Abstract: The invention relates to an organic optoelectronic device, such as a display device, which is protected from the surrounding air by a sealed encapsulation which includes thin layers, and to a method for encapsulating the same. Said device has an electroluminescent unit having at least one active area (5) covered with a multi-layer encapsulation structure (201) and an electric connection area adjacent to the active area, the encapsulation structure including n stack(s) (n?1) comprising an inorganic film F1, . . . , Fn and a photosensitive layer C1, . . . , Cn, including an internal stack F1/C1 in which F1 covers the active area and C1, which is deposited in a liquid phase, is superposed thereon. According to the invention, the layer or each layer C1, Cn is etched and covers the film F1, . . . , Fn by extending around a peripheral edge (5a) of the active area in at least one structured surrounding portion (210, 211, 212) ending beyond the adjacent connection area, and if n>2, the or each layer C2, . . .

Abstract: The invention relates to a process for the non-covalent coating of a support by a hybrid organic/inorganic film, characterized in that it comprises the steps of: —depositing a conjugated organic polymer comprising organic groups of X type onto the support; depositing nanoparticles comprising one or more organic groups of Y type onto the support, and in that the groups of X and Y types are capable of developing hydrogen-type bonds between themselves. Typically, the deposition steps are repeated, generally alternately, until the desired thickness for the film is obtained. The deposition may be carried out on the whole of the support or on one part of the latter only.

Abstract: The invention relates to an organic optoelectronic device, such as a display device, which is protected from the surrounding air by a sealed encapsulation which includes thin layers, and to a method for encapsulating the same. Said device has an electroluminescent unit having at least one active area (5) covered with a multi-layer encapsulation structure (201) and an electric connection area adjacent to the active area, the encapsulation structure including n stack(s) (n?1) comprising an inorganic film F1, . . . , Fn and a photosensitive layer C1, . . . , Cn, including an internal stack F1/C1 in which F1 covers the active area and C1, which is deposited in a liquid phase, is superposed thereon. According to the invention, the layer or each layer C1, Cn is etched and covers the film F1, . . . , Fn by extending around a peripheral edge (5a) of the active area in at least one structured surrounding portion (210, 211, 212) ending beyond the adjacent connection area, and if n>2, the or each layer C2, . . .

Abstract: The invention relates to a process for the non-covalent coating of a support by a hybrid organic/inorganic film, characterized in that it comprises the steps of: —depositing a conjugated organic polymer comprising organic groups of X type onto the support; depositing nanoparticles comprising one or more organic groups of Y type onto the support, and in that the groups of X and Y types are capable of developing hydrogen-type bonds between themselves. Typically, the deposition steps are repeated, generally alternately, until the desired thickness for the film is obtained. The deposition may be carried out on the whole of the support or on one part of the latter only.