Patents by Inventor Julio Navarro
Julio Navarro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080137317Abstract: A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.Type: ApplicationFiled: December 12, 2006Publication date: June 12, 2008Inventors: Robert T. Worl, Bruce L. Blaser, Peter T. Heisen, Julio A. Navarro, Douglas A. Pietila, Scott A. Raby, Jimmy S. Takeuchi
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Publication number: 20080122725Abstract: A ballistic resistant antenna for use with a ballistic resistant communications system having a first plate fabricated from a ballistic material. The first plate has at least one opening configured to allow transmission of electromagnetic energy at a predetermined range of electromagnetic wavelengths. The antenna also has at least one plug having a geometry that is capable of insertion into the at least one opening. The at least one plug is made up of a material that is substantially transparent to the predetermined range of electromagnetic wavelengths.Type: ApplicationFiled: November 29, 2006Publication date: May 29, 2008Applicant: THE BOEING COMPANYInventors: Julio A. NAVARRO, Richard N. BOSTWICK, Andrew G. LAQUER
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Publication number: 20080106467Abstract: A compact, low profile electronically scanned antenna module is provided. The antenna module includes a multi-layer antenna integrated printed wiring board (AiPWB) that includes a radiator layer on a front surface. The radiator layer includes a plurality of RF radiating elements. The antenna module additionally includes a plurality of radiator electronics modules orthogonally connected to a back surface of the AiPWB. The electronics modules are interconnected with radiating elements through the AiPWB and include a plurality of beam steering electronic elements mounted to a multi layer conformable substrate. The orthogonal connections allow the antenna module to have outer dimensions that are substantially equal to the dimensions of a perimeter of the AiPWB.Type: ApplicationFiled: November 8, 2006Publication date: May 8, 2008Inventors: Julio A. Navarro, Devin W. Hersey, Michael H. Florian, Gordon D. Osterhues, Percy Yen
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Publication number: 20080106484Abstract: A dual beam electronically scanned phased array antenna architecture is provided. The architecture includes a plurality of antenna modules substantially orthogonally connected to a signal distribution board. Each module includes a radiator board substantially orthogonally connected to a first end of a support mandrel. Each radiator board includes a plurality of radio frequency (RF) radiating elements. Each module additionally includes pair of chip carriers mounted to opposing sides of the respective mandrel and interconnected to the respective radiator board. Furthermore, each module includes signal transfer board formed to fit around a second end of the mandrel such that the signal transfer board is compressed between the mandrel the signal distribution board. Each module further includes a pair of signal distribution bridges mounted to the opposing sides of the mandrel.Type: ApplicationFiled: November 8, 2006Publication date: May 8, 2008Inventors: Julio A. Navarro, Peter T. Heisen, Scott A. Raby, Ming Chen, Lixin Cai
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Patent number: 7332048Abstract: An apparatus and method for forming and bonding of flexible circuits to metal structures includes a clamping frame having a removable frame portion. At least one flexible roller fixture provides opposed flexible rollers. A clearance aperture in the roller fixture is sized to slidably receive the clamping frame. As the clamping frame is inserted through the clearance aperture of the roller fixture the opposed flexible rollers apply a continuous pressure to deflect the flexible circuit. A curing clamp is then connected to the clamping frame having at least one engagement face defining a flexible circuit finished shape. The flexible circuit is then heat cured to adhesively bond to the metal structure.Type: GrantFiled: November 17, 2004Date of Patent: February 19, 2008Assignee: The Boeing CompanyInventors: Julio Navarro, Richard N Bostwick, Mark S Bolster
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Patent number: 7287987Abstract: An electrical connector apparatus and method for connecting circuit traces on two or more independent circuit board assemblies. A compressible elastomeric member is wrapped with a flexible circuit assembly having a plurality of independent circuit traces, with each circuit trace including a pair of raised electrical contacts. The compressible member with the electrical circuit wrapped over it is supported by a holder assembly. The holder assembly is secured to one of a pair of adjacently positioned independent printed circuit assemblies. The compressible member is held by the holder assembly so that it is compressed against both of the printed circuit board assemblies. The raised electrical contacts electrically contact traces on each of the printed circuit assemblies to complete the electrical connections between the circuit assemblies.Type: GrantFiled: May 31, 2005Date of Patent: October 30, 2007Assignee: The Boeing CompanyInventors: Peter T Heisen, Julio A Navarro
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Patent number: 7187342Abstract: A phased array antenna module for use in the gigahertz bandwidth. The module includes a metallic core with a pair of chip carrier assemblies secured to opposite sides of the core. The core has an internal waveguide with a signal splitter for directing electromagnetic wave energy evenly to the two chip carrier assemblies. A flexible, cylindrical connector assembly electrically couples the chip carrier assemblies to an aperture board. The aperture board includes a plurality of dipole antenna radiating elements. The module core is coupled directly to a cold plate. A direct thermal path is created between the chip carrier assemblies, the module core and the cold plate for highly efficient cooling of the electronic components on the chip carrier assemblies.Type: GrantFiled: May 31, 2005Date of Patent: March 6, 2007Assignee: The Boeing CompanyInventors: Peter T Heisen, Julio A Navarro, Ming Chen
