Abstract: A focused multi-planar image acquisition in real time even while a test object is moving, is achieved with a system and a method for a focused multi-planar image acquisition in a prober. When a surface of a test object is positioned laterally in relation to tips of separated probe needles, a microscope is focused on the surface of the test object at a first time and on a plane of the probe needles at a second time. The objective lens is provided with a microscope objective lens focusing system, which can focus the objective lens, independently of a vertical adjustment drive of the microscope, on the surface of the test object in a first focal plane and in a second focal plane, which is on a level with the probe needle tips.

Abstract: A focused multi-planar image acquisition in real time even while a test object is moving, is achieved with a system and a method for a focused multi-planar image acquisition in a prober. When a surface of a test object is positioned laterally in relation to tips of separated probe needles, a microscope is focused on the surface of the test object at a first time and on a plane of the probe needles at a second time. The objective lens is provided with a microscope objective lens focusing system, which can focus the objective lens, independently of a vertical adjustment drive of the microscope, on the surface of the test object in a first focal plane and in a second focal plane, which is on a level with the probe needle tips.

Abstract: In a method for producing semiconductor components, in which chips are structured, tested, and isolated into dies on a wafer, in the event of a wafer being broken during the method, undamaged chips of a fragment of the wafer delimited by at least one edge section and at least one fracture contour are processed further as usual. The method has the result that the yield of usable chips is significantly increased in relation to the discarding and disposal of broken wafers provided in the prior art. The average production costs of electronic components and the loss of valuable semiconductor materials and the costs for the disposal of the fragments viewed as discards up to this point are thus significantly reduced.

Abstract: In a device and a method for positioning an object, a drive of a movement device is controlled. To this end, a visual joystick is actuated, as a result of which a moveable actuator is moved, at least linearly by means of a display of a control unit of the movement device, into a position, in which a direction of movement, which can be implemented with the drive, is displayed symbolically. The drive for the movement of the object in the displayed direction of movement is initiated by means of a switching function of the actuator.

Abstract: The invention relates to a system and a method for capturing images in a prober. According to the invention, the surface of a test object is illuminated in succession with light of a first, second and third color; and an image capturing device records a gray scale image of the surface; and a composite image is produced from the three gray scale images by means of an image evaluating device. The object of the invention is to qualitatively improve the image capturing, in order to raise the positioning accuracy by means of an improved display, as a result of which, finely structured test objects can be used. This object of the invention is achieved in that the lighting device is designed as a unit, which can be controlled by the image evaluating unit and which produces at least three colors and which exhibits at least one light emitting diode (LED) as the lighting means.

Abstract: A process is provided for inspection of a variety of structures on the basis of a golden template, that was attained by recording and statistical analysis of greyscale pictures and is compared to the greyscale picture of the structure to be evaluated based on position. The underlying task is to report any such inspection process, with which a positioning of the test structure relative to the golden template and a structure detection with sub-pixel accuracy is carried out. In positioning of each further structure to be recorded, which follows a first recorded structure, the further structure is fundamentally positioned in accordance with the first positioned structure, applicable characteristic values of the greyscale picture recorded in this position are determined and hence a degree of similarity is determined.