Abstract: A method of controlling wetting characteristics is described. Such method includes forming and configuring nanostructures on a surface where controlling of the wetting characteristics is desired. Surfaces and methods of fabricating such surfaces are also described.

Abstract: Nanopillars with nanoscale diameters are provided where the nanopillar has uniformly aligned nano-twins either perpendicular or inclined by 1-90° to the pillar-axis with no grain-boundaries or any other features.

Abstract: Solid and hollow cylindrical nanopillars with nanoscale diameters are provided. Also provides is a method of making such nanopillars using electron beam lithography followed by the electroplating.

Abstract: A thin-film layered electronic device, or array of devices, is formed over a layer structure comprising a flexible substrate, a buffer layer, and a metal layer. The layer structure is annealed to permanently deform the layer structure beyond its plastic deformation limit. The thin-film electronic device is formed thereover by a process according to which all steps are performed at a temperature below that at which further plastic deformation of the buffer layer occurs. In-process strain and runout are reduced, improving device yield on flexible substrates. The metal layer forms a first layer of the thin-film layered device, or array of devices.

Abstract: A method of controlling wetting characteristics is described. Such method includes forming and configuring nanostructures on a surface where controlling of the wetting characteristics is desired. Surfaces and methods of fabricating such surfaces are also described.

Abstract: Nanopillars with nanoscale diameters are provided where the nanopillar has uniformly aligned nano-twins either perpendicular or inclined by 1-90° to the pillar-axis with no grain-boundaries or any other features.

Abstract: The invention is an indenter tip that is modified to permit both compression testing and tensile testing on samples having dimensions smaller than approximately 1 ?m. The modified indenter tip has both a surface that can be used to apply compressive forces, and tines that can be used to engage a free end of a specimen to be tested in tension. The apparatus used to perform the tests includes elements of a scanning electron microscope that permit visualization of the specimen to be tested and the modified indenter tip, so as to permit appropriate alignment and engagement of the same. The apparatus also includes elements of a microindenter that provide mechanical manipulation of the relative position and orientation of the modified indenter tip and of the specimen to be tested, as well as the necessary controls and instrumentation to perform the test and to collect, record and manipulate data.

Abstract: Solid and hollow cylindrical nanopillars with nanoscale diameters are provided. Also provides is a method of making such nanopillars using electron beam lithography followed by the electroplating.

Abstract: The invention is an indenter tip that is modified to permit both compression testing and tensile testing on samples having dimensions smaller than approximately 1 ?m. The modified indenter tip has both a surface that can be used to apply compressive forces, and tines that can be used to engage a free end of a specimen to be tested in tension. The apparatus used to perform the tests includes elements of a scanning electron microscope that permit visualization of the specimen to be tested and the modified indenter tip, so as to permit appropriate alignment and engagement of the same. The apparatus also includes elements of a microindenter that provide mechanical manipulation of the relative position and orientation of the modified indenter tip and of the specimen to be tested, as well as the necessary controls and instrumentation to perform the test and to collect, record and manipulate data.

Abstract: A method of forming a thin-film layered electronic device over a flexible substrate comprises the steps of depositing a buffer layer over the flexible substrate, heating the substrate and buffer layer stack to a temperature at which plastic deformation of the buffer layer takes place, cooling the stack, then forming the thin-film electronic device over the plastically deformed buffer layer without further plastic deformation of the buffer layer. The heating and cooling to cause plastic deformation of the buffer layer is referred to as annealing. The thin-film electronic device is formed by a process according to which all steps are performed at a temperature below that at which further plastic deformation of the buffer layer occurs. In-process strain and runout are reduced, improving device yield on flexible substrates. An optional metal base layer may be formed over the buffer layer prior annealing.