Abstract: The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.

Abstract: The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.

Abstract: The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.

Abstract: A wearable surface cover and method are described herein. The wearable surface cover, in an embodiment, has at least one layer. The at least one layer has an inner surface configured to be removably coupled to a target surface, an outer surface, and silicone. The at least one layer defines an opening that extends through the at least one layer to expose the target surface to an environment.

Abstract: The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.

Abstract: A wearable surface cover and method are described herein. The wearable surface cover, in an embodiment, has at least one layer. The at least one layer has an inner surface configured to be removably coupled to a target surface, an outer surface, and silicone. The at least one layer defines an opening that extends through the at least one layer to expose the target surface to an environment.

Abstract: A porous sintered body with an electrically conductive coating is provided. The sintered body has an open porosity in a range from 10 to 90%. The electrically conductive coating is bonded to the surface of the pores and is part of a heating device in a vaporizer. The electrically conductive coating lines the pores located in the interior of the sintered body so that when the sintered body is electrically connected and a current is applied, the current flows at least partially through the interior of the sintered body so that the interior of the sintered body is heated. A method for producing a porous sintered body with an electrically conductive coating is also provided.

Abstract: A reusable surface cover and method are disclosed herein. The reusable surface cover, in an embodiment, includes at least one layer having silicon. The at least one layer is configured to be removably coupled to a target surface. The at least one layer, in an embodiment, is configured to secure a plurality of objects to the target surface.

Abstract: A reusable surface cover and method are disclosed herein. The reusable surface cover, in an embodiment, includes at least one layer having silicon. The at least one layer is configured to be removably coupled to a target surface. The at least one layer, in an embodiment, is configured to secure a plurality of objects to the target surface.

Abstract: A porous sintered body with an electrically conductive coating is provided. The sintered body has an open porosity in a range from 10 to 90%. The electrically conductive coating is bonded to the surface of the pores and is part of a heating device in a vaporizer. The electrically conductive coating lines the pores located in the interior of the sintered body so that when the sintered body is electrically connected and a current is applied, the current flows at least partially through the interior of the sintered body so that the interior of the sintered body is heated. A method for producing a porous sintered body with an electrically conductive coating is also provided.