Patents by Inventor Julia Lin

Julia Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12549688
    Abstract: Introduced here is a surveillance system that is able to employ an approach to sharing security information, such that organizations have the ability to voluntarily share relevant security information with the individuals who frequent the corresponding buildings. The surveillance system introduced here may not only be able to protect the safety of organizations, but also the privacy of users. In order for a member of the public to truly feel safe—not only from material loss or bodily harm—it is crucial for her to know what information is being recorded, stored, and used.
    Type: Grant
    Filed: May 16, 2023
    Date of Patent: February 10, 2026
    Assignee: Verkada Inc.
    Inventors: Karl Erik Gustav Rehnby, Julia Lin, Arjun Krishnaiah, Matthew Timothy Bornski
  • Publication number: 20230379438
    Abstract: Introduced here is a surveillance system that is able to employ an approach to sharing security information, such that organizations have the ability to voluntarily share relevant security information with the individuals who frequent the corresponding buildings. The surveillance system introduced here may not only be able to protect the safety of organizations, but also the privacy of users. In order for a member of the public to truly feel safe—not only from material loss or bodily harm—it is crucial for her to know what information is being recorded, stored, and used.
    Type: Application
    Filed: May 16, 2023
    Publication date: November 23, 2023
    Inventors: Karl Erik Gustav Rehnby, Julia Lin, Arjun Krishnaiah, Matthew Timothy Bornski
  • Publication number: 20210167019
    Abstract: Provided herein are metal interconnects that may include a cobalt alloy, a nickel alloy, or nickel. Also provided herein are methods of making metal interconnects. The metal interconnects may include a barrier and/or adhesion layer, a seed layer, a fill material, a cap, or a combination thereof, and at least one of the barrier and/or adhesion layer, the seed layer, the fill material, or the cap may include a cobalt alloy, a nickel alloy, nickel, or a combination thereof.
    Type: Application
    Filed: September 1, 2017
    Publication date: June 3, 2021
    Applicant: Intel Corporation
    Inventors: Daniel Zierath, Srijit Mukherjee, Jason Farmer, Chandan Ganpule, Julia Lin
  • Patent number: 10812348
    Abstract: Methods and systems are provided for automatically capturing network data for a detected anomaly. In some examples, a network node establishes a baseline usage by applying at least one baselining rule to network traffic to generate baseline statistics, detects an anomaly usage by applying at least one anomaly rule to network traffic and generating an anomaly event, and captures network data according to an anomaly event by triggering at least one capturing rule to be applied to network traffic when an associated anomaly event is generated.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: October 20, 2020
    Assignee: A10 Networks, Inc.
    Inventors: Rajkumar Jalan, Ronald Wai Lun Szeto, Rishi Sampat, Julia Lin
  • Publication number: 20180019931
    Abstract: Methods and systems are provided for automatically capturing network data for a detected anomaly. In some examples, a network node establishes a baseline usage by applying at least one baselining rule to network traffic to generate baseline statistics, detects an anomaly usage by applying at least one anomaly rule to network traffic and generating an anomaly event, and captures network data according to an anomaly event by triggering at least one capturing rule to be applied to network traffic when an associated anomaly event is generated.
    Type: Application
    Filed: July 15, 2016
    Publication date: January 18, 2018
    Inventors: Rajkumar Jalan, Ronald Wai Lun Szeto, Rishi Sampat, Julia Lin