Abstract: Embodiments of the disclosure relate to an optical fiber ribbon. The optical fiber ribbon includes a plurality of optical fibers arranged adjacently to each other and a plurality of bonding regions intermittently spaced along a length of the optical fiber ribbon. At each bonding region, at least one bond is formed between two optical fibers of the plurality of optical fibers. Further, the at least one bond comprises a first material applied to outer surfaces of the two optical fibers and a second material applied over the first material. The first material is different from the second material, and at least one of the first material or the second material includes a colorant configured to identify the optical fiber ribbon. Also disclosed are embodiments of making such an optical fiber ribbon as well as of optical fiber cables including such an optical fiber ribbon.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes an interconnect structure disposed over a substrate. The interconnect structure includes a plurality of interconnect layers disposed within a dielectric structure. A bond pad structure is disposed over the interconnect structure. The bond pad structure includes a contact layer. A first masking layer including a metal-oxide is disposed over the bond pad structure. The first masking layer has interior sidewalls arranged directly over the bond pad structure to define an opening. A conductive bump is arranged within the opening and on the contact layer.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method includes forming a plurality of bond pad structures over an interconnect structure on a front-side of a semiconductor body. The plurality of bond pad structures respectively have a titanium contact layer. The interconnect structure and the semiconductor body are patterned to define trenches extending into the semiconductor body. A dielectric fill material is formed within the trenches. The dielectric fill material is etched to expose the titanium contact layer prior to bonding the semiconductor body to a carrier substrate. The semiconductor body is thinned to expose the dielectric fill material along a back-side of the semiconductor body and to form a plurality of integrated chip die. The dielectric fill material is removed to separate the plurality of integrated chip die.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method includes forming a plurality of bond pad structures over an interconnect structure on a front-side of a semiconductor body. The plurality of bond pad structures respectively have a titanium contact layer. The interconnect structure and the semiconductor body are patterned to define trenches extending into the semiconductor body. A dielectric fill material is formed within the trenches. The dielectric fill material is etched to expose the titanium contact layer prior to bonding the semiconductor body to a carrier substrate. The semiconductor body is thinned to expose the dielectric fill material along a back-side of the semiconductor body and to form a plurality of integrated chip die. The dielectric fill material is removed to separate the plurality of integrated chip die.

Abstract: The invention overcomes the deficiencies of the art by providing an agronomically elite soybean plant with non-transgenic mutations of at least two of the glycinin subunits selected from the group consisting of Gy1, Gy2, Gy3, Gy4, and Gy5, such as conferring a Gy2 and Gy4 null phenotype and increased ?-conglycinin content in seed. The invention also provides derivatives, and plant parts of these plants and uses thereof. Methods for marker assisted selection of soybean varieties comprising non-transgenic mutations conferring a reduced Gy1, Gy2, Gy3, Gy4, and Gy5 phenotype are also provided as part of the current invention. Methods for producing such plants that are further lipoxygenase and/or Kunitz Trypsin Inhibitor null and the plants produced thereby are also provided. The invention is significant in that soybeans from such plants are preferred dietary additives and provide important health benefits.

Abstract: The invention overcomes the deficiencies of the art by providing an agronomically elite soybean plant with non-transgenic mutations of at least two of the glycinin subunits selected from the group consisting of Gy1, Gy2, Gy3, Gy4, and Gy5, such as conferring a Gy2 and Gy4 null phenotype and increased ?-conglycinin content in seed. The invention also provides derivatives, and plant parts of these plants and uses thereof. Methods for marker assisted selection of soybean varieties comprising non-transgenic mutations conferring a reduced Gy1, Gy2, Gy3, Gy4, and Gy5 phenotype are also provided as part of the current invention. Methods for producing such plants that are further lipoxygenase and/or Kunitz Trypsin Inhibitor null and the plants produced thereby are also provided. The invention is significant in that soybeans from such plants are preferred dietary additives and provide important health benefits.

Abstract: The invention overcomes the deficiencies of the art by providing an agronomically elite soybean plant with non-transgenic mutations of at least two of the glycinin subunits selected from the group consisting of Gy1, Gy2, Gy3, Gy4, and Gy5, such as conferring a Gy2 and Gy4 null phenotype and increased ?-conglycinin content in seed. The invention also provides derivatives, and plant parts of these plants and uses thereof. Methods for marker assisted selection of soybean varieties comprising non-transgenic mutations conferring a reduced Gy1, Gy2, Gy3, Gy4, and Gy5 phenotype are also provided as part of the current invention. Methods for producing such plants that are further lipoxygenase and/or Kunitz Trypsin Inhibitor null and the plants produced thereby are also provided. The invention is significant in that soybeans from such plants are preferred dietary additives and provide important health benefits.

Abstract: The invention overcomes the deficiencies of the art by providing an agronomically elite soybean plant with non-transgenic mutations of at least two of the glycinin subunits selected from the group consisting of Gy1, Gy2, Gy3, Gy4, and Gy5, such as conferring a Gy3 and Gy4 null phenotype and increased ?-conglycinin content in seed. The invention also provides derivatives, and plant parts of these plants and uses thereof. Methods for marker assisted selection of soybean varieties comprising non-transgenic mutations conferring a reduced Gy1, Gy2, Gy3, Gy4, and Gy5 phenotype are also provided as part of the current invention. Methods for producing such plants that are further lipoxygenase and/or Kunitz Trypsin Inhibitor null and the plants produced thereby are also provided. The invention is significant in that soybeans from such plants are preferred dietary additives and provide important health benefits.

Abstract: A table assembly includes a top and four table leg assemblies are connected to an underside of the top. Each table leg assembly includes a U-shaped frame and a bush with a tapered inside and a tapered outside extends through a hole in the bottom of each bush. A securing sleeve is engaged with the tapered inside of each bush and a leg is securely inserted in the securing sleeve corresponding thereto. The legs assembly is easily assembled and dis-assembled. The bushes each have a cushion lip inclinedly extending from a top thereof and being in contact with the top so as to provide a cushion function for the load on the top.