Patents by Inventor Julien Morand

Julien Morand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240014046
    Abstract: The present invention concerns a method and a device for making an integrated cooling liquid cavity in a printed circuit board by inserting a power semiconductor die in a dielectric material, laminating the dielectric material with a dielectric material and a thin electrically conducting layer on each side of the dielectric material, drilling vias through the laminated copper and dielectric layers, metallizing the vias in order to form a first printed circuit board, laminating a dielectric material, a soluble material having a predetermined form and an electrically conducting layer on the first printed circuit board, injecting solvent in the soluble material in order to dissolve the soluble material and reveal a cavity injecting cooling liquid in the revealed cavity.
    Type: Application
    Filed: June 16, 2021
    Publication date: January 11, 2024
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Julien MORAND, Stefan MOLLOV
  • Patent number: 11735998
    Abstract: A current going through the first power semiconductor is sensed by a first and a second current derivative sensing means, the current going through the second semiconductor is sensed by a third and a fourth current derivative sensing means, when the current going through the first power semiconductor increases, the first current derivative means providing a positive voltage and the second current derivative means providing an opposite negative voltage, when the current going through the second power semiconductor increases, the third current derivative means providing a positive voltage and the fourth current derivative means providing an opposite voltage and the system reduces the voltage on the gate of the first power semiconductor if the first and third current derivative means provide voltages of same sign and reduces the voltage on the gate of the second power semiconductor if the second and fourth current derivative means provide voltages of same sign.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: August 22, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Julien Morand, Stefan Mollov
  • Publication number: 20230145900
    Abstract: A switching method for a half bridge power converter includes at least a pair of power switches in legs of the convertor providing upper and lower branch power switches and first and second gate control circuits for the upper and lower branch power switches. The switching method includes sensing the current derivative in the upper and lower branches during switching of the pair of power switches to provide a first signal and a second signal proportional to the current derivative of the power current in the upper and lower power switches, summing the first and second signals to provide a summed current derivative signal, and adding the summed current derivative signal to the power switch command signal of the first and second gate control circuits causing the summed derivative signals to modulate the gate commutation signals of the gate control circuits.
    Type: Application
    Filed: February 4, 2021
    Publication date: May 11, 2023
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Johan LE LESLE, Julien MORAND, Stefan MOLLOV
  • Publication number: 20220115945
    Abstract: A current going through the first power semiconductor is sensed by a first and a second current derivative sensing means, the current going through the second semiconductor is sensed by a third and a fourth current derivative sensing means, when the current going through the first power semiconductor increases, the first current derivative means providing a positive voltage and the second current derivative means providing an opposite negative voltage, when the current going through the second power semiconductor increases, the third current derivative means providing a positive voltage and the fourth current derivative means providing an opposite voltage and the system reduces the voltage on the gate of the first power semiconductor if the first and third current derivative means provide voltages of same sign and reduces the voltage on the gate of the second power semiconductor if the second and fourth current derivative means provide voltages of same sign.
