Abstract: A camera comprising: a camera enclosure; an optomechanical assembly fixedly coupled to the camera enclosure; an image sensor assembly movably coupled to the camera enclosure, the image sensor assembly comprising: a substrate, an image sensor coupled to the substrate, a flexible printed circuit board coupled to the substrate, a conductive stiffener plate coupled to the flexible printed circuit board, and a passive heat exchanger thermally coupled to the image sensor to dissipate heat away from the image sensor.

Abstract: An apparatus and method of producing a dual overmolded camera module. The dual overmolded camera module including a dual overmolded image sensor module having a first image sensor device and a second image sensor device spaced from one another in an x-direction at a predetermined alignment distance, and wherein at least one of the first image sensor device and the second image sensor device have a conductive via formed therethrough and a redistribution layer along at least one side. The dual overmolded camera module further including a first lens assembly and a second lens assembly mounted over respective ones of the first image sensor device and the second image sensor device, and wherein both the first lens assembly and the second lens assembly are aligned with a common target.

Abstract: A camera module including a die having a top side and a bottom side, an image sensor is positioned on the top side of the die and a conductive via is formed through the die to provide an electrical connection between the top side and the bottom side; an overmold casing formed around the die; and a lens holder assembly attached to the top side of the die and the overmold casing. A method of producing a camera module including providing an image sensor die that is overmolded within a casing, the image sensor die having a top side and a bottom side, wherein an image sensor is positioned on the top side and a conductive via is formed through the image sensor die from the top side to the bottom side; and attaching a lens holder to the top side of the image sensor die.

Abstract: An apparatus and method of producing a dual overmolded camera module. The dual overmolded camera module including a dual overmolded image sensor module having a first image sensor device and a second image sensor device spaced from one another in an x-direction at a predetermined alignment distance, and wherein at least one of the first image sensor device and the second image sensor device have a conductive via formed therethrough and a redistribution layer along at least one side. The dual overmolded camera module further including a first lens assembly and a second lens assembly mounted over respective ones of the first image sensor device and the second image sensor device, and wherein both the first lens assembly and the second lens assembly are aligned with a common target.

Abstract: A camera module including a die having a top side and a bottom side, an image sensor is positioned on the top side of the die and a conductive via is formed through the die to provide an electrical connection between the top side and the bottom side; an overmold casing formed around the die; and a lens holder assembly attached to the top side of the die and the overmold casing. A method of producing a camera module including providing an image sensor die that is overmolded within a casing, the image sensor die having a top side and a bottom side, wherein an image sensor is positioned on the top side and a conductive via is formed through the image sensor die from the top side to the bottom side; and attaching a lens holder to the top side of the image sensor die.

Abstract: A camera module including a die having a top side and a bottom side, an image sensor is positioned on the top side of the die and a conductive via is formed through the die to provide an electrical connection between the top side and the bottom side; an overmold casing formed around the die; and a lens holder assembly attached to the top side of the die and the overmold casing. A method of producing a camera module including providing an image sensor die that is overmolded within a casing, the image sensor die having a top side and a bottom side, wherein an image sensor is positioned on the top side and a conductive via is formed through the image sensor die from the top side to the bottom side; and attaching a lens holder to the top side of the image sensor die.

Abstract: A camera module including a die having a top side and a bottom side, an image sensor is positioned on the top side of the die and a conductive via is formed through the die to provide an electrical connection between the top side and the bottom side; an overmold casing formed around the die; and a lens holder assembly attached to the top side of the die and the overmold casing. A method of producing a camera module including providing an image sensor die that is overmolded within a casing, the image sensor die having a top side and a bottom side, wherein an image sensor is positioned on the top side and a conductive via is formed through the image sensor die from the top side to the bottom side; and attaching a lens holder to the top side of the image sensor die.