Abstract: A semiconductor device includes a semiconductor body having an upper surface, a group of first upper-level metal fingers and second upper-level metal fingers that are arranged alternatingly with one another, wherein each of the first upper-level metal fingers is electrically connected to the semiconductor body by the first lower-level conductive fingers, wherein each of the second upper-level metal fingers is electrically connected to the semiconductor body by the second lower-level conductive fingers, wherein the group of first lower-level conductive fingers and second lower-level conductive fingers defines a connection area over the upper surface, and wherein in the connection area the first upper-level metal fingers are at least partially non-overlapping with the second upper-level metal fingers.

Abstract: A semiconductor device includes a semiconductor body including an upper surface, input and output terminals disposed on the upper surface of the semiconductor body, first and second p-n junction devices that are monolithically integrated in the semiconductor body, and a signal line protection circuit connected between the input and output terminals and comprising a low-pass filter and a voltage clamping device, wherein each of the low-pass filter and the voltage clamping device include the first and second p-n junction devices.