Abstract: A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.

Abstract: An electronic device with a heat-dissipation structure is disclosed. The electronic device comprises a housing, a printed circuit board assembly, and a heat sink. The printed circuit board assembly is disposed in an interior of the housing, and the printed circuit board assembly forms a high-temperatured heat flow area and a low-temperatured heat flow area in the electronic device. The heat sink is disposed between the printed circuit board assembly and the housing and in the low-temperatured heat flow area for balancing heat flow and homogenizing temperature of the electronic device to enhance heat-dissipation efficiency.

Abstract: A heat-dissipating fan module of an electronic apparatus is disclosed. The heat-dissipating fan module includes a casing having an opening, the opening having a guiding device along an edge thereof, and a heat-dissipating fan fixed to one side of the casing and correspondingly disposed on the opening.

Abstract: A heat-dispersing module of an electronic device is disclosed.

Abstract: A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.

Abstract: A heat-dispersing module of an electronic device is disclosed.

Abstract: A heat-dissipating fan module of an electronic apparatus is disclosed. The heat-dissipating fan module includes a casing having an opening, the opening having a guiding device along an edge thereof, and a heat-dissipating fan fixed to one side of the casing and correspondingly disposed on the opening.

Abstract: A joint structure of electronic element for linking circuit board and electronic element is provided. The joint structure of an electronic element for being electrically connected to a circuit board has at least one slot positioned thereon. And, the joint structure of the electronic element includes: at least one terminal which has a curved portion including a deflected angle with a normal line of a plane of the circuit board, wherein when the joint structure of the electronic element is connected with the slot, the terminal produces an elastic stress through suffering a jostle from the slot so as to urge against the slot for forming an electrical connection therebetween.

Abstract: A waterproof and heat-dissipating structure of an electronic apparatus including a circuit board, an input element and an output element is disclosed. The structure includes an aluminum-wrapped housing having at least four adjoining surfaces for defining a space, a first opening end and a second opening end, wherein the space is used for accommodating the circuit board, a first lateral plate fixed to the aluminum-wrapped housing, covering the first opening end and having a first hole for fixing the input element therein, and a second lateral plate fixed to the aluminum-wrapped housing, covering the second opening end and having a second hole for fixing the output element therein.

Abstract: A waterproof and heat-dissipating structure of an electronic apparatus including a circuit board, an input element and an output element is disclosed. The structure includes an aluminum-wrapped housing having at least four adjoining surfaces for defining a space, a first opening end and a second opening end, wherein the space is used for accommodating the circuit board, a first lateral plate fixed to the aluminum-wrapped housing, covering the first opening end and having a first hole for fixing the input element therein, and a second lateral plate fixed to the aluminum-wrapped housing, covering the second opening end and having a second hole for fixing the output element therein.

Abstract: A composite heat sink with high density fins and a method for assembling the composite heat sink are disclosed. The composite heat sink includes a base and a plurality of fins detachably connected to each other, wherein each fin includes a plate and a bottom perpendicularly extended from a first end of the plate. Furthermore, each bottom of the fin is disposed on a surface of the base.

Abstract: A connector for connecting a first device with a second device through a combination thereof with a flat cable of the second device is disclosed. The connector includes a connecting head for receiving the flat cable therefrom; and an auxiliary device, located outside the connecting head for being exerted thereon a first directional force to clamp the flat cable in the connecting head, and a second directional force to release the flat cable from the connecting head. By providing such an auxiliary device to facilitate the clamping of the flat cable in the connecting head, the connector can be in good mechanical and electronic connection with a flat cable.

Abstract: The present invention discloses a power supply system with modularized and integrated cable interface configuration for providing power from an external power source to a plurality of subsystems in a personal computer. The power supply system includes a power cable for connecting the power supply system to the external power source. The power supply system further includes an output (O/P) cable having a first end and second end, the O/P cable including a plurality of cable groups wherein each of the cable groups including a subsystem plug module on the first end for connecting to a corresponding PC subsystems. The power supply system further includes an integrated PC receptive module for providing an interface with the O/P cable. The O/P cable further including an integrated O/P cable plug module on the second end for plugging the O/P cable into the integrated receptive module, wherein the integrated O/P plug module being in electric connection to each of the cable groups.