Patents by Inventor Julian Chee

Julian Chee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS device for an implant assembly
    Patent number: 11896365
    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: February 13, 2024
    Assignee: ENDOTRONIX, INC.
    Inventors: Mohammad Faisal Zaman, Jeffrey Fong, Julian Chee, Tyler Panian, Michael Nagy
  • MEMS DEVICE FOR AN IMPLANT ASSEMBLY
    Publication number: 20230320617
    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.
    Type: Application
    Filed: February 27, 2023
    Publication date: October 12, 2023
    Inventors: Mohammad Faisal Zaman, Jeffrey Fong, Julian Chee, Tyler Panian, Michael Nagy
  • MEMS device for an implant assembly
    Patent number: 11589773
    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: February 28, 2023
    Assignee: ENDOTRONIX, INC.
    Inventors: Mohammad Faisal Zaman, Jeffrey Fong, Julian Chee, Tyler Panian, Michael Nagy
  • MEMS DEVICE FOR AN IMPLANT ASSEMBLY
    Publication number: 20190150785
    Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Inventors: Mohammad Faisal Zaman, Jeffrey Fong, Julian Chee, Tyler Panian, Michael Nagy