Abstract: A furandicarboxylate polymer has a character index that ranges from 0.27 to 0.55 and that is calculated using the following Equation: Character index=[(AC1×Mn1÷(2×106)], where AC1 represents an acid value of the furandicarboxylate polymer, and Mn1 represents a number average molecular weight of the furandicarboxylate polymer.

Abstract: A polyester composition includes a polyester, a copolyester-ether, a styrene-butadiene copolymer, and a catalyst. The styrene-butadiene copolymer includes a butadiene monomer unit which is in an amount ranging from 12 wt % to 50 wt % based on a total weight of the styrene-butadiene copolymer. The styrene-butadiene copolymer is in an amount ranging from 0.2 to 4 parts by weight based on 100 parts by weight of the polyester.

Abstract: Disclosed are methods and substrates suitable for flip-chip assembly. Underfill processing used to produce the substrates provides for lead-free, eutectic solder, and other alloy reflow based flip-chip interconnects for 10-20 ?m peripheral and area array I/O pitch. The methods and substrates utilize underfill materials with tailored properties along with a variety of patterning techniques to produce openings in underfill material disposed on the substrates that are used as an alignment guide for flip-chip attachment to the substrates.

Abstract: A method for controlling the bond microstructures is disclosed. A Sn layer and an Au layer are sequentially formed on the two members that are to be jointed. The weight ratio of Sn/Au is 20:80 having a variation range about ±3-4%. Next, the Sn layer and the Au layer are treated with a first temperature or a second temperature so that the Sn layer and the Au layer react to form a bond microstructure connecting two members. When the Sn layer and the Au layer are treated with the first temperature, the bond microstructure will have a layered structure. When the Sn layer and the Au layer are treated with the second temperature, the bond microstructure will have an eutectic structure. Therefore, the bond microstructures can be manufactured with a diferent of characteristics by treating with a different of temperatures for suiting various industrial applications.