Abstract: A support device for a thin substrate, notably in a semiconductor material, having the shape of a plate with a circular profile, including a platen provided with projecting fixed abutments against which bears the substrate, wherein the fixed abutments are disposed on said platen so as to define an open housing which the substrate is freely engaged. The platen includes a complementary movable abutment, adapted for retracting inside a recess formed in the platen thickness which allows for engagement of said substrate. Once said substrate has been placed in a position a contact is established with the fixed abutments bearing in a resilient way against the substrate edge holding it against the abutments.