Abstract: Encoder including a moveable part with at least one magnetic dipole, at least one Hall Effect sensor with a sensitive area arranged to detect a magnetic field created by the magnetic dipole, at least one circuit board with a main thickness and having an attachment portion on which the Hall Effect sensor is mounted, where the Hall Effect sensor is a semiconductor die sensor with the sensitive area arranged on an external face of the semiconductor die, where the Hall Effect sensor is flip chip mounted onto the attachment portion of the circuit board, with the sensitive area in contact with the circuit board, and where the attachment portion is arranged between the Hall Effect sensor and the magnetic dipole and presents a reduced thickness compared to the main thickness of the rest of the circuit board.

Abstract: Encoder including a moveable part with at least one magnetic dipole, at least one Hall Effect sensor with a sensitive area arranged to detect a magnetic field created by the magnetic dipole, at least one circuit board with a main thickness and having an attachment portion on which the Hall Effect sensor is mounted, where the Hall Effect sensor is a semiconductor die sensor with the sensitive area arranged on an external face of the semiconductor die, where the Hall Effect sensor is flip chip mounted onto the attachment portion of the circuit board, with the sensitive area in contact with the circuit board, and where the attachment portion is arranged between the Hall Effect sensor and the magnetic dipole and presents a reduced thickness compared to the main thickness of the rest of the circuit board.