Patents by Inventor Jules J Poisson

Jules J Poisson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer level packaging technique for microdevices
    Patent number: 7138293
    Abstract: A method is disclosed for fabricating a integrated device, such as a MEMS device. A first wafer is provided on an exposed surface with a layer of gold, gold alloy or gold compound. A second wafer is provided on its exposed surface with under-layer of gold, gold alloy or gold compound; and an over- of bismuth, bismuth alloy, a compound of bismuth, cadmium, cadmium alloy, a compound of cadmium compound, tin, tin alloy, or a compound of tin. The wafers are then brought into contact and bonded at their surfaces through the deposited layers.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: November 21, 2006
    Assignee: Dalsa Semiconductor Inc.
    Inventors: Luc Ouellet, Jules J Poisson
  • Wafer level packaging technique for microdevices
    Publication number: 20040067604
    Abstract: A method is disclosed for fabricating a integrated device, such as a MEMS device. A first wafer is provided on an exposed surface with a layer of gold, gold alloy or gold compound. A second wafer is provided on its exposed surface with under-layer of gold, gold alloy or gold compound; and an over- of bismuth, bismuth alloy, a compound of bismuth, cadmium, cadmium alloy, a compound of cadmium compound, tin, tin alloy, or a compound of tin. The wafers are then brought into contact and bonded at their surfaces through the deposited layers.
    Type: Application
    Filed: December 6, 2002
    Publication date: April 8, 2004
    Inventors: Luc Ouellet, Jules J. Poisson