Patents by Inventor Julius Chew

Julius Chew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High power ceramic on copper package
    Patent number: 9269594
    Abstract: According to an embodiment of a high power package, the package includes a heat sink containing enough copper to have a thermal conductivity of at least 350 W/mK, an electrically insulating attached to the heat sink with an epoxy and a semiconductor chip attached to the heat sink on the same side as the lead frame with an electrically conductive material having a melting point of 280° C. or greater.
    Type: Grant
    Filed: January 5, 2012
    Date of Patent: February 23, 2016
    Assignee: Infineon Technologies AG
    Inventors: Anwar Mohammed, Julius Chew, Donald Fowlkes
  • High Power Ceramic on Copper Package
    Publication number: 20120104582
    Abstract: According to an embodiment of a high power package, the package includes a heat sink containing enough copper to have a thermal conductivity of at least 350 W/mK, an electrically insulating attached to the heat sink with an epoxy and a semiconductor chip attached to the heat sink on the same side as the lead frame with an electrically conductive material having a melting point of 280° C. or greater.
    Type: Application
    Filed: January 5, 2012
    Publication date: May 3, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Anwar A. Mohammed, Julius Chew, Donald Fowlkes
  • Air Cavity Package with Copper Heat Sink and Ceramic Window Frame
    Publication number: 20110012254
    Abstract: An air cavity package is manufactured by attaching a die to a surface of a copper heat sink, dispensing a bead of epoxy around a periphery of the heat sink surface after the die is attached to the copper heat sink so that the bead of epoxy generally surrounds the die and placing a ceramic window frame on the bead of epoxy. The epoxy is cured to attach a bottom surface of the ceramic window frame to the copper heat sink.
    Type: Application
    Filed: July 14, 2009
    Publication date: January 20, 2011
    Applicant: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
    Inventors: Anwar A. Mohammed, Julius Chew, Alexander Komposch, Christian Andrada
  • High Power Ceramic on Copper Package
    Publication number: 20100283134
    Abstract: According to an embodiment of a high power package, the package includes a copper heat sink, a ceramic lead frame and a semiconductor chip. The copper heat sink has a thermal conductivity of at least 350 W/m K. The ceramic lead frame is attached to the copper heat sink with an epoxy. The semiconductor chip is attached to the copper heat sink on the same side as the lead frame with an electrically conductive material having a melting point of about 280° C. or greater.
    Type: Application
    Filed: May 6, 2009
    Publication date: November 11, 2010
    Applicant: Infineon Technologies North America Corp.
    Inventors: Anwar A. Mohammed, Julius Chew, Donald Fowlkes
  • Thermally Enhanced Electronic Package
    Publication number: 20100148326
    Abstract: According to one embodiment, an electronic package includes a semiconductor die, a heat sink and a metallization layer interposed between the semiconductor die and the heat sink. The metallization layer attaches the semiconductor die to the heat sink. The metallization layer has a thickness of about 5 ?m or less and a thermal conductivity of about 60 W/m·K or greater.
    Type: Application
    Filed: December 17, 2008
    Publication date: June 17, 2010
    Applicant: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
    Inventors: Anwar A. Mohammad, Julius Chew