Patents by Inventor Julia Huang

Julia Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING THE SAME
    Publication number: 20150311114
    Abstract: The present disclosure provides a method for forming a semiconductor structure. In accordance with some embodiments, the method includes providing a substrate and a conductive feature formed over the substrate; forming a low-k dielectric layer over the conductive feature; forming a contact trench aligned with the conductive feature; and selectively growing a sealing layer which is a monolayer formed on sidewalls of the contact trench.
    Type: Application
    Filed: April 24, 2014
    Publication date: October 29, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Julia Huang, Hsiang-Wei Lin