Abstract: A system for cleaning a wafer has a vacuum source, a chuck table configured to support a wafer assembly and to be in communication with both the vacuum source and the wafer assembly, such that in use a suction force is applied to the wafer assembly via the chuck table. The system also includes a sensor component configured to detect the presence of the wafer assembly on the chuck table.

Abstract: A chuck table for supporting a wafer assembly during a cleaning process comprising an axis of rotation, a first surface including an opening configured to be in communication with a vacuum source, and a second surface opposing the first surface. The second surface includes a suction opening displaced radially from both the opening in the first surface and the axis, the suction opening being in communication with the opening in the first surface such that in use a suction force can be applied via the suction opening.