Abstract: A method of managing configuration of user equipment that has a configuration database modifiable with configuration data in a first format, and a communications unit for receiving configuration data in a second format is described. The method comprises storing a user agent at the user equipment; providing received configuration data in the second format to the user agent; using the user agent to transform the configuration data into the first format in the user equipment; and modifying the configuration database with the configuration data in the first format.

Abstract: A method of managing configuration of user equipment that has a configuration database modifiable with configuration data in a first format, and a communications unit for receiving configuration data in a second format is described. The method comprises storing a user agent at the user equipment; providing received configuration data in the second format to the user agent; using the user agent to transform the configuration data into the first format in the user equipment; and modifying the configuration database with the configuration data in the first format.

Abstract: Low power consumption display devices are disclosed. Phoactive layers are utilized that both respond to electrical energy to allow a display device to display information and that generate electrical energy in response to incident radiation. Display pixels of a single display device may be divided displaying and generating pixels. The displaying pixels may display information and the generating pixels may generate electrical energy. The generated electrical energy may be used to provide power to drive an image.

Abstract: A method is provided for manufacturing an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The method includes laminating a plurality of structural and/or protective layers interspersed with electronically functional layers or electronic components in communication with the multimedia device to form a supportive and electronically functional layer, cover, protective layer, and/or electronic device. Thus, the manufacturing methods provided allow for the cost-effective addition of thin and lightweight functional, protective, and/or decorative layers to a multimedia device or other electronic device at a sales location or other customization location.

Abstract: The invention relates to a device for removing heat from an electronic component mounted on a circuit board. The device uses a working fluid circulated through cooling elements which are integrated into a metal matrix composite structure. The cooling elements are positioned and arranged within the structure to efficiently manage heat dissipation by evacuating the heat from the component in a multi-directional manner.

Abstract: The invention relates to a method of installing a heat source on a micro heat pipe module and to a micro heat pipe module. The micro heat pipe module (1) has micro heat pipes (3) for dissipating the thermal energy generated by the heat source (2) generating thermal energy, and the micro heat pipe module (1) has a side (4) on which the heat source (2) generating thermal energy is installed. The side (4) of the micro heat pipe module (1), on which the heat source (2) generating thermal energy is installed, is coated with a coating (5) made of a heat conducting material, which coating (5) is arranged to conduct the heat generated by the heat source (2) generating thermal energy away from the heat source (2) generating thermal energy along said side (4) of the micro heat pipe module (1) and to the micro heat pipe module (1).

Abstract: The invention relates to an arrangement for dissipating thermal energy generated by a heat source (1), which arrangement comprises a heat conductor element (2) for conducting thermal energy generated by the heat source (1) away from the heat source (1), the heat conductor element (2) having at least one micro heat pipe module (3) attached to it for distributing thermal energy generated by the heat source (1) in the heat conductor element (2). The heat source (1) is attached to an element (4) which is made of a heat conducting material and which is in thermal contact with the heat conductor element (2) and which is arranged to conduct thermal energy from the heat source (1) to the heat conductor element (2) by means of the heat conducting ability of said heat conducting material.

Abstract: The invention relates to a cooling apparatus (10) based on heat energy bound to working fluid in phase transition, the cooling apparatus comprising, for conducting elsewhere the heat energy generated by an electronic component (7), elongated cooling elements (1; 6a, 6b; 9a-9f) containing working fluid and extending in at least two different directions forming a matrix of cooling elements, and a heat conducting material (8; 15) binding the matrix of the cooling elements. The cooling elements (6a, 6b; 9a-9f) are arranged parallel to a circuit board level (A) and in at least one direction deviating from the circuit board level (A).