Patents by Inventor Julia Platzer

Julia Platzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230085035
    Abstract: A method of manufacturing a component carrier includes laser drilling a blind hole in a layer stack, and subsequently extending the blind hole to a through hole by etching. A component carrier includes an electrically insulating layer structure, an electrically conductive layer structure directly on an electrically insulating layer structure, and a tapering through hole extending through the electrically conductive layer structure and through the electrically insulating layer structure with a lateral overhang of the electrically conductive layer structure beyond the electrically insulating layer structure at the tapering through hole of not more than 20% of a maximum diameter of the tapering through hole.
    Type: Application
    Filed: September 16, 2022
    Publication date: March 16, 2023
    Inventors: Abderrazzaq IFIS, Jens RIEDLER, Lukas HERRES, Felix SKRIVANEK, Julia PLATZER
  • Patent number: 11439018
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: September 6, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Sabine Liebfahrt, Ferdinand Lutschounig, Bernhard Reitmaier, Julia Platzer, Markus Frewein
  • Patent number: 11412618
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: August 9, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Sabine Liebfahrt, Ferdinand Lutschounig, Bernhard Reitmaier, Julia Platzer, Markus Frewein
  • Publication number: 20220210920
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.
    Type: Application
    Filed: December 29, 2020
    Publication date: June 30, 2022
    Inventors: Sabine Liebfahrt, Ferdinand Lutschounig, Bernhard Reitmaier, Julia Platzer, Markus Frewein
  • Publication number: 20220210919
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.
    Type: Application
    Filed: December 29, 2020
    Publication date: June 30, 2022
    Inventors: Sabine Liebfahrt, Ferdinand Lutschounig, Bernhard Reitmaier, Julia Platzer, Markus Frewein