Patents by Inventor Julio Zegarra
Julio Zegarra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240022008Abstract: An integrated millimeter wave antenna module may include at least one antenna array connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.Type: ApplicationFiled: February 24, 2023Publication date: January 18, 2024Inventors: Julio ZEGARRA, Peter LIEN, Sang-June PARK, Darryl Sheldon JESSIE, Alberto CICALINI, Sean OAK, Neil BURNS
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Patent number: 11594824Abstract: An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.Type: GrantFiled: March 20, 2020Date of Patent: February 28, 2023Assignee: QUALCOMM IncorporatedInventors: Julio Zegarra, Peter Lien, Sang-June Park, Darryl Sheldon Jessie, Alberto Cicalini, Sean Oak, Neil Burns
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Publication number: 20220166127Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.Type: ApplicationFiled: February 7, 2022Publication date: May 26, 2022Inventors: Seong Heon JEONG, Rajneesh KUMAR, Mohammad Ali TASSOUDJI, Darryl JESSIE, Gurkanwal SAHOTA, Kevin Hsi Huai WANG, Jeong IL KIM, Taesik YANG, Thomas MYERS, Neil BURNS, Julio ZEGARRA, Clinton James WILBER, Jordan SZABO
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Patent number: 11342961Abstract: Methods and apparatus are disclosed for near field radio-frequency (RF) testing of devices, particularly user equipment (UEs) capable of millimeter-wave (mmWave) transmissions. An exemplary test apparatus is described that uses a transducer to facilitate near field over-the-air testing of UEs in the mmWave transmission band. The transducer may be an orthomode transducer and may include a dual-polarity port positioned in the reactive near field of an antenna of a device under test (DUT). For UE signal transmission tests, the orthomode transducer splits test signals received from the antenna of the DUT via the dual-polarity port into a pair of single-polarity RF signals. The single-polarity RF signals are separately fed through a pair of waveguide-to-coaxial adaptors into separate coaxial cables, which feed coaxial transmission versions of the single-polarity RF signals to test equipment for analysis. UE signal reception tests are also described that utilize the same or different orthomode transducer.Type: GrantFiled: January 4, 2021Date of Patent: May 24, 2022Assignee: QUALCOMM IncorporatedInventors: Marvin Leroy Vis, Julio Zegarra, Thanh Duong, Thomas Funk, Erez Avigdor Falkenstein, Larry Flowers, Andrew Lejman, Joshua Britton, Tao Wang, Ali Morshedi
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Patent number: 11245175Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.Type: GrantFiled: September 27, 2018Date of Patent: February 8, 2022Assignee: QUALCOMM IncorporatedInventors: Seong Heon Jeong, Rajneesh Kumar, Mohammad Ali Tassoudji, Darryl Jessie, Gurkanwal Sahota, Kevin Hsi Huai Wang, Jeong Il Kim, Taesik Yang, Thomas Myers, Neil Burns, Julio Zegarra, Clinton James Wilber, Jordan Szabo
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Publication number: 20210119350Abstract: An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.Type: ApplicationFiled: March 20, 2020Publication date: April 22, 2021Inventors: Julio ZEGARRA, Peter LIEN, Sang-June PARK, Darryl Sheldon JESSIE, Alberto CICALINI, Sean OAK, Neil BURNS
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Patent number: 10971819Abstract: An antenna system for transducing radio-frequency energy includes: a first antenna sub-system comprising a plurality of radiators and a ground conductor, each of the plurality of radiators being sized and shaped to transduce millimeter-wave energy between first wireless signals and first electrical current signals; and a second antenna sub-system comprising a first radiator configured to transduce sub-6 GHz energy between second wireless signals and second electrical current signals, wherein the first radiator comprises the ground conductor.Type: GrantFiled: February 15, 2019Date of Patent: April 6, 2021Assignee: QUALCOMM IncorporatedInventors: Guining Shi, Young Jun Song, Allen Minh-Triet Tran, Mohammad Ali Tassoudji, Elizabeth Wyrwich, Julio Zegarra, Clinton James Wilber, Neil Burns, Jorge Fabrega Sanchez
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Publication number: 20190260127Abstract: An antenna system for transducing radio-frequency energy includes: a first antenna sub-system comprising a plurality of radiators and a ground conductor, each of the plurality of radiators being sized and shaped to transduce millimeter-wave energy between first wireless signals and first electrical current signals; and a second antenna sub-system comprising a first radiator configured to transduce sub-6 GHz energy between second wireless signals and second electrical current signals, wherein the first radiator comprises the ground conductor.Type: ApplicationFiled: February 15, 2019Publication date: August 22, 2019Inventors: Guining SHI, Young Jun SONG, Allen Minh-Triet TRAN, Mohammad Ali TASSOUDJI, Elizabeth WYRWICH, Julio ZEGARRA, Clinton James WILBER, Neil BURNS, Jorge FABREGA SANCHEZ
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Publication number: 20190103653Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.Type: ApplicationFiled: September 27, 2018Publication date: April 4, 2019Inventors: Seong Heon JEONG, Rajneesh KUMAR, Mohammad Ali TASSOUDJI, Darryl JESSIE, Gurkanwal SAHOTA, Kevin Hsi Huai WANG, Jeong KIM, II, Taesik YANG, Thomas MYERS, Neil BURNS, Julio ZEGARRA, Clinton James WILBER, Jordan SZABO
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Publication number: 20100214184Abstract: A multi-band antenna device includes a primary antenna with a helical component and a folded component. A wire is formed in a helix to construct the helical component and a wire is formed in a folded-over fashion to form the folded component. The folded component is disposed inside the helix. The helical component and folded component may be formed with separate wires or as one continuous wire. The primary antenna is for resonating in multiple frequency bands including a first frequency band correlated with the helical component and a second frequency band correlated with the folded component. A secondary antenna may be included to provide diversity and possibly other frequency bands. The secondary antenna includes a planar inverted F antenna.Type: ApplicationFiled: February 24, 2009Publication date: August 26, 2010Applicant: QUALCOMM IncorporatedInventors: Allen M. Tran, Sreenivas Kasturi, Steven J. Lundgren, Julio Zegarra, Arthur Page, JR.