Patents by Inventor Julia WOERTINK

Julia WOERTINK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
    Patent number: 10100421
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: October 16, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides
    Patent number: 10104782
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: October 16, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
    Patent number: 10006136
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: June 26, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Julia Kozhukh, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
    Patent number: 9932684
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of ?-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: April 3, 2018
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF IMIDAZOLE AND BISEPOXIDE COMPOUNDS
    Publication number: 20170037526
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF IMIDAZOLE COMPOUNDS, BISEPOXIDES AND HALOBENZYL COMPOUNDS
    Publication number: 20170037528
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Julia Kozhukh, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF ALPHA AMINO ACIDS AND BISEPOXIDES
    Publication number: 20170037527
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of ?-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF PYRIDYL ALKYLAMINES AND BISEPOXIDES
    Publication number: 20170042037
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Electroplating baths of silver and tin alloys
    Patent number: 9512529
    Abstract: Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.
    Type: Grant
    Filed: June 4, 2013
    Date of Patent: December 6, 2016
    Inventors: Adolphe Foyet, Margit Clauss, Wan Zhang-Beglinger, Julia Woertink, Yi Qin, Jonathan Prange, Pedro O Lopez Montesinos
  • PLATING BATH AND METHOD
    Publication number: 20150122661
    Abstract: Tin-containing electroplating baths having a combination of certain brightening agents provide tin-containing solder deposits having reduced void formation and smooth morphology.
    Type: Application
    Filed: November 5, 2013
    Publication date: May 7, 2015
    Inventors: Julia WOERTINK, Yi QIN, Jonathan D. PRANGE, Pedro O. LOPEZ MONTESINOS
  • PLATING BATH AND METHOD
    Publication number: 20150122662
    Abstract: Tin electroplating baths having certain brightening agents and nonionic surfactants provide tin-containing solder deposits having good morphology, reduced void formation and improved within-die uniformity.
    Type: Application
    Filed: November 5, 2013
    Publication date: May 7, 2015
    Inventors: Julia WOERTINK, Yi QIN, Jonathan D. PRANGE, Pedro O. LOPEZ MONTESINOS
  • ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS
    Publication number: 20140353162
    Abstract: Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.
    Type: Application
    Filed: June 4, 2013
    Publication date: December 4, 2014
    Inventors: Adolphe FOYET, Margit CLAUSS, Wan ZHANG-BEGLINGER, Julia WOERTINK, Yi QIN, Jonathan PRANGE, Pedro O. LOPEZ MONTESINOS