Patents by Inventor Julio Zegarra

Julio Zegarra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240022008
    Abstract: An integrated millimeter wave antenna module may include at least one antenna array connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.
    Type: Application
    Filed: February 24, 2023
    Publication date: January 18, 2024
    Inventors: Julio ZEGARRA, Peter LIEN, Sang-June PARK, Darryl Sheldon JESSIE, Alberto CICALINI, Sean OAK, Neil BURNS
  • Patent number: 11594824
    Abstract: An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: February 28, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Julio Zegarra, Peter Lien, Sang-June Park, Darryl Sheldon Jessie, Alberto Cicalini, Sean Oak, Neil Burns
  • Publication number: 20220166127
    Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
    Type: Application
    Filed: February 7, 2022
    Publication date: May 26, 2022
    Inventors: Seong Heon JEONG, Rajneesh KUMAR, Mohammad Ali TASSOUDJI, Darryl JESSIE, Gurkanwal SAHOTA, Kevin Hsi Huai WANG, Jeong IL KIM, Taesik YANG, Thomas MYERS, Neil BURNS, Julio ZEGARRA, Clinton James WILBER, Jordan SZABO
  • Patent number: 11342961
    Abstract: Methods and apparatus are disclosed for near field radio-frequency (RF) testing of devices, particularly user equipment (UEs) capable of millimeter-wave (mmWave) transmissions. An exemplary test apparatus is described that uses a transducer to facilitate near field over-the-air testing of UEs in the mmWave transmission band. The transducer may be an orthomode transducer and may include a dual-polarity port positioned in the reactive near field of an antenna of a device under test (DUT). For UE signal transmission tests, the orthomode transducer splits test signals received from the antenna of the DUT via the dual-polarity port into a pair of single-polarity RF signals. The single-polarity RF signals are separately fed through a pair of waveguide-to-coaxial adaptors into separate coaxial cables, which feed coaxial transmission versions of the single-polarity RF signals to test equipment for analysis. UE signal reception tests are also described that utilize the same or different orthomode transducer.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: May 24, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Marvin Leroy Vis, Julio Zegarra, Thanh Duong, Thomas Funk, Erez Avigdor Falkenstein, Larry Flowers, Andrew Lejman, Joshua Britton, Tao Wang, Ali Morshedi
  • Patent number: 11245175
    Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: February 8, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Seong Heon Jeong, Rajneesh Kumar, Mohammad Ali Tassoudji, Darryl Jessie, Gurkanwal Sahota, Kevin Hsi Huai Wang, Jeong Il Kim, Taesik Yang, Thomas Myers, Neil Burns, Julio Zegarra, Clinton James Wilber, Jordan Szabo
  • Publication number: 20210119350
    Abstract: An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.
    Type: Application
    Filed: March 20, 2020
    Publication date: April 22, 2021
    Inventors: Julio ZEGARRA, Peter LIEN, Sang-June PARK, Darryl Sheldon JESSIE, Alberto CICALINI, Sean OAK, Neil BURNS
  • Patent number: 10971819
    Abstract: An antenna system for transducing radio-frequency energy includes: a first antenna sub-system comprising a plurality of radiators and a ground conductor, each of the plurality of radiators being sized and shaped to transduce millimeter-wave energy between first wireless signals and first electrical current signals; and a second antenna sub-system comprising a first radiator configured to transduce sub-6 GHz energy between second wireless signals and second electrical current signals, wherein the first radiator comprises the ground conductor.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: April 6, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Guining Shi, Young Jun Song, Allen Minh-Triet Tran, Mohammad Ali Tassoudji, Elizabeth Wyrwich, Julio Zegarra, Clinton James Wilber, Neil Burns, Jorge Fabrega Sanchez
  • Publication number: 20190260127
    Abstract: An antenna system for transducing radio-frequency energy includes: a first antenna sub-system comprising a plurality of radiators and a ground conductor, each of the plurality of radiators being sized and shaped to transduce millimeter-wave energy between first wireless signals and first electrical current signals; and a second antenna sub-system comprising a first radiator configured to transduce sub-6 GHz energy between second wireless signals and second electrical current signals, wherein the first radiator comprises the ground conductor.
    Type: Application
    Filed: February 15, 2019
    Publication date: August 22, 2019
    Inventors: Guining SHI, Young Jun SONG, Allen Minh-Triet TRAN, Mohammad Ali TASSOUDJI, Elizabeth WYRWICH, Julio ZEGARRA, Clinton James WILBER, Neil BURNS, Jorge FABREGA SANCHEZ
  • Publication number: 20190103653
    Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 4, 2019
    Inventors: Seong Heon JEONG, Rajneesh KUMAR, Mohammad Ali TASSOUDJI, Darryl JESSIE, Gurkanwal SAHOTA, Kevin Hsi Huai WANG, Jeong KIM, II, Taesik YANG, Thomas MYERS, Neil BURNS, Julio ZEGARRA, Clinton James WILBER, Jordan SZABO
  • Publication number: 20100214184
    Abstract: A multi-band antenna device includes a primary antenna with a helical component and a folded component. A wire is formed in a helix to construct the helical component and a wire is formed in a folded-over fashion to form the folded component. The folded component is disposed inside the helix. The helical component and folded component may be formed with separate wires or as one continuous wire. The primary antenna is for resonating in multiple frequency bands including a first frequency band correlated with the helical component and a second frequency band correlated with the folded component. A secondary antenna may be included to provide diversity and possibly other frequency bands. The secondary antenna includes a planar inverted F antenna.
    Type: Application
    Filed: February 24, 2009
    Publication date: August 26, 2010
    Applicant: QUALCOMM Incorporated
    Inventors: Allen M. Tran, Sreenivas Kasturi, Steven J. Lundgren, Julio Zegarra, Arthur Page, JR.