    Type: Application
    Filed: November 14, 2019
    Publication date: April 14, 2022
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Julien MORAND, Stefan MOLLOV
  • Patent number: 11217571
    Abstract: A power module (1) is disclosed, comprising: first and second substrates (10), each substrate patterned layer of electrically conductive material (12), a plurality of pre-packed power cells (20), positioned between the substrates, each cell comprising: an electrically insulating core (21) embedding at least one power die (22), and two external layers (23) of electrically conductive material on opposite sides of the electrically insulating core (21), said external layers being respectively connected to each patterned layers of the substrates, wherein each external layer of a pre-packed power cell comprises a contact pad (230) connected to a respective contact (220) of the power die through connections arranged in the electrically insulating core (21), said contact pad having a surface area greater than the surface area of the power die electrical contact to which it is connected.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: January 4, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Julien Morand, Remi Perrin, Roberto Mrad, Jeffrey Ewanchuk, Stefan Mollov
  • Patent number: 11038498
    Abstract: The present invention concerns a device and a method for controlling the switching from a conducting state to a non conducting state or from a non conducting state to a conducting state of a semiconductor power switch providing current to a load, the device receiving an input signal that is intended to drive the semiconductor power switch. The invention: —senses the derivative of the drain to source current going through the semiconductor power switch in order to obtain a voltage representative of the sensed derivative of drain to source current, —amplifies the voltage representative of the sensed derivative of drain to source current, —adds the amplified voltage representative of the derivative of the sensed drain to source current to the input signal during a given time period.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: June 15, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Julien Morand, Julio Cezar Brandelero, Stefan Mollov
  • Publication number: 20210143103
    Abstract: The invention relates to an electrical power assembly (1), comprising: a power die (10), having at least two electrical contacts (11), an electrically insulating core (20), wherein the power die is embedded in the electrically insulating core, and two layers (30) of electrically conductive material on opposite main surfaces of the electrically insulating core, characterized in that the electrical power assembly comprises at least one open cavity (40) extending from an electrical contact (11) of the power die, through the electrically insulating core and the layer (30) of electrically conductive material located on the same side of the power die than the electrical contact, such that the open cavity has a bottom (41) formed by an area of the electrical contact of the power die.
    Type: Application
    Filed: May 29, 2019
    Publication date: May 13, 2021
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Roberto MRAD, Remi PERRIN, Julien MORAND, Jeffrey EWANCHUK, Stefan MOLLOV
  • Publication number: 20210043613
    Abstract: A power module (1) is disclosed, comprising: first and second substrates (10), each substrate patterned layer of electrically conductive material (12), a plurality of pre-packed power cells (20), positioned between the substrates, each cell comprising: an electrically insulating core (21) embedding at least one power die (22), and two external layers (23) of electrically conductive material on opposite sides of the electrically insulating core (21), said external layers being respectively connected to each patterned layers of the substrates, wherein each external layer of a pre-packed power cell comprises a contact pad (230) connected to a respective contact (220) of the power die through connections arranged in the electrically insulating core (21), said contact pad having a surface area greater than the surface area of the power die electrical contact to which it is connected.
    Type: Application
    Filed: March 5, 2019
    Publication date: February 11, 2021
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Julien MORAND, Remi PERRIN, Roberto MRAD, Jeffrey EWANCHUK, Stefan MOLLOV
  • Publication number: 20200412354
    Abstract: The present invention concerns a device and a method for controlling the switching from a conducting state to a non conducting state or from a non conducting state to a conducting state of a semiconductor power switch providing current to a load, the device receiving an input signal that is intended to drive the semiconductor power switch. The invention:—senses the derivative of the drain to source current going through the semiconductor power switch in order to obtain a voltage representative of the sensed derivative of drain to source current,—amplifies the voltage representative of the sensed derivative of drain to source current,—adds the amplified voltage representative of the derivative of the sensed drain to source current to the input signal during a given time period.
    Type: Application
    Filed: March 6, 2019
    Publication date: December 31, 2020
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Julien MORAND, Julio Cezar BRANDELERO, Stefan MOLLOV
  • Patent number: 7171290
    Abstract: In order to control the attitude of a satellite having at least four gyroscopic actuators with respective spinners mounted on gimbals steerable about axes parallel to one or the other of only two different directions that are fixed relative to the satellite, the attitude of the satellite is measured using sensors on board the satellite, the control torque required to perform an attitude-changing maneuver is calculated, local linearization calculation is performed based on pseudo-inversion of the Jacobean matrix of the function associating the orientations of the actuator gimbals with the total angular momentum of the cluster in order to determine a new gimbal orientation, and precession speeds of at least one of the gimbals of the actuators are controlled to deliver the control torque for reaching the desired configuration.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: January 30, 2007
    Assignee: EADS Astrium SAS
    Inventors: Kristen Lagadec, Ange Defendini, Julien Morand