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Publication number: 20070035448Abstract: A phased array antenna system including a mandrel having compliant portions and an internally formed cooling passageway. The compliant portions are formed by removing portions of material along one end of the mandrel to form a plurality of pairs of generally U-shaped, leaf spring-like connecting areas. The connecting areas allow a degree of movement of a lower portion of the mandrel relative to the remainder of the mandrel, when the mandrel is fixedly secured to a printed wiring board (PWB). This enables flexible electrical interconnects, positioned over the compliant portions, to make electrical contact with circuit traces on the PWB, even if the PWB has a curved or undulating surface.Type: ApplicationFiled: August 9, 2005Publication date: February 15, 2007Inventors: Julio Navarro, Richard Bostwick, Mark Bolster
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Publication number: 20060270279Abstract: An electrical connector apparatus and method for connecting circuit traces on two or more independent circuit board assemblies. A compressible elastomeric member is wrapped with a flexible circuit assembly having a plurality of independent circuit traces, with each circuit trace including a pair of raised electrical contacts. The compressible member with the electrical circuit wrapped over it is supported by a holder assembly. The holder assembly is secured to one of a pair of adjacently positioned independent printed circuit assemblies. The compressible member is held by the holder assembly so that it is compressed against both of the printed circuit board assemblies. The raised electrical contacts electrically contact traces on each of the printed circuit assemblies to complete the electrical connections between the circuit assemblies.Type: ApplicationFiled: May 31, 2005Publication date: November 30, 2006Inventors: Peter Heisen, Julio Navarro
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Patent number: 7109935Abstract: An antenna system for communicating electromagnetic and optical signals using a common aperture is provided. The system includes at least one optical phased array terminal integrated with an optically transparent electromagnetic antenna such that the optically transparent electromagnetic antenna and the optical phased array terminal share a common aperture. The optically transparent electromagnetic antenna includes a substrate fabricated of a substantially electrically non-conductive material that is substantially optically transparent to optical signals having a wavelength within a specific portion of the optical spectrum. An antenna element layer, including an array of electromagnetic antenna elements electrically connected by transmission lines and a plurality of phase shifters electrically connected to the electromagnetic antenna elements is disposed onto the substrate.Type: GrantFiled: August 10, 2004Date of Patent: September 19, 2006Assignee: The Boeing CompanyInventors: Jonathan M. Saint Clair, Julio A. Navarro, Derek E. Iverson, Scott A. Raby
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Publication number: 20060105620Abstract: An apparatus and method for forming and bonding of flexible circuits to metal structures includes a clamping frame having a removable frame portion. At least one flexible roller fixture provides opposed flexible rollers. A clearance aperture in the roller fixture is sized to slidably receive the clamping frame. As the clamping frame is inserted through the clearance aperture of the roller fixture the opposed flexible rollers apply a continuous pressure to deflect the flexible circuit. A curing clamp is then connected to the clamping frame having at least one engagement face defining a flexible circuit finished shape. The flexible circuit is then heat cured to adhesively bond to the metal structure.Type: ApplicationFiled: November 17, 2004Publication date: May 18, 2006Inventors: Julio Navarro, Richard Bostwick, Mark Bolster
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Publication number: 20060033663Abstract: An antenna system for communicating electromagnetic and optical signals using a common aperture is provided. The system includes at least one optical phased array terminal integrated with an optically transparent electromagnetic antenna such that the optically transparent electromagnetic antenna and the optical phased array terminal share a common aperture. The optically transparent electromagnetic antenna includes a substrate fabricated of a substantially electrically non-conductive material that is substantially optically transparent to optical signals having a wavelength within a specific portion of the optical spectrum. An antenna element layer, including an array of electromagnetic antenna elements electrically connected by transmission lines and a plurality of phase shifters electrically connected to the electromagnetic antenna elements is disposed onto the substrate.Type: ApplicationFiled: August 10, 2004Publication date: February 16, 2006Inventors: Jonathan Saint Clair, Julio Navarro, Derek Iverson, Scott Raby
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Publication number: 20050219137Abstract: A phased array antenna module for use in the gigahertz bandwidth. The module includes a metallic core with a pair of chip carrier assemblies secured to opposite sides of the core. The core has an internal waveguide with a signal splitter for directing electromagnetic wave energy evenly to the two chip carrier assemblies. A flexible, cylindrical connector assembly electrically couples the chip carrier assemblies to an aperture board. The aperture board includes a plurality of dipole antenna radiating elements. The module core is coupled directly to a cold plate. A direct thermal path is created between the chip carrier assemblies, the module core and the cold plate for highly efficient cooling of the electronic components on the chip carrier assemblies.Type: ApplicationFiled: May 31, 2005Publication date: October 6, 2005Inventors: Peter Heisen, Julio Navarro, Ming Chen
