Patents by Inventor Jui-Yi Chen
Jui-Yi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240168526Abstract: A body structure of a portable computer including a case, a keyboard module, a touch pad module, and a cover. The case has an inner surface and an exterior surface opposite to each other, and the exterior surface is exposed to an outer environment. The case further has a first receiving opening, a second receiving opening, and a rib structure separating the first and the second receiving openings. The keyboard module is assembled to the second receiving opening from the exterior surface and locked at the rib structure. The touch pad module is assembled to the first receiving opening from the exterior surface and locked at the rib structure. The cover is assembled to the case and covers the rib structure.Type: ApplicationFiled: July 19, 2023Publication date: May 23, 2024Applicant: Acer IncorporatedInventors: Hui-Ping Sun, Jui-Yi Yu, Chun-Hung Wen, Yen-Chou Chueh, Chun-Hsien Chen
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Publication number: 20240111330Abstract: A foldable electronic device is provided, including a first body, a second body, a supporting member, a first hinge connecting the first body and the supporting member, a second hinge connecting the supporting member and the second body, and a gravity-type latch movably disposed in the supporting member. The first body and the supporting member are rotated relatively to be folded or unfolded via the first hinge, and the second body and the supporting member are rotated relatively to be folded or unfolded via the second hinge. In a transforming process of the first body folding to the supporting member and together unfolding relative to the second body, the gravity-type latch is latched onto the first body once the unfolding angle is less than a predetermined value, and the gravity-type latch is de-latched from the first body once the unfolding angle is equal to or greater than the predetermined value.Type: ApplicationFiled: May 4, 2023Publication date: April 4, 2024Applicant: Acer IncorporatedInventors: Jui-Yi Yu, Chun-Hsien Chen, Hui-Ping Sun, Chun-Hung Wen, Yen-Chou Chueh
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Publication number: 20240111339Abstract: A cabling structure of a foldable electronic device includes a first body, a second body, a hinge module connecting the first body and the second body, a sliding member movably disposed in the second body, a flexible electrical connecting member connected to the first body, the second body, and the sliding member and being driven when the first body and the second body are rotated relatively, and a restoring module disposed in the second body and providing a force to the sliding member. The first body and the second body are rotated relatively to each other through the hinge module. When being rotated relatively to each other, the first body and the second body drive the flexible electrical connecting member and the sliding member. The restoring module restores the sliding member and the flexible electrical connecting member via the force.Type: ApplicationFiled: May 8, 2023Publication date: April 4, 2024Applicant: Acer IncorporatedInventors: Hui-Ping Sun, Jui-Yi Yu, Chun-Hung Wen, Yen-Chou Chueh, Chun-Hsien Chen
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Patent number: 11942425Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a semiconductor substrate, a contact structure, a first conductive element, and a first dielectric spacer structure. The semiconductor substrate includes an active region and an isolation structure. The contact structure is on the active region of the semiconductor substrate. The first conductive element is on the isolation structure of the semiconductor substrate. The first dielectric spacer structure is between the contact structure and the first to conductive element. The first dielectric spacer structure has a first concave surface facing the first conductive element.Type: GrantFiled: April 19, 2022Date of Patent: March 26, 2024Assignee: NANYA TECHNOLOGY CORPORATIONInventors: Chih-Ying Tsai, Jui-Seng Wang, Yi-Yi Chen
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Patent number: 11940737Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.Type: GrantFiled: May 7, 2021Date of Patent: March 26, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu, Wei-Ti Hsu, Jui-Ping Chuang, Tzong-Sheng Chang, Kuei-Shun Chen, Meng-Wei Chen
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Publication number: 20240098932Abstract: A foldable electronic device, including a first body, a second body, an air valve movably disposed in the first body, at least one triggering member, and a hinge connecting the first body and the second body, is provided. The first body has multiple openings respectively located at two opposite surfaces. The triggering member is movably disposed in the first body and has a part exposed outside the first body. The air valve and the triggering member are mutually on moving paths of each other. The first body and the second body are rotated to be folded or unfolded relative to each other by the hinge. A part of the triggering member is suitable for bearing a force such that the triggering member drives the air valve, so that the air valve opens or closes the openings.Type: ApplicationFiled: July 19, 2023Publication date: March 21, 2024Applicant: Acer IncorporatedInventors: Hui-Ping Sun, Jui-Yi Yu, Chun-Hung Wen, Yen-Chou Chueh, Yu-Ming Lin, Chun-Hsien Chen
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Publication number: 20240090310Abstract: A compound comprising a first ligand LA of Formula I, is provided. In Formula I, moiety A is a 5-membered or 6-membered ring; moiety B is a fused ring structure comprising at least four rings; K is a direct bond, O, or S; each of Z1 and Z2 is independently C or N; each RA and RB is independently hydrogen or a General Substituent; at least one RB comprises a cyclic group or an electron-withdrawing group; LA is coordinated to a metal M that has an atomic mass of at least 40 and is optionally coordinated to other ligands; and the ligand LA is optionally linked with other ligands. Formulations, OLEDs, and consumer products including the compound are also provided.Type: ApplicationFiled: April 10, 2023Publication date: March 14, 2024Applicant: UNIVERSAL DISPLAY CORPORATIONInventors: Jui-Yi TSAI, Alexey Borisovich DYATKIN, Walter YEAGER, Pierre-Luc T. BOUDREAULT, Hsiao-Fan CHEN, Wei-Chun SHIH
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Publication number: 20240083928Abstract: A compound comprising a bidentate ligand LA, comprising a moiety W is disclosed. W is a cyclic structure including three or more aromatic moieties joined to each other by direct bonds, wherein W can be substituted. Ligand LA is coordinated to a metal M, and can be joined with other ligands to form a tridentate, tetradentate, pentadentate, or hexadentate ligand. The compound does not form part of an interlocked compound. Formulations, OLEDs, and consumer products containing the compound are also provided.Type: ApplicationFiled: July 27, 2022Publication date: March 14, 2024Applicant: Universal Display CorporationInventors: Alexey Borisovich DYATKIN, Jui-Yi TSAI, Zhiqiang JI, Hsiao-Fan CHEN
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Publication number: 20240081014Abstract: In some examples, a device can include a locking mechanism to couple the device to a computing device enclosure, a first portion at a first level to interact with a processor back-plate, and a second portion at a second level to interact with an area proximate to the processor back-plate, wherein the second portion protrudes to the second level toward the processor back-plate when the device is coupled to the computing device enclosure.Type: ApplicationFiled: January 29, 2021Publication date: March 7, 2024Applicant: Hewlett-Packard Development Company, L.P.Inventors: Fu-Yi Chen, Jui-Ming Chien
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Publication number: 20230167403Abstract: Microfluidic devices and methods for co-encapsulation of a cell and a controlled release particle in one droplet are escribed herein. The devices and methods utilize laminar flow, high shear liquid-liquid interfaces, hydrodynamic vortices, and/or acoustic focusing to increase co-encapsulation efficiency. The precise variation of the droplets microenvironment is enabled by the controlled release particle co-encapsulated with the single cell in each droplet. This capability, coupled with established detection methods, provides an important tool for precise, single cell analysis.Type: ApplicationFiled: May 4, 2021Publication date: June 1, 2023Inventors: Abraham P. Lee, Gisela Lin, Yue Yun, Elizabeth Chatt, Marzieh Ataei, Jui-Yi Chen