamp cover and is spaced apart from each other along a circumferential direction. The plurality of clamping portions each defines a recess facing the lamp cover. The recesses communicate with each other along the circumferential direction whereby an annular engaging groove is defined in the heat sink by the recesses. The connecting portion is engaged in the engaging groove whereby the lamp cover is connected with the heat sink.

Abstract: A heat dissipation module includes a centrifugal fan, a fin group, a first heat pipe and a second heat pipe. The centrifugal fan includes a housing and an impeller rotatably mounted in the housing. The housing defines an air inlet and an air outlet therein. The fin group is disposed at the air outlet of the centrifugal fan. The fin group includes a plurality of spaced fins. The first heat pipe includes a condensing section thermally contacting the fin group and an evaporating section for thermally contacting a heat source. The second heat pipe includes a condensing section thermally contacting the condensing section of the first heat pipe and an evaporating section for thermally contacting another heat source.

Abstract: An electronic device includes a circuit board and a thermal module mounted thereon. The circuit board has a heat-generating chip and an electromagnetic interference (EMI) source mounted thereon. The thermal module includes a shielding cover and a heat conducting member. The shielding cover is heat-conductive and electrically-conductive material, and defines a cavity therein. The shielding cover encloses the EMI source in the cavity for EMI shielding. The heat conducting member has one end thermally connecting with the shielding cover and another end thermally connecting with the heat-generating chip for transferring heat from the heat-generating chip to the shielding cover.

Abstract: A centrifugal blower (10) includes a casing (12) and a rotor (14) rotatable disposed in the casing. The casing includes a base plate (121), a sidewall (122) extending from the base plate and a cover (123) covering the sidewall. The sidewall is a multilayer structure and includes a first section (128a) and a second section (128c). A distance between a central axis (A) of the rotor and an inner surface of the second section is greater than that between the central axis of the rotor and an inner surface of the first section. The first section is located below a mother board (20) and the second section sits on a top surface of the motherboard when the centrifugal blower is mounted to the mother board.

Abstract: A thermal module includes a centrifugal blower (10), a heat sink (20) mounted to an air outlet (11) of the centrifugal blower, a heat pipe (40) connecting the heat sink with a heat generating electronic component, and a resilient clip (80) for mounting the heat pipe onto the heat generating electronic component. The resilient clip includes an M-shaped pressing portion (82) disposed above an evaporation section (44) of the heat pipe, a plate portion (83) disposed at one end of the pressing portion for being fixed to a sidewall (53d), and an abutting portion (85) disposed at the other end of the pressing portion and including an abutting plate (85b) for abutting against a bottom surface of another sidewall (53b).

Abstract: A heat dissipation device includes a fin unit, a fan and a fan duct. The fin unit includes a plurality of fins stacked together. An airflow channel is defined between each two neighboring fins. The fan includes an air inlet and an opposite air outlet. The fan duct communicates the airflow channels of the fin unit and the fan. The fan duct includes a first flue connected to the air inlet of the fan and a second flue connected to the fin unit. The second flue includes a first side plate and a second side plate covering on two neighboring sides of the fin unit, respectively.

Abstract: An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis.

Abstract: A portable electronic device includes a housing receiving a heat generating electrical component therein, a display unit and a heat dissipating hinge pivotably interconnecting the housing and the display unit. The heat dissipating hinge includes a body, a cover, a first heat pipe and a second heat pipe. A body defines a first receiving groove receiving a condenser section of the second heat pipe therein. The cover and the body cooperatively define a receiving channel receiving the evaporator section of the first heat pipe therein. Heat generated by the electric device is transferred from the heat generating electronic component to the display unit through the heat dissipating hinge. First and second supporting members are secured to two ends of the evaporator section of the first heat pipe to prevent leakage of thermal grease from a middle portion of the receiving channel.

Abstract: An exemplary method for manufacturing a heat pipe includes the following steps: providing a tube, a mandrel and an artery pipe, the tube defining an opening at one end thereof, a wick structure being positioned on an inner surface of the tube, a slot being defined in an outer surface of the mandrel; inserting the mandrel and the artery pipe into the tube via the opening, the artery pipe being received in the slot; baking the tube with the mandrel and the artery pipe to make the artery pipe join the wick structure; drawing the mandrel out of the tube via the opening; and injecting a working media into the tube, and evacuating and sealing the tube.

Abstract: A portable electronic device includes a main body and a centrifugal fan. The main body includes a bottom wall, an opposite top wall and a side wall connecting the top wall with the bottom wall. The bottom wall, the top wall and the side wall cooperatively define a space in the main body. A groove is defined in the top wall for communicating the space with an outside environment of the main body. The top wall is provided with an active cover plate corresponding to the groove. The cover plate is capable of moving upwardly relative to the top wall to define an air intake between the cover plate and the top wall. A centrifugal fan is received in the space of the main body. The centrifugal fan sucks air into the space from the outside environment via the air intake and the groove.

Abstract: A thermal module comprises a cooling fan, a heat pipe and a fin assembly. The cooling fan defines an air outlet therein. The fin assembly is mounted at the air outlet of the cooling fan. The heat pipe comprises an evaporating section attached to the cooling fan and a condensing section attached to the fin assembly. The evaporating section of the heat pipe is wholly located within an inner space of the cooling fan.

Abstract: An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component.

Abstract: A thermal module (10) includes a fin assembly (14), a heat pipe (16) thermally contacting with a heat generating electronic component (60) disposed on a printed circuit board (50) and the fin assembly, and a resilient fastener (20) attaching an evaporation section (164) of the heat pipe to the heat generating electronic component. The fastener includes a mounting element (40) being attached to the printed circuit board, and an engaging element (30) embedded in the mounting element. The engaging element includes a base plate (32) having a first surface contacting with the evaporation section of the heat pipe and a second surface thermally contacting with the heat generating electronic component, and at least a resilient strip (34) sandwiched between the first surface of the base plate of the engaging element and the mounting element.