Patents by Inventor Julian Carlo Concepcion BARBADILLO

Julian Carlo Concepcion BARBADILLO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942387
    Abstract: In examples, a semiconductor package comprises a wafer chip scale package (WCSP) having circuitry formed in a device side and an insulative layer above the device side. The WCSP includes one or more plated walls extending vertically to form a defined space, the one or more plated walls configured to prevent mold compound from flowing into the defined space. The WCSP includes mold compound abutting surfaces of the one or more plated walls opposing the defined space. The WCSP includes a conductive terminal coupled to the circuitry and extending from the WCSP into the defined space.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: March 26, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: John Carlo Cruz Molina, Julian Carlo Concepcion Barbadillo, Ray Fredric Solis De Asis
  • Publication number: 20230095185
    Abstract: In examples, a semiconductor package comprises a wafer chip scale package (WCSP) having circuitry formed in a device side and an insulative layer above the device side. The WCSP includes one or more plated walls extending vertically to form a defined space, the one or more plated walls configured to prevent mold compound from flowing into the defined space. The WCSP includes mold compound abutting surfaces of the one or more plated walls opposing the defined space. The WCSP includes a conductive terminal coupled to the circuitry and extending from the WCSP into the defined space.
    Type: Application
    Filed: September 30, 2021
    Publication date: March 30, 2023
    Inventors: John Carlo Cruz MOLINA, Julian Carlo Concepcion BARBADILLO, Ray Fredric Solis DE ASIS