Patents by Inventor Julie C. WHELAN

Julie C. WHELAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Covalent chemical surface modification of surfaces with available silicon or nitrogen
    Patent number: 10519035
    Abstract: The invention provides a method to form and functionalize monolayers on a silicon-rich silicon nitride surface or a silicon surface formed by a nanopore fabrication method known as dielectric breakdown. Thermal, photochemical and radical processing can be used to hydrosilylate nascent silicon and silicon nitride surfaces with various reagents. The conventional need for hydrofluoric acid etching prior to coupling functional groups to the surfaces is thereby completely avoided.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: December 31, 2019
    Assignee: Rhode Island Council On Postsecondary Education
    Inventors: Jason R. Dwyer, Y. M. Nuwan D. Y. Bandara, Buddini Iroshika Karawdeniya, Julie C. Whelan
  • Systems and methods for electroless plating of thin gold films directly onto silicon nitride and into pores in silicon nitride
    Patent number: 10351958
    Abstract: A method is disclosed for electroless plating of thin metal film directly onto a substrate. The method includes the steps of: cleaning the substrate to remove organic material; etching a surface of the substrate to remove an oxygen-containing surface layer; soaking and rinsing the substrate in a plurality of baths following etching; and electroless plating the metal onto the substrate.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: July 16, 2019
    Assignee: Council On Postsecondary Education
    Inventors: Jason Rodger Dwyer, Julie C. Whelan, Y. M. Nuwan D. Y. Bandara, Buddini I. Karawdeniya
  • SYSTEMS AND METHODS FOR ELECTROLESS PLATING OF THIN GOLD FILMS DIRECTLY ONTO SILICON NITRIDE AND INTO PORES IN SILICON NITRIDE
    Publication number: 20170130338
    Abstract: A method is disclosed for electroless plating of thin metal film directly onto a substrate. The method includes the steps of: cleaning the substrate to remove organic material; etching a surface of the substrate to remove an oxygen-containing surface layer; soaking and rinsing the substrate in a plurality of baths following etching; and electroless plating the metal onto the substrate.
    Type: Application
    Filed: June 22, 2015
    Publication date: May 11, 2017
    Inventors: Jason Rodger DWYER, Julie C. WHELAN, Y.M. Nuwan D.Y. BANDARA, Buddini I. KARAWDENIYA