Abstract: A MEMS component package comprises a body having outer surfaces of non-conductive material and a plurality of conducting leads protruding therefrom. A solder pad is applied on a blind pad exposed on a PCB surface while applying solder paste. The blind pad is collocated with an intended location of the body, and the solder pad is collocated with the blind pad. The package is placed on the PCB surface, joining the leads to the pin pads of the PCB with solder paste. The PCB is heated to melt the paste. This couples the leads to the pin pads, and melts the solder pad. The melting transforms the solder pad into a solder bump configured to couple the body to the at least one blind pad. The solder bump attaches with a non-galvanic contact directly to the non-conductive plastic bottom of the body.

Abstract: A method for processing milk, comprising the steps of: providing skim milk; separating the skim milk to provide two or more fractions; providing a part or all of the two or more fractions into at least two compositions; subjecting the at least two compositions to at least one microbial load reduction treatment, wherein the at least one microbial load reduction treatment is different for each composition, is disclosed. Also, a method for producing a milk product, wherein the milk product is composed at least from the two differently treated compositions is disclosed.