Patents by Inventor Julie A. Springer

Julie A. Springer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and structure for interconnecting different polysilicon zones on semiconductor substrates for integrated circuits
    Patent number: 5453400
    Abstract: A method of forming interconnections of devices of integrated circuits, especially interconnecting spaced source/drain regions and/or gate regions, and the resulting structures are provided. An etch-stop material such as silicon dioxide is deposited over the entire substrate on which the devices are formed. A layer of silicon is deposited over etch-stop material, and the silicon is selectively etched to reveal the etch-stop material at the regions to be connected. The etch-stop material at those regions is then removed. Following this a high-conductivity material, which is either a refractory metal or a silicide formed from layers of silicon and a refractory metal, is formed on the substrate connecting the spaced regions.
    Type: Grant
    Filed: January 19, 1993
    Date of Patent: September 26, 1995
    Assignee: International Business Machines Corporation
    Inventors: John R. Abernathey, Randy W. Mann, Paul C. Parries, Julie A. Springer