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Patent number: 6952184Abstract: A circularly polarized antenna system having improved axial ratio is disclosed. The antenna system comprises a circularly-polarized antenna, and a high-impedance buffer surface, surrounding the circularly polarized antenna, and disposed between the circularly polarized antenna and a ground plane. The width of the high-impedance buffer surface between the circularly-polarized antenna and the ground plane is selected to achieve an H-plane radiation pattern substantially identical to an E-plane radiation pattern over a desired scan angle.Type: GrantFiled: July 25, 2003Date of Patent: October 4, 2005Assignee: The Boeing CompanyInventors: Daniel Frederic Sievenpiper, James H. Schaffner, Julio A. Navarro
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Publication number: 20050134514Abstract: A microwave phased array antenna module. The antenna module includes a mandrel having an integrally formed waveguide splitter. Separate electromagnetic wave energy distribution panels that each include DC power, data and logic interconnects, as well as electronic modules incorporating ASICs, phase shifters and power amplifiers, are disposed on opposite sides of the mandrel. Waveguide coupling elements are further secured to the mandrel on opposing sides thereof to couple the electromagnetic wave energy received through an input port of the mandrel with each of the distribution panels. Antenna modules are disposed within openings formed in a second end of the mandrel and electrically coupled via electrical interconnects with the distribution panels.Type: ApplicationFiled: August 12, 2004Publication date: June 23, 2005Inventor: Julio Navarro
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Patent number: 6900765Abstract: A phased array antenna system having a corporate waveguide distribution network stripline printed circuit board. The stripline printed circuit board receives electromagnetic (EM) wave energy from a 1×4 waveguide distribution network input plate and distributes the EM wave energy to 524 radiating elements. The stripline circuit board enables extremely tight spacing of independent antenna radiating elements that would not be possible with a rectangular air filled waveguide. The antenna system enables operation at millimeter wave frequencies, and particularly at 44 GHz, and without requiring the use of a plurality of look-up tables for various phase and amplitude delays, that would otherwise be required with a rectangular, air-filled waveguide distribution structure. The antenna system can be used at millimeter wave frequencies, and in connection with the MILSTAR communications protocol, without the requirement of knowing, in advance, the next beam hopping frequency employed by the MILSTAR protocol.Type: GrantFiled: July 23, 2003Date of Patent: May 31, 2005Assignee: The Boeing CompanyInventors: Julio A. Navarro, John B. O'Connell, Richard N. Bostwick
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Publication number: 20050017919Abstract: A circularly polarized antenna system having improved axial ratio is disclosed. The antenna system comprises a circularly-polarized antenna, and a high-impedance buffer surface, surrounding the circularly polarized antenna, and disposed between the circularly polarized antenna and a ground plane. The width of the high-impedance buffer surface between the circularly-polarized antenna and the ground plane is selected to achieve an H-plane radiation pattern substantially identical to an E-plane radiation pattern over a desired scan angle.Type: ApplicationFiled: July 25, 2003Publication date: January 27, 2005Inventors: Daniel Sievenpiper, James Schaffner, Julio Navarro
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Publication number: 20050017904Abstract: A phased array antenna system having a corporate waveguide distribution network stripline printed circuit board. The stripline printed circuit board receives electromagnetic (EM) wave energy from a 1×4 waveguide distribution network input plate and distributes the EM wave energy to 524 radiating elements. The stripline circuit board enables extremely tight spacing of independent antenna radiating elements that would not be possible with a rectangular air filled waveguide. The antenna system enables operation at millimeter wave frequencies, and particularly at 44 GHz, and without requiring the use of a plurality of look-up tables for various phase and amplitude delays, that would otherwise be required with a rectangular, air-filled waveguide distribution structure. The antenna system can be used at millimeter wave frequencies, and in connection with the MILSTAR communications protocol, without the requirement of knowing, in advance, the next beam hopping frequency employed by the MILSTAR protocol.Type: ApplicationFiled: July 23, 2003Publication date: January 27, 2005Inventors: Julio Navarro, John O'Connell, Richard Bostwick
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Patent number: 6670930Abstract: A phased array antenna system formed from an antenna-integrated printed wiring board for performing the functions of a waveguide impedance matching layer, a honeycomb support structure, RF antenna probes, DC logic and RF distribution. The printed wiring board construction of the present invention significantly reduces the number of component parts required to form a phased array antenna assembly, as well as simplifying the manufacturing process of the antenna assembly. The antenna-integrated printed wiring board is formed from an inexpensive, photolithographic process to create a single part (or optionally a two part) structure for performing the above-listed functions.Type: GrantFiled: December 5, 2001Date of Patent: December 30, 2003Assignee: The Boeing CompanyInventor: Julio A. Navarro
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Publication number: 20030103012Abstract: A phased array antenna system formed from an antenna-integrated printed wiring board for performing the functions of a waveguide impedance matching layers, a honeycomb support structure, RF antenna probes, DC logic and RF distribution. The printed wiring board construction of the present invention significantly reduces the number of component parts required to form a phased array antenna assembly, as well as simplifying the manufacturing process of the antenna assembly. The antenna-integrated printed wiring board is formed from an inexpensive, photolithographic process to create a single part (or optionally a two part) structure for performing the above-listed functions.Type: ApplicationFiled: December 5, 2001Publication date: June 5, 2003Inventor: Julio A. Navarro