Patents by Inventor Julian Gonska
Julian Gonska has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9988261Abstract: A micromechanical device, in particular a sensor device, and a method for manufacturing a micromechanical device are provided. The micromechanical device has a housing, the housing including a first cavity, and the housing including a second cavity that is separate from the first cavity. The micromechanical device is configured in such a way that a predetermined first gas pressure prevails in the first cavity, and a predetermined second gas pressure which is reduced compared to the first gas pressure prevails in the second cavity. A heating element is situated in the area of the second cavity. The micromechanical device has a printed conductor, the heating element being heatable with the aid of the printed conductor.Type: GrantFiled: June 13, 2013Date of Patent: June 5, 2018Assignee: ROBERT BOSCH GMBHInventors: Julian Gonska, Jochen Reinmuth, Kathrin Gutsche
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Patent number: 9725309Abstract: A micromechanical sensor device includes: an ASIC substrate having a first front side and a first rear side; a rewiring element formed on the first front side and including multiple stacked conductor levels and insulating layers; a MEMS substrate having a second front side and a second rear side; a first micromechanical functional layer formed on top of the second front side; and a second micromechanical functional layer formed on top of the first micromechanical functional layer and connected to the rewiring element. In the second micromechanical functional layer, a movable sensor structure is anchored on one side via a first anchoring area, and an electrical connecting element formed in a second anchoring area is anchored on one side on the ASIC, and the first and second anchoring areas are elastically connected to one another via a spring element.Type: GrantFiled: November 30, 2015Date of Patent: August 8, 2017Assignee: ROBERT BOSCH GMBHInventors: Julian Gonska, Jochen Reinmuth
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Patent number: 9670055Abstract: A method for manufacturing a micromechanical sensor unit, the micromechanical sensor unit including a substrate and a sealing cap, in the first method step the substrate and the sealing cap being configured and joined in such a way that, as a result of bonding the sealing cap and the substrate, a first cavity, which has a first pressure and in which a first sensor element is situated, and a second cavity, which has a second pressure and in which a second sensor element is situated, are manufactured, in a second method step a sealable channel leading into the first cavity being created, in a third method step the first pressure in the first cavity being established via the sealable channel.Type: GrantFiled: October 31, 2014Date of Patent: June 6, 2017Assignee: Robert Bosch GmbHInventors: Jochen Reinmuth, Julian Gonska
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Patent number: 9650240Abstract: Measures are provided for improving and simplifying metallic bonding processes which enable a reliable initiation of the bonding process and thus contribute to a uniform bonding. The present method provides a further option for using bonding layers. The method in the case of which the two semiconductor elements are bonded to one another via a bond of at least one metallic starting layer and at least one further starting layer provides that the two starting layers are structured in such a way that the layer areas which are assigned to one another have differently sized areal extents. Moreover, the layer thicknesses of the two starting layers should be selected in such a way that the layer areas which are assigned to one another meet the material ratio necessary for the bonding process.Type: GrantFiled: June 4, 2015Date of Patent: May 16, 2017Assignee: Robert Bosch GmbHInventors: Mirko Hattass, Heiko Stahl, Jochen Reinmuth, Julian Gonska, Johannes Classen
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Patent number: 9593011Abstract: A method is described for producing a micromechanical component. The method includes providing a first substrate, providing a second substrate, developing a projecting patterned element on the second substrate, and connecting the first and the second substrate via the projecting patterned element. The method provides that the connecting of the first and the second substrate includes eutectic bonding. Also described is a micromechanical component, in which a first and a second substrate are connected to each other.Type: GrantFiled: April 7, 2010Date of Patent: March 14, 2017Assignee: ROBERT BOSCH GMBHInventors: Julian Gonska, Heribert Weber
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Patent number: 9567212Abstract: A micromechanical component includes a first space in which a first sensor is situated and a second space in which a second sensor is situated, different pressures prevailing in the first and second spaces, one of the two spaces extending via a third space to a first lattice structure which is situated in an edge region of the component and is essentially hermetically sealed.Type: GrantFiled: October 24, 2013Date of Patent: February 14, 2017Assignee: ROBERT BOSCH GMBHInventors: Julian Gonska, Jochen Reinmuth, Kathrin Gutsche, Jens Frey, Heribert Weber
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Patent number: 9567205Abstract: A micromechanical sensor device and a corresponding manufacturing method are described. The micromechanical sensor device includes a CMOS wafer having a front side and a rear side, a rewiring device formed on the front side of the CMOS wafer including a plurality of stacked printed conductor levels and insulation layers, an MEMS wafer having a front side and a rear side, a micromechanical sensor device formed across the front side of the MEMS wafer, a bond connection between the MEMS wafer and the CMOS wafer, a cavern between the MEMS wafer and the CMOS wafer, in which the sensor device is hermetically enclosed, and an exposed getter layer area applied to at least one of the plurality of stacked printed conductor levels and insulation layers.Type: GrantFiled: November 6, 2014Date of Patent: February 14, 2017Assignee: ROBERT BOSCH GMBHInventors: Jochen Reinmuth, Julian Gonska
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Publication number: 20160368763Abstract: A method for manufacturing a micromechanical component including forming an access opening in an MEMS element or in a cap element of the component; connecting the MEMS element to the cap element, at least one cavity being formed between the MEMS element and the cap element; and closing off the access opening with respect to the at least one cavity under a defined atmosphere, using a laser.Type: ApplicationFiled: December 22, 2014Publication date: December 22, 2016Inventors: Julian Gonska, Mawuli Ametowobla, Jochen Reinmuth
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Publication number: 20160152466Abstract: A micromechanical sensor device includes: an ASIC substrate having a first front side and a first rear side; a rewiring element formed on the first front side and including multiple stacked conductor levels and insulating layers; a MEMS substrate having a second front side and a second rear side; a first micromechanical functional layer formed on top of the second front side; and a second micromechanical functional layer formed on top of the first micromechanical functional layer and connected to the rewiring element. In the second micromechanical functional layer, a movable sensor structure is anchored on one side via a first anchoring area, and an electrical connecting element formed in a second anchoring area is anchored on one side on the ASIC, and the first and second anchoring areas are elastically connected to one another via a spring element.Type: ApplicationFiled: November 30, 2015Publication date: June 2, 2016Inventors: Julian GONSKA, Jochen Reinmuth
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Publication number: 20150353349Abstract: Measures are provided for improving and simplifying metallic bonding processes which enable a reliable initiation of the bonding process and thus contribute to a uniform bonding. The present method provides a further option for using bonding layers. The method in the case of which the two semiconductor elements are bonded to one another via a bond of at least one metallic starting layer and at least one further starting layer provides that the two starting layers are structured in such a way that the layer areas which are assigned to one another have differently sized areal extents. Moreover, the layer thicknesses of the two starting layers should be selected in such a way that the layer areas which are assigned to one another meet the material ratio necessary for the bonding process.Type: ApplicationFiled: June 4, 2015Publication date: December 10, 2015Inventors: Mirko HATTASS, Heiko STAHL, Jochen REINMUTH, Julian GONSKA, Johannes CLASSEN
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Patent number: 9123716Abstract: A method for bonding two silicon substrates and a corresponding system of two silicon substrates. The method includes: providing first and second silicon substrates; depositing a first bonding layer of pure aluminum or of aluminum-copper having a copper component between 0.1 and 5% on a first bonding surface of the first silicon substrate; depositing a second bonding layer of germanium above the first bonding surface or above a second bonding surface of the second silicon substrate; subsequently joining the first and second silicon substrates, so that the first and the second bonding surfaces lie opposite each other; and implementing a thermal treatment step to form an eutectic bonding layer of aluminum-germanium or containing aluminum-germanium as the main component, between the first silicon substrate and the second silicon substrate, spikes which contain aluminum as a minimum and extend into the first silicon substrate, forming at least on the first bonding surface.Type: GrantFiled: December 19, 2012Date of Patent: September 1, 2015Assignee: ROBERT BOSCH GMBHInventors: Julian Gonska, Heribert Weber, Jens Frey, Timo Schary, Thomas Mayer
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Publication number: 20150137329Abstract: An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer.Type: ApplicationFiled: January 28, 2015Publication date: May 21, 2015Inventors: Julian Gonska, Jens Frey, Heribert Weber, Eckhard Graf, Roman Schlosser
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Publication number: 20150123217Abstract: A method for manufacturing a micromechanical sensor unit, the micromechanical sensor unit including a substrate and a sealing cap, in the first method step the substrate and the sealing cap being configured and joined in such a way that, as a result of bonding the sealing cap and the substrate, a first cavity, which has a first pressure and in which a first sensor element is situated, and a second cavity, which has a second pressure and in which a second sensor element is situated, are manufactured, in a second method step a sealable channel leading into the first cavity being created, in a third method step the first pressure in the first cavity being established via the sealable channel.Type: ApplicationFiled: October 31, 2014Publication date: May 7, 2015Inventors: Jochen REINMUTH, Julian GONSKA
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Publication number: 20150123221Abstract: A micromechanical sensor device and a corresponding manufacturing method are described. The micromechanical sensor device includes a CMOS wafer having a front side and a rear side, a rewiring device formed on the front side of the CMOS wafer including a plurality of stacked printed conductor levels and insulation layers, an MEMS wafer having a front side and a rear side, a micromechanical sensor device formed across the front side of the MEMS wafer, a bond connection between the MEMS wafer and the CMOS wafer, a cavern between the MEMS wafer and the CMOS wafer, in which the sensor device is hermetically enclosed, and an exposed getter layer area applied to at least one of the plurality of stacked printed conductor levels and insulation layers.Type: ApplicationFiled: November 6, 2014Publication date: May 7, 2015Inventors: Jochen REINMUTH, Julian GONSKA
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Patent number: 8975118Abstract: An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer.Type: GrantFiled: April 13, 2011Date of Patent: March 10, 2015Assignee: Robert Bosch GmbHInventors: Julian Gonska, Jens Frey, Heribert Weber, Eckhard Graf, Roman Schlosser
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Publication number: 20140117472Abstract: A micromechanical component includes a first space in which a first sensor is situated and a second space in which a second sensor is situated, different pressures prevailing in the first and second spaces, one of the two spaces extending via a third space to a first lattice structure which is situated in an edge region of the component and is essentially hermetically sealed.Type: ApplicationFiled: October 24, 2013Publication date: May 1, 2014Applicant: ROBERT BOSCH GMBHInventors: Julian Gonska, Jochen Reinmuth, Kathrin Gutsche, Jens Frey, Heribert Weber
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Publication number: 20130334622Abstract: A micromechanical device, in particular a sensor device, and a method for manufacturing a micromechanical device are provided. The micromechanical device has a housing, the housing including a first cavity, and the housing including a second cavity that is separate from the first cavity. The micromechanical device is configured in such a way that a predetermined first gas pressure prevails in the first cavity, and a predetermined second gas pressure which is reduced compared to the first gas pressure prevails in the second cavity. A heating element is situated in the area of the second cavity. The micromechanical device has a printed conductor, the heating element being heatable with the aid of the printed conductor.Type: ApplicationFiled: June 13, 2013Publication date: December 19, 2013Applicant: Robert Bosch GmbHInventors: Julian GONSKA, Jochen REINMUTH, Kathrin GUTSCHE
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Publication number: 20130285175Abstract: A micromechanical component, in particular a micromechanical sensor having a carrier substrate and having a cap substrate, and a manufacturing method are provided. The carrier substrate and the cap substrate are joined together with the aid of a eutectic bond connection or by a metallic solder connection or a glass solder connection (e.g., glass frit), in an edge area of the carrier substrate and the cap substrate. The connection of the carrier substrate and the cap substrate is established with the aid of connecting areas, and a stop trench or a stop protrusion or both a stop trench and a stop protrusion are situated within the edge areas in the bordering areas.Type: ApplicationFiled: April 24, 2013Publication date: October 31, 2013Applicant: Robert Bosch GmbHInventors: Julian Gonska, Jens Frey, Herlbert Weber, Timo Schary, Thomas Mayer
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Patent number: 8530260Abstract: A method for attaching a first carrier device to a second carrier device includes forming at least one first bond layer and/or solder layer on a first exterior of the first carrier device, a partial surface being framed by the at least one first bond layer and/or solder layer, and placing the first carrier device on the second carrier device and fixedly bonding or soldering the first carrier device to the second carrier device. The at least one first bond layer and/or solder layer includes a first cover area which is larger than a first contact area.Type: GrantFiled: April 12, 2010Date of Patent: September 10, 2013Assignee: Robert Bosch GmbHInventors: Julian Gonska, Axel Grosse, Heribert Weber, Ralf Hausner
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Publication number: 20130161820Abstract: A method for bonding two silicon substrates and a corresponding system of two silicon substrates. The method includes: providing first and second silicon substrates; depositing a first bonding layer of pure aluminum or of aluminum-copper having a copper component between 0.1 and 5% on a first bonding surface of the first silicon substrate; depositing a second bonding layer of germanium above the first bonding surface or above a second bonding surface of the second silicon substrate; subsequently joining the first and second silicon substrates, so that the first and the second bonding surfaces lie opposite each other; and implementing a thermal treatment step to form an eutectic bonding layer of aluminum-germanium or containing aluminum-germanium as the main component, between the first silicon substrate and the second silicon substrate, spikes which contain aluminum as a minimum and extend into the first silicon substrate, forming at least on the first bonding surface.Type: ApplicationFiled: December 19, 2012Publication date: June 27, 2013Inventors: Julian GONSKA, Heribert Weber, Jens Frey, Timo Schary, Thomas Mayer