Abstract: To eliminate such shortcomings in the prior art that a large-scale semiconductor facility is required, large-sized wiring cannot be produced, and wiring for connection between substrates cannot be formed. Also, to eliminate such shortcomings in a method of using optical fibers for wiring that the wiring is unstable, requires a larger space, and gives rise to a difficulty in management regarding how the optical fibers are connected when the number of optical fibers increases. Further, to eliminate such shortcomings in another method of holding and fixing an optical fiber between polymer sheets that wiring cannot be formed on a plate connecting substrates.

Abstract: To eliminate such shortcomings in the prior art that a large-scale semiconductor facility is required, large-sized wiring cannot be produced, and wiring for connection between substrates cannot be formed. Also, to eliminate such shortcomings in a method of using optical fibers for wiring that the wiring is unstable, requires a larger space, and gives rise to a difficulty in management regarding how the optical fibers are connected when the number of optical fibers increases. Further, to eliminate such shortcomings in another method of holding and fixing an optical fiber between polymer sheets that wiring cannot be formed on a plate connecting substrates.