Patents by Inventor Julian Searle

Julian Searle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11983091
    Abstract: A system and method to adaptively generate a program model. Source code of a program to be tested for code issues, and a set of predefined patterns to be tested in the source code are received. Feature configuration data is generated by determining a set of features corresponding to the received set of predefined patterns. A set of program models is identified by selecting, for each feature in the set of features, a program model from among a plurality of program models that is optimized for the feature. A dynamic program model is built based on the identified set of program models, the dynamic program model being adapted to resolve each of the patterns included in the received set of predefined patterns. And the source code is tested for code issues by extracting from the dynamic program model instances of each of the set of predefined patterns.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: May 14, 2024
    Assignee: GitLab B.V.
    Inventors: Julian Thome, Isaac Dawson, James Johnson, Zach Rice, Daniel Searles, Lucas Charles, Mark Art, Taylor McCaslin, Thomas Woodham, Todd Stadelhofer
  • Publication number: 20080308937
    Abstract: Embodiments of copper-free semiconductor device interfaces and methods for forming and/or utilizing the same are provided herein. In some embodiments, a semiconductor structure may include a substrate having an exposed copper-containing feature; and a copper-free interface disposed over the substrate and providing a conductive interconnect between the copper-containing feature and an upper surface of the copper-free interface to facilitate electrical coupling of the substrate to a semiconductor device while physically isolating the semiconductor device from the copper-containing feature.
    Type: Application
    Filed: June 13, 2008
    Publication date: December 18, 2008
    Applicant: SVTC TECHNOLOGIES, LLC
    Inventors: Wilbur Catabay, Julian Searle, Wei-Jen Hsia, Milan Prejda, Rohini Ranganathan, Lahcene Smati, Majid